JP2007110023A5 - - Google Patents

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Publication number
JP2007110023A5
JP2007110023A5 JP2005301788A JP2005301788A JP2007110023A5 JP 2007110023 A5 JP2007110023 A5 JP 2007110023A5 JP 2005301788 A JP2005301788 A JP 2005301788A JP 2005301788 A JP2005301788 A JP 2005301788A JP 2007110023 A5 JP2007110023 A5 JP 2007110023A5
Authority
JP
Japan
Prior art keywords
suction plate
substrate holding
adhesive layer
step shape
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005301788A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007110023A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005301788A priority Critical patent/JP2007110023A/ja
Priority claimed from JP2005301788A external-priority patent/JP2007110023A/ja
Publication of JP2007110023A publication Critical patent/JP2007110023A/ja
Publication of JP2007110023A5 publication Critical patent/JP2007110023A5/ja
Pending legal-status Critical Current

Links

JP2005301788A 2005-10-17 2005-10-17 基板保持装置 Pending JP2007110023A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005301788A JP2007110023A (ja) 2005-10-17 2005-10-17 基板保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005301788A JP2007110023A (ja) 2005-10-17 2005-10-17 基板保持装置

Publications (2)

Publication Number Publication Date
JP2007110023A JP2007110023A (ja) 2007-04-26
JP2007110023A5 true JP2007110023A5 (enExample) 2008-09-18

Family

ID=38035626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005301788A Pending JP2007110023A (ja) 2005-10-17 2005-10-17 基板保持装置

Country Status (1)

Country Link
JP (1) JP2007110023A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6176771B2 (ja) * 2010-12-28 2017-08-09 住友大阪セメント株式会社 静電チャック装置
KR20170109690A (ko) * 2012-04-26 2017-09-29 어플라이드 머티어리얼스, 인코포레이티드 Ｅｓｃ 본딩 접착제 부식을 방지하기 위한 방법들 및 장치
JP6469985B2 (ja) * 2014-07-28 2019-02-13 株式会社日立ハイテクノロジーズ プラズマ処理装置
WO2017033738A1 (ja) 2015-08-27 2017-03-02 住友大阪セメント株式会社 静電チャック装置
CN108028219B (zh) * 2015-09-25 2019-06-14 住友大阪水泥股份有限公司 静电卡盘装置
CN111684579B (zh) * 2018-03-13 2023-07-25 日本碍子株式会社 晶片保持台
JP2023550333A (ja) * 2020-11-19 2023-12-01 ラム リサーチ コーポレーション 基板全体に均一な温度を有する基板支持体
KR102507875B1 (ko) * 2021-08-27 2023-03-09 주식회사 동탄이엔지 정전척 및 정전척 제조 방법
WO2025122428A1 (en) * 2023-12-04 2025-06-12 Lam Research Corporation Ceramic top plate with an annular projection to protect a seal ring and a bonding layer of a substrate support from ion erosion
JP7714063B1 (ja) 2024-01-22 2025-07-28 日本特殊陶業株式会社 保持装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07263527A (ja) * 1994-03-17 1995-10-13 Fujitsu Ltd 静電吸着装置
JP3485390B2 (ja) * 1995-07-28 2004-01-13 京セラ株式会社 静電チャック
JPH08316298A (ja) * 1995-05-11 1996-11-29 Souzou Kagaku:Kk 静電チャック
JPH10144778A (ja) * 1996-11-13 1998-05-29 Kobe Steel Ltd 静電チャック
JP2001068539A (ja) * 1999-08-27 2001-03-16 Taiheiyo Cement Corp 静電チャック
JP2003060019A (ja) * 2001-08-13 2003-02-28 Hitachi Ltd ウエハステージ
JP2003168725A (ja) * 2001-11-30 2003-06-13 Kyocera Corp ウエハ支持部材及びその製造方法
JP4129152B2 (ja) * 2002-08-06 2008-08-06 東京エレクトロン株式会社 基板載置部材およびそれを用いた基板処理装置
JP4451098B2 (ja) * 2002-08-22 2010-04-14 住友大阪セメント株式会社 サセプタ装置
JP4409373B2 (ja) * 2004-06-29 2010-02-03 日本碍子株式会社 基板載置装置及び基板温度調整方法
JP4749072B2 (ja) * 2005-07-26 2011-08-17 京セラ株式会社 ウェハ保持体

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