JP2007194663A5 - - Google Patents

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Publication number
JP2007194663A5
JP2007194663A5 JP2007098534A JP2007098534A JP2007194663A5 JP 2007194663 A5 JP2007194663 A5 JP 2007194663A5 JP 2007098534 A JP2007098534 A JP 2007098534A JP 2007098534 A JP2007098534 A JP 2007098534A JP 2007194663 A5 JP2007194663 A5 JP 2007194663A5
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JP
Japan
Prior art keywords
conductive film
forming
type
plate
continuous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007098534A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007194663A (ja
JP5209224B2 (ja
Filing date
Publication date
Priority claimed from KR1019990062154A external-priority patent/KR100319896B1/ko
Application filed filed Critical
Publication of JP2007194663A publication Critical patent/JP2007194663A/ja
Publication of JP2007194663A5 publication Critical patent/JP2007194663A5/ja
Application granted granted Critical
Publication of JP5209224B2 publication Critical patent/JP5209224B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2007098534A 1998-12-28 2007-04-04 半導体素子のボンディングパッド構造の製造方法 Expired - Fee Related JP5209224B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR19980059418 1998-12-28
KR1998P-59418 1999-12-24
KR1019990062154A KR100319896B1 (ko) 1998-12-28 1999-12-24 반도체 소자의 본딩 패드 구조 및 그 제조 방법
KR1999P-62154 1999-12-24

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP11375282A Division JP2000195866A (ja) 1998-12-28 1999-12-28 半導体素子のボンディングパッド構造及びその製造方法

Publications (3)

Publication Number Publication Date
JP2007194663A JP2007194663A (ja) 2007-08-02
JP2007194663A5 true JP2007194663A5 (enrdf_load_stackoverflow) 2010-08-12
JP5209224B2 JP5209224B2 (ja) 2013-06-12

Family

ID=26634489

Family Applications (2)

Application Number Title Priority Date Filing Date
JP11375282A Pending JP2000195866A (ja) 1998-12-28 1999-12-28 半導体素子のボンディングパッド構造及びその製造方法
JP2007098534A Expired - Fee Related JP5209224B2 (ja) 1998-12-28 2007-04-04 半導体素子のボンディングパッド構造の製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP11375282A Pending JP2000195866A (ja) 1998-12-28 1999-12-28 半導体素子のボンディングパッド構造及びその製造方法

Country Status (2)

Country Link
JP (2) JP2000195866A (enrdf_load_stackoverflow)
KR (1) KR100319896B1 (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195896A (ja) 1998-12-25 2000-07-14 Nec Corp 半導体装置
WO2001078145A2 (en) * 2000-04-12 2001-10-18 Koninklijke Philips Electronics N.V. Boding pad in semiconductor device
JP3434793B2 (ja) 2000-09-29 2003-08-11 Ｎｅｃエレクトロニクス株式会社 半導体装置とその製造方法
KR100500416B1 (ko) * 2000-11-15 2005-07-12 주식회사 하이닉스반도체 반도체 소자의 패드 제조 방법
KR100421043B1 (ko) * 2000-12-21 2004-03-04 삼성전자주식회사 비정렬되고 소정 거리 이격된 섬형 절연체들의 배열을 갖는 도전막을 포함하는 집적 회로 본딩 패드
JP2004095916A (ja) * 2002-08-30 2004-03-25 Fujitsu Ltd 半導体装置及びその製造方法
US7692315B2 (en) 2002-08-30 2010-04-06 Fujitsu Microelectronics Limited Semiconductor device and method for manufacturing the same
JP4579621B2 (ja) * 2003-09-26 2010-11-10 パナソニック株式会社 半導体装置
EP1519411A3 (en) * 2003-09-26 2010-01-13 Panasonic Corporation Semiconductor device and method for fabricating the same
US6960836B2 (en) * 2003-09-30 2005-11-01 Agere Systems, Inc. Reinforced bond pad
JP4759229B2 (ja) * 2004-05-12 2011-08-31 ルネサスエレクトロニクス株式会社 半導体装置
JP2006024698A (ja) 2004-07-07 2006-01-26 Toshiba Corp 半導体装置及びその製造方法
KR100675275B1 (ko) * 2004-12-16 2007-01-26 삼성전자주식회사 반도체 장치 및 이 장치의 패드 배치방법
JP4452217B2 (ja) 2005-07-04 2010-04-21 富士通マイクロエレクトロニクス株式会社 半導体装置
JP4757660B2 (ja) * 2006-02-27 2011-08-24 エルピーダメモリ株式会社 半導体装置
DE112009004978B4 (de) 2009-04-28 2020-06-04 Mitsubishi Electric Corp. Leistungshalbleitervorrichtung
JP2024106763A (ja) 2023-01-27 2024-08-08 三菱電機株式会社 ボンディングパッド、集積回路素子、及び集積回路装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57172752A (en) * 1981-04-16 1982-10-23 Fujitsu Ltd Semiconductor device
JPS61239646A (ja) * 1985-04-16 1986-10-24 Nec Corp 多層配線の形成方法
JP2916326B2 (ja) * 1992-06-11 1999-07-05 三菱電機株式会社 半導体装置のパッド構造
US5248903A (en) * 1992-09-18 1993-09-28 Lsi Logic Corporation Composite bond pads for semiconductor devices
JPH06196525A (ja) * 1992-12-24 1994-07-15 Kawasaki Steel Corp ボンディングパッドの構造
JPH06326150A (ja) * 1993-05-12 1994-11-25 Sony Corp パッド構造
JP3432284B2 (ja) * 1994-07-04 2003-08-04 三菱電機株式会社 半導体装置
JPH08162532A (ja) * 1994-12-05 1996-06-21 Sony Corp 半導体装置の製造方法
JPH08213422A (ja) * 1995-02-07 1996-08-20 Mitsubishi Electric Corp 半導体装置およびそのボンディングパッド構造
JPH08293523A (ja) * 1995-02-21 1996-11-05 Seiko Epson Corp 半導体装置およびその製造方法
JPH09162290A (ja) * 1995-12-04 1997-06-20 Ricoh Co Ltd 半導体集積回路装置
KR100200700B1 (ko) * 1996-02-29 1999-06-15 윤종용 다층 패드를 구비하는 반도체장치 및 그 제조방법
JP3482779B2 (ja) * 1996-08-20 2004-01-06 セイコーエプソン株式会社 半導体装置およびその製造方法
JP2001085465A (ja) * 1999-09-16 2001-03-30 Matsushita Electronics Industry Corp 半導体装置

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