JP2007142267A5 - - Google Patents

Download PDF

Info

Publication number
JP2007142267A5
JP2007142267A5 JP2005336032A JP2005336032A JP2007142267A5 JP 2007142267 A5 JP2007142267 A5 JP 2007142267A5 JP 2005336032 A JP2005336032 A JP 2005336032A JP 2005336032 A JP2005336032 A JP 2005336032A JP 2007142267 A5 JP2007142267 A5 JP 2007142267A5
Authority
JP
Japan
Prior art keywords
processed
mounting table
flow paths
mounting
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005336032A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007142267A (ja
JP4580327B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2005336032A external-priority patent/JP4580327B2/ja
Priority to JP2005336032A priority Critical patent/JP4580327B2/ja
Priority to KR1020060113198A priority patent/KR100856152B1/ko
Priority to US11/560,904 priority patent/US7556246B2/en
Priority to CN200610149470XA priority patent/CN1971870B/zh
Priority to TW095143079A priority patent/TWI392051B/zh
Publication of JP2007142267A publication Critical patent/JP2007142267A/ja
Publication of JP2007142267A5 publication Critical patent/JP2007142267A5/ja
Publication of JP4580327B2 publication Critical patent/JP4580327B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2005336032A 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構 Expired - Lifetime JP4580327B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005336032A JP4580327B2 (ja) 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構
KR1020060113198A KR100856152B1 (ko) 2005-11-21 2006-11-16 피처리체의 반출 방법 및 프로그램 기억 매체 및 탑재기구
US11/560,904 US7556246B2 (en) 2005-11-21 2006-11-17 Unloading method of object, program storage medium, and mounting mechanism
TW095143079A TWI392051B (zh) 2005-11-21 2006-11-21 The method of removing the processed body and the program memory medium and the placing mechanism
CN200610149470XA CN1971870B (zh) 2005-11-21 2006-11-21 被处理体的取出方法及载置机构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005336032A JP4580327B2 (ja) 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構

Publications (3)

Publication Number Publication Date
JP2007142267A JP2007142267A (ja) 2007-06-07
JP2007142267A5 true JP2007142267A5 (enExample) 2008-12-18
JP4580327B2 JP4580327B2 (ja) 2010-11-10

Family

ID=38054545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005336032A Expired - Lifetime JP4580327B2 (ja) 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構

Country Status (5)

Country Link
US (1) US7556246B2 (enExample)
JP (1) JP4580327B2 (enExample)
KR (1) KR100856152B1 (enExample)
CN (1) CN1971870B (enExample)
TW (1) TWI392051B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101004434B1 (ko) * 2008-11-26 2010-12-28 세메스 주식회사 기판 지지 유닛과, 이를 이용한 기판 연마 장치 및 방법
JP2010129929A (ja) * 2008-11-28 2010-06-10 Canon Inc 基板保持装置、基板保持方法、露光装置およびデバイス製造方法
DE102009018434B4 (de) * 2009-04-22 2023-11-30 Ev Group Gmbh Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten
JP5390266B2 (ja) * 2009-06-01 2014-01-15 東京エレクトロン株式会社 吸着検知解消方法、処理装置、及びコンピュータ読み取り可能な記憶媒体
JP5591563B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置確認装置
JP5591562B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置決め装置
TWI460075B (zh) * 2010-11-11 2014-11-11 C Sun Mfg Ltd 壓合機
TWI402171B (zh) * 2010-11-11 2013-07-21 C Sun Mfg Ltd 壓合裝置及其壓合方法
CN102306620B (zh) * 2011-09-01 2013-03-27 清华大学 激光退火片台装置
JP2013145776A (ja) * 2012-01-13 2013-07-25 Disco Abrasive Syst Ltd 搬送方法
PT2891174T (pt) * 2012-08-31 2019-11-20 Semiconductor Tech & Instruments Pte Ltd Sistema e método para correcção automática do desalinhamento rotational de pastilhas em molduras de filme
JP7071118B2 (ja) * 2014-08-19 2022-05-18 ルミレッズ ホールディング ベーフェー ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ
EP3295479B1 (en) * 2015-05-13 2018-09-26 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
JP6659332B2 (ja) * 2015-12-07 2020-03-04 株式会社荏原製作所 基板処理装置、基板処理装置の真空吸着テーブルから基板を脱着する方法、及び、基板処理装置の真空吸着テーブルに基板を載置する方法
WO2017176419A1 (en) * 2016-04-08 2017-10-12 Applied Materials, Inc. Vacuum chuck pressure control system
CN112008636B (zh) * 2020-09-15 2024-09-27 河北三厦科技股份有限公司 一种夹具
KR102604456B1 (ko) * 2021-09-24 2023-11-23 주식회사 기가레인 웨이퍼 디척킹 방법

