CN1971870B - 被处理体的取出方法及载置机构 - Google Patents

被处理体的取出方法及载置机构 Download PDF

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Publication number
CN1971870B
CN1971870B CN200610149470XA CN200610149470A CN1971870B CN 1971870 B CN1971870 B CN 1971870B CN 200610149470X A CN200610149470X A CN 200610149470XA CN 200610149470 A CN200610149470 A CN 200610149470A CN 1971870 B CN1971870 B CN 1971870B
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China
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platform
handled object
carrying
year
wafer
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CN200610149470XA
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Chinese (zh)
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CN1971870A (zh
Inventor
铃木胜
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN200610149470XA 2005-11-21 2006-11-21 被处理体的取出方法及载置机构 Active CN1971870B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005336032A JP4580327B2 (ja) 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構
JP2005336032 2005-11-21
JP2005-336032 2005-11-21

Publications (2)

Publication Number Publication Date
CN1971870A CN1971870A (zh) 2007-05-30
CN1971870B true CN1971870B (zh) 2012-05-23

Family

ID=38054545

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200610149470XA Active CN1971870B (zh) 2005-11-21 2006-11-21 被处理体的取出方法及载置机构

Country Status (5)

Country Link
US (1) US7556246B2 (enExample)
JP (1) JP4580327B2 (enExample)
KR (1) KR100856152B1 (enExample)
CN (1) CN1971870B (enExample)
TW (1) TWI392051B (enExample)

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JP2010129929A (ja) * 2008-11-28 2010-06-10 Canon Inc 基板保持装置、基板保持方法、露光装置およびデバイス製造方法
DE102009018434B4 (de) * 2009-04-22 2023-11-30 Ev Group Gmbh Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten
JP5390266B2 (ja) * 2009-06-01 2014-01-15 東京エレクトロン株式会社 吸着検知解消方法、処理装置、及びコンピュータ読み取り可能な記憶媒体
JP5591563B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置確認装置
JP5591562B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置決め装置
TWI460075B (zh) * 2010-11-11 2014-11-11 C Sun Mfg Ltd 壓合機
TWI402171B (zh) * 2010-11-11 2013-07-21 C Sun Mfg Ltd 壓合裝置及其壓合方法
CN102306620B (zh) * 2011-09-01 2013-03-27 清华大学 激光退火片台装置
JP2013145776A (ja) * 2012-01-13 2013-07-25 Disco Abrasive Syst Ltd 搬送方法
PT2891174T (pt) * 2012-08-31 2019-11-20 Semiconductor Tech & Instruments Pte Ltd Sistema e método para correcção automática do desalinhamento rotational de pastilhas em molduras de filme
JP7071118B2 (ja) * 2014-08-19 2022-05-18 ルミレッズ ホールディング ベーフェー ダイレベルのレーザリフトオフ中の機械的損傷を減少させるサファイアコレクタ
EP3295479B1 (en) * 2015-05-13 2018-09-26 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
JP6659332B2 (ja) * 2015-12-07 2020-03-04 株式会社荏原製作所 基板処理装置、基板処理装置の真空吸着テーブルから基板を脱着する方法、及び、基板処理装置の真空吸着テーブルに基板を載置する方法
WO2017176419A1 (en) * 2016-04-08 2017-10-12 Applied Materials, Inc. Vacuum chuck pressure control system
CN112008636B (zh) * 2020-09-15 2024-09-27 河北三厦科技股份有限公司 一种夹具
KR102604456B1 (ko) * 2021-09-24 2023-11-23 주식회사 기가레인 웨이퍼 디척킹 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber

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US4908095A (en) * 1988-05-02 1990-03-13 Tokyo Electron Limited Etching device, and etching method
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
JP3153372B2 (ja) * 1992-02-26 2001-04-09 東京エレクトロン株式会社 基板処理装置
KR100290748B1 (ko) * 1993-01-29 2001-06-01 히가시 데쓰로 플라즈마 처리장치
US5542559A (en) * 1993-02-16 1996-08-06 Tokyo Electron Kabushiki Kaisha Plasma treatment apparatus
JPH07157117A (ja) * 1993-12-08 1995-06-20 Fuji Photo Film Co Ltd 板状体または箱体の真空チャック装置
TW254030B (en) * 1994-03-18 1995-08-11 Anelva Corp Mechanic escape mechanism for substrate
JPH0927541A (ja) * 1995-07-10 1997-01-28 Nikon Corp 基板ホルダ
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
JP2991110B2 (ja) * 1996-05-01 1999-12-20 日本電気株式会社 基板吸着保持装置
US6089763A (en) 1997-09-09 2000-07-18 Dns Korea Co., Ltd. Semiconductor wafer processing system
KR100257787B1 (ko) * 1997-09-09 2000-06-01 김광교 반도체 제조용 설비의 웨이퍼 슬립 방지방법
JPH11233601A (ja) 1998-02-10 1999-08-27 Hitachi Ltd 静電吸着装置及びそれを用いた試料処理装置
DE69928319T2 (de) * 1998-04-27 2006-04-20 Tokyo Seimitsu Co. Ltd., Mitaka Oberflächenbearbeitungsverfahren und Oberflächenbearbeitungsvorrichtung für Halbleiterscheiben
JP2000183130A (ja) 1998-12-21 2000-06-30 Matsushita Electric Ind Co Ltd ウェハ搬送方法とその装置
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting
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KR100939596B1 (ko) * 2001-11-02 2010-02-01 어플라이드 머티어리얼스, 인코포레이티드 단일 웨이퍼 건조기 및 건조 방법
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JP2004193195A (ja) * 2002-12-09 2004-07-08 Shinko Electric Ind Co Ltd 搬送装置
JP2005129837A (ja) * 2003-10-27 2005-05-19 Seiko Epson Corp 基板処理装置及び基板処理方法
US7187188B2 (en) * 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
KR20050120282A (ko) * 2004-06-18 2005-12-22 삼성전자주식회사 정전척으로부터 웨이퍼를 리프팅하는 방법
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber

Also Published As

Publication number Publication date
JP2007142267A (ja) 2007-06-07
KR100856152B1 (ko) 2008-09-03
US20070118246A1 (en) 2007-05-24
TWI392051B (zh) 2013-04-01
JP4580327B2 (ja) 2010-11-10
KR20070053615A (ko) 2007-05-25
US7556246B2 (en) 2009-07-07
CN1971870A (zh) 2007-05-30
TW200731457A (en) 2007-08-16

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