JP2007224228A - 回路接続材料並びに回路端子の接続構造体及び接続方法 - Google Patents

回路接続材料並びに回路端子の接続構造体及び接続方法 Download PDF

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Publication number
JP2007224228A
JP2007224228A JP2006049624A JP2006049624A JP2007224228A JP 2007224228 A JP2007224228 A JP 2007224228A JP 2006049624 A JP2006049624 A JP 2006049624A JP 2006049624 A JP2006049624 A JP 2006049624A JP 2007224228 A JP2007224228 A JP 2007224228A
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JP
Japan
Prior art keywords
circuit
connection
weight
parts
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006049624A
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English (en)
Japanese (ja)
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JP2007224228A5 (enExample
Inventor
Takashi Nakazawa
孝 中澤
Mitsugi Fujinawa
貢 藤縄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2006049624A priority Critical patent/JP2007224228A/ja
Publication of JP2007224228A publication Critical patent/JP2007224228A/ja
Publication of JP2007224228A5 publication Critical patent/JP2007224228A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
JP2006049624A 2006-02-27 2006-02-27 回路接続材料並びに回路端子の接続構造体及び接続方法 Pending JP2007224228A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006049624A JP2007224228A (ja) 2006-02-27 2006-02-27 回路接続材料並びに回路端子の接続構造体及び接続方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006049624A JP2007224228A (ja) 2006-02-27 2006-02-27 回路接続材料並びに回路端子の接続構造体及び接続方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011157627A Division JP5365666B2 (ja) 2011-07-19 2011-07-19 回路接続材料並びに回路端子の接続構造体及び接続方法

Publications (2)

Publication Number Publication Date
JP2007224228A true JP2007224228A (ja) 2007-09-06
JP2007224228A5 JP2007224228A5 (enExample) 2011-09-01

Family

ID=38546325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006049624A Pending JP2007224228A (ja) 2006-02-27 2006-02-27 回路接続材料並びに回路端子の接続構造体及び接続方法

Country Status (1)

Country Link
JP (1) JP2007224228A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135255A (ja) * 2008-12-08 2010-06-17 Sony Chemical & Information Device Corp 異方性導電フィルム、並びに、接合体及びその製造方法
JP2010280896A (ja) * 2010-08-06 2010-12-16 Sony Chemical & Information Device Corp 対向電極接続用接着剤
JP2013229314A (ja) * 2012-03-30 2013-11-07 Sekisui Chem Co Ltd 導電材料、接続構造体及び接続構造体の製造方法
JP2014074139A (ja) * 2012-10-05 2014-04-24 Dexerials Corp 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法
KR20140059828A (ko) 2011-09-06 2014-05-16 히타치가세이가부시끼가이샤 접착제 조성물 및 접속체
JP2015183118A (ja) * 2014-03-25 2015-10-22 日立化成株式会社 接着剤組成物、異方導電性接着剤組成物、回路接続材料及び接続体
WO2021111978A1 (ja) * 2019-12-03 2021-06-10 デクセリアルズ株式会社 異方性導電フィルム
JP2021093357A (ja) * 2019-12-03 2021-06-17 デクセリアルズ株式会社 異方性導電フィルム
KR20220058611A (ko) 2019-12-03 2022-05-09 데쿠세리아루즈 가부시키가이샤 필름 권장체 및 접속체의 제조 방법
KR20250027845A (ko) 2022-08-30 2025-02-27 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 구조체 및 접속 구조체의 제조 방법
KR20250057889A (ko) 2022-11-30 2025-04-29 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 구조체 및 접속 구조체의 제조 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168412A (ja) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH11191320A (ja) * 1997-12-26 1999-07-13 Sony Chem Corp 異方性導電接着フィルム
JP2002285135A (ja) * 2001-03-27 2002-10-03 Shin Etsu Polymer Co Ltd 異方導電性接着剤及びこれを用いた接続構造
JP2002367692A (ja) * 2001-06-11 2002-12-20 Shin Etsu Polymer Co Ltd 異方導電性接着剤及びそれを用いた接続構造
JP2005235530A (ja) * 2004-02-18 2005-09-02 Hitachi Chem Co Ltd 回路接続材料
JP2005325161A (ja) * 2004-05-12 2005-11-24 Hitachi Chem Co Ltd 異方導電性接着フィルム及びその製造方法並びにそれらを用いた回路接続構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10168412A (ja) * 1996-12-10 1998-06-23 Sumitomo Bakelite Co Ltd 異方導電性接着剤
JPH11191320A (ja) * 1997-12-26 1999-07-13 Sony Chem Corp 異方性導電接着フィルム
JP2002285135A (ja) * 2001-03-27 2002-10-03 Shin Etsu Polymer Co Ltd 異方導電性接着剤及びこれを用いた接続構造
JP2002367692A (ja) * 2001-06-11 2002-12-20 Shin Etsu Polymer Co Ltd 異方導電性接着剤及びそれを用いた接続構造
JP2005235530A (ja) * 2004-02-18 2005-09-02 Hitachi Chem Co Ltd 回路接続材料
JP2005325161A (ja) * 2004-05-12 2005-11-24 Hitachi Chem Co Ltd 異方導電性接着フィルム及びその製造方法並びにそれらを用いた回路接続構造体

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010135255A (ja) * 2008-12-08 2010-06-17 Sony Chemical & Information Device Corp 異方性導電フィルム、並びに、接合体及びその製造方法
JP2010280896A (ja) * 2010-08-06 2010-12-16 Sony Chemical & Information Device Corp 対向電極接続用接着剤
KR20140059828A (ko) 2011-09-06 2014-05-16 히타치가세이가부시끼가이샤 접착제 조성물 및 접속체
JP2013229314A (ja) * 2012-03-30 2013-11-07 Sekisui Chem Co Ltd 導電材料、接続構造体及び接続構造体の製造方法
JP2014074139A (ja) * 2012-10-05 2014-04-24 Dexerials Corp 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法
JP2015183118A (ja) * 2014-03-25 2015-10-22 日立化成株式会社 接着剤組成物、異方導電性接着剤組成物、回路接続材料及び接続体
WO2021111978A1 (ja) * 2019-12-03 2021-06-10 デクセリアルズ株式会社 異方性導電フィルム
JP2021093357A (ja) * 2019-12-03 2021-06-17 デクセリアルズ株式会社 異方性導電フィルム
KR20220058611A (ko) 2019-12-03 2022-05-09 데쿠세리아루즈 가부시키가이샤 필름 권장체 및 접속체의 제조 방법
KR20220061166A (ko) 2019-12-03 2022-05-12 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
CN114787307A (zh) * 2019-12-03 2022-07-22 迪睿合株式会社 各向异性导电膜
KR102801141B1 (ko) * 2019-12-03 2025-04-25 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
KR20250027845A (ko) 2022-08-30 2025-02-27 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 구조체 및 접속 구조체의 제조 방법
KR20250057889A (ko) 2022-11-30 2025-04-29 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 접속 구조체 및 접속 구조체의 제조 방법

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