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812201A (en) * 1986-07-25 1989-03-14 Tokyo Electron Limited Method of ashing layers, and apparatus for ashing layers
US4908095A (en) * 1988-05-02 1990-03-13 Tokyo Electron Limited Etching device, and etching method
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
JP3153372B2 (ja) * 1992-02-26 2001-04-09 東京エレクトロン株式会社 基板処理装置
KR100290748B1 (ko) * 1993-01-29 2001-06-01 히가시 데쓰로 플라즈마 처리장치
US5542559A (en) * 1993-02-16 1996-08-06 Tokyo Electron Kabushiki Kaisha Plasma treatment apparatus
JPH07157117A (ja) * 1993-12-08 1995-06-20 Fuji Photo Film Co Ltd 板状体または箱体の真空チャック装置
TW254030B (en) * 1994-03-18 1995-08-11 Anelva Corp Mechanic escape mechanism for substrate
JPH0927541A (ja) * 1995-07-10 1997-01-28 Nikon Corp 基板ホルダ
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
JP2991110B2 (ja) * 1996-05-01 1999-12-20 日本電気株式会社 基板吸着保持装置
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US6089763A (en) 1997-09-09 2000-07-18 Dns Korea Co., Ltd. Semiconductor wafer processing system
KR100257787B1 (ko) * 1997-09-09 2000-06-01 김광교 반도체 제조용 설비의 웨이퍼 슬립 방지방법
JPH11233601A (ja) 1998-02-10 1999-08-27 Hitachi Ltd 静電吸着装置及びそれを用いた試料処理装置
DE69928319T2 (de) * 1998-04-27 2006-04-20 Tokyo Seimitsu Co. Ltd., Mitaka Oberflächenbearbeitungsverfahren und Oberflächenbearbeitungsvorrichtung für Halbleiterscheiben
JP2000183130A (ja) 1998-12-21 2000-06-30 Matsushita Electric Ind Co Ltd ウェハ搬送方法とその装置
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting
JP2001338868A (ja) * 2000-03-24 2001-12-07 Nikon Corp 照度計測装置及び露光装置
JP4067307B2 (ja) * 2000-04-27 2008-03-26 株式会社荏原製作所 回転保持装置
KR100939596B1 (ko) * 2001-11-02 2010-02-01 어플라이드 머티어리얼스, 인코포레이티드 단일 웨이퍼 건조기 및 건조 방법
US7750654B2 (en) * 2002-09-02 2010-07-06 Octec Inc. Probe method, prober, and electrode reducing/plasma-etching processing mechanism
US6722642B1 (en) * 2002-11-06 2004-04-20 Tokyo Electron Limited High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
JP2004193195A (ja) * 2002-12-09 2004-07-08 Shinko Electric Ind Co Ltd 搬送装置
JP2005129837A (ja) * 2003-10-27 2005-05-19 Seiko Epson Corp 基板処理装置及び基板処理方法
US7187188B2 (en) * 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
KR20050120282A (ko) * 2004-06-18 2005-12-22 삼성전자주식회사 정전척으로부터 웨이퍼를 리프팅하는 방법
US7292428B2 (en) * 2005-04-26 2007-11-06 Applied Materials, Inc. Electrostatic chuck with smart lift-pin mechanism for a plasma reactor

Similar Documents

Publication Publication Date Title
JP2007142267A5 (enExample)
CN207629455U (zh) 一种高效模块化滚边岛车门加工系统
TW200729382A (en) Methods and apparatus for transferring substrates during electronic device manufacturing
JP4580327B2 (ja) 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構
CN2892771Y (zh) 排气吸盘
JP5759779B2 (ja) 板材の加工装置
JP5989501B2 (ja) 搬送方法
JP2007157996A (ja) ワーク搬送装置及びワーク搬送方法
CN101432211A (zh) 用于操作具有至少一个通孔的工件的方法和机械装置
JP2015115574A (ja) ウェーハ搬送システム
WO2014127499A1 (zh) 加工系统
JP2010010398A5 (enExample)
DE502007000453D1 (de) Hoch-Geschwindigkeits-Lader
JP5245999B2 (ja) ロボットハンド及び移送ロボット
CN102366912B (zh) 由去毛刺机专用气阀构成的真空工作平台及负压控制方法
JP2011040707A (ja) ストッカー
CN108637765A (zh) 一种机床自动换刀机械手
JP6037685B2 (ja) 研削装置
JP6058386B2 (ja) 加工装置
CN204800359U (zh) 多功能加工设备
ATE387288T1 (de) Fertigungs-anlage mit einer werkstück-lade- transport-einrichtung
JP2013129037A (ja) 吸着搬送方法及び板材吸着搬送装置
CN108406832A (zh) 一种可吹扫的玻璃膜机械手
JP2003273055A (ja) スピンナー洗浄装置
JP5959948B2 (ja) ウエハリング交換装置およびチップ実装装置