JP2007254678A - シリカ系被膜形成用組成物およびシリカ系被膜 - Google Patents

シリカ系被膜形成用組成物およびシリカ系被膜 Download PDF

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Publication number
JP2007254678A
JP2007254678A JP2006083733A JP2006083733A JP2007254678A JP 2007254678 A JP2007254678 A JP 2007254678A JP 2006083733 A JP2006083733 A JP 2006083733A JP 2006083733 A JP2006083733 A JP 2006083733A JP 2007254678 A JP2007254678 A JP 2007254678A
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JP
Japan
Prior art keywords
silica
based film
composition
forming
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006083733A
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English (en)
Japanese (ja)
Inventor
Kiyoshi Ishikawa
清 石川
Toshiyuki Ogata
寿幸 緒方
Hideo Haneda
英夫 羽田
Shogo Matsumaru
省吾 松丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2006083733A priority Critical patent/JP2007254678A/ja
Priority to TW096109989A priority patent/TW200745265A/zh
Priority to PCT/JP2007/056090 priority patent/WO2007111270A1/ja
Publication of JP2007254678A publication Critical patent/JP2007254678A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Paints Or Removers (AREA)
  • Silicon Polymers (AREA)
JP2006083733A 2006-03-24 2006-03-24 シリカ系被膜形成用組成物およびシリカ系被膜 Pending JP2007254678A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006083733A JP2007254678A (ja) 2006-03-24 2006-03-24 シリカ系被膜形成用組成物およびシリカ系被膜
TW096109989A TW200745265A (en) 2006-03-24 2007-03-22 Composition for forming silica coating and silica coating
PCT/JP2007/056090 WO2007111270A1 (ja) 2006-03-24 2007-03-23 シリカ系被膜形成用組成物およびシリカ系被膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006083733A JP2007254678A (ja) 2006-03-24 2006-03-24 シリカ系被膜形成用組成物およびシリカ系被膜

Publications (1)

Publication Number Publication Date
JP2007254678A true JP2007254678A (ja) 2007-10-04

Family

ID=38541187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006083733A Pending JP2007254678A (ja) 2006-03-24 2006-03-24 シリカ系被膜形成用組成物およびシリカ系被膜

Country Status (3)

Country Link
JP (1) JP2007254678A (https=)
TW (1) TW200745265A (https=)
WO (1) WO2007111270A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150044858A1 (en) * 2013-08-06 2015-02-12 Tokyo Ohka Kogyo Co., Ltd. Film-forming material
KR20150087392A (ko) * 2012-11-22 2015-07-29 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. 포지티브형 감광성 실록산 조성물
JP2017011252A (ja) * 2014-10-03 2017-01-12 東京応化工業株式会社 半導体基板の製造方法
TWI583740B (zh) * 2012-04-24 2017-05-21 Tokyo Ohka Kogyo Co Ltd A film forming composition, a diffusing agent composition, a method for producing a film forming composition, and a method for producing a diffuser composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58216194A (ja) * 1982-06-10 1983-12-15 Matsumoto Seiyaku Kogyo Kk シリケ−ト組成物
JPH0762122B2 (ja) * 1986-09-09 1995-07-05 松本製薬工業株式会社 耐熱絶縁塗料組成物
JPH0715084B2 (ja) * 1986-10-27 1995-02-22 松本製薬工業株式会社 表面処理方法
JPH0499029A (ja) * 1990-08-07 1992-03-31 Nec Corp 絶縁膜の形成方法
JP3702842B2 (ja) * 2001-12-04 2005-10-05 日立化成工業株式会社 シリカ系被膜形成用組成物、シリカ系被膜、シリカ系被膜の製造方法及び電子部品
JPWO2003087228A1 (ja) * 2002-04-12 2005-08-18 Ａｚエレクトロニックマテリアルズ株式会社 ケイ素含有共重合ポリマー組成物、溶剤可溶性架橋ケイ素含有共重合ポリマー及びこれらの硬化物

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583740B (zh) * 2012-04-24 2017-05-21 Tokyo Ohka Kogyo Co Ltd A film forming composition, a diffusing agent composition, a method for producing a film forming composition, and a method for producing a diffuser composition
KR20150087392A (ko) * 2012-11-22 2015-07-29 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. 포지티브형 감광성 실록산 조성물
KR101681919B1 (ko) 2012-11-22 2016-12-02 에이제트 일렉트로닉 머티어리얼스 (룩셈부르크) 에스.에이.알.엘. 포지티브형 감광성 실록산 조성물
US20150044858A1 (en) * 2013-08-06 2015-02-12 Tokyo Ohka Kogyo Co., Ltd. Film-forming material
US9796879B2 (en) * 2013-08-06 2017-10-24 Tokyo Ohka Kogyo Co., Ltd. Film-forming material
JP2017011252A (ja) * 2014-10-03 2017-01-12 東京応化工業株式会社 半導体基板の製造方法

Also Published As

Publication number Publication date
WO2007111270A1 (ja) 2007-10-04
TW200745265A (en) 2007-12-16
TWI358427B (https=) 2012-02-21

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