JP2010010398A5 - - Google Patents

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Publication number
JP2010010398A5
JP2010010398A5 JP2008168053A JP2008168053A JP2010010398A5 JP 2010010398 A5 JP2010010398 A5 JP 2010010398A5 JP 2008168053 A JP2008168053 A JP 2008168053A JP 2008168053 A JP2008168053 A JP 2008168053A JP 2010010398 A5 JP2010010398 A5 JP 2010010398A5
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JP
Japan
Prior art keywords
vacuum
sample
vacuum processing
transfer container
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008168053A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010010398A (ja
JP5097627B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008168053A priority Critical patent/JP5097627B2/ja
Priority claimed from JP2008168053A external-priority patent/JP5097627B2/ja
Priority to KR1020080080620A priority patent/KR101092510B1/ko
Priority to US12/203,168 priority patent/US8100620B2/en
Publication of JP2010010398A publication Critical patent/JP2010010398A/ja
Publication of JP2010010398A5 publication Critical patent/JP2010010398A5/ja
Application granted granted Critical
Publication of JP5097627B2 publication Critical patent/JP5097627B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008168053A 2008-06-27 2008-06-27 真空処理装置 Active JP5097627B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008168053A JP5097627B2 (ja) 2008-06-27 2008-06-27 真空処理装置
KR1020080080620A KR101092510B1 (ko) 2008-06-27 2008-08-18 진공처리장치
US12/203,168 US8100620B2 (en) 2008-06-27 2008-09-03 Vacuum processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008168053A JP5097627B2 (ja) 2008-06-27 2008-06-27 真空処理装置

Publications (3)

Publication Number Publication Date
JP2010010398A JP2010010398A (ja) 2010-01-14
JP2010010398A5 true JP2010010398A5 (enExample) 2011-09-08
JP5097627B2 JP5097627B2 (ja) 2012-12-12

Family

ID=41447675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008168053A Active JP5097627B2 (ja) 2008-06-27 2008-06-27 真空処理装置

Country Status (3)

Country Link
US (1) US8100620B2 (enExample)
JP (1) JP5097627B2 (enExample)
KR (1) KR101092510B1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005051340A1 (ja) 2003-11-27 2005-06-09 Shiseido Company, Ltd. 不全角化抑制剤及び皮膚外用組成物
US20110269314A1 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Process chambers having shared resources and methods of use thereof
KR102497795B1 (ko) * 2016-07-04 2023-02-09 세메스 주식회사 기판 처리 장치
US11107713B2 (en) * 2019-05-29 2021-08-31 Taiwan Semiconductor Manufacturing Company Ltd. Conveying system and method for operating the same
JP2023507098A (ja) * 2019-12-18 2023-02-21 ブルックス オートメーション （ジャーマニー） ゲゼルシャフト ミット ベシュレンクテル ハフツング 半導体生産設備機械のためのコア・モジュール
US12288701B2 (en) * 2022-02-28 2025-04-29 Syskey Technology Co., Ltd. Multi-chamber semiconductor manufacturing system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4852516A (en) * 1986-05-19 1989-08-01 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US6312525B1 (en) * 1997-07-11 2001-11-06 Applied Materials, Inc. Modular architecture for semiconductor wafer fabrication equipment
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US7032614B2 (en) * 2000-11-03 2006-04-25 Applied Materials, Inc. Facilities connection box for pre-facilitation of wafer fabrication equipment
JP2004006665A (ja) * 2002-02-20 2004-01-08 Tokyo Electron Ltd 真空処理装置
SG115630A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Temperature conditioned load lock, lithographic apparatus comprising such a load lock and method of manufacturing a substrate with such a load lock
JP4522795B2 (ja) * 2003-09-04 2010-08-11 株式会社日立ハイテクノロジーズ 真空処理装置
JP4426343B2 (ja) * 2004-03-08 2010-03-03 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP4961893B2 (ja) * 2006-08-23 2012-06-27 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法

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