JP2009239261A5 - - Google Patents

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Publication number
JP2009239261A5
JP2009239261A5 JP2009039580A JP2009039580A JP2009239261A5 JP 2009239261 A5 JP2009239261 A5 JP 2009239261A5 JP 2009039580 A JP2009039580 A JP 2009039580A JP 2009039580 A JP2009039580 A JP 2009039580A JP 2009239261 A5 JP2009239261 A5 JP 2009239261A5
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JP
Japan
Prior art keywords
support member
main surface
contact
substrate
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009039580A
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English (en)
Japanese (ja)
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JP2009239261A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009039580A priority Critical patent/JP2009239261A/ja
Priority claimed from JP2009039580A external-priority patent/JP2009239261A/ja
Publication of JP2009239261A publication Critical patent/JP2009239261A/ja
Publication of JP2009239261A5 publication Critical patent/JP2009239261A5/ja
Pending legal-status Critical Current

Links

JP2009039580A 2008-03-07 2009-02-23 電子ユニット、電子装置 Pending JP2009239261A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009039580A JP2009239261A (ja) 2008-03-07 2009-02-23 電子ユニット、電子装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008057935 2008-03-07
JP2009039580A JP2009239261A (ja) 2008-03-07 2009-02-23 電子ユニット、電子装置

Publications (2)

Publication Number Publication Date
JP2009239261A JP2009239261A (ja) 2009-10-15
JP2009239261A5 true JP2009239261A5 (enExample) 2012-03-01

Family

ID=41053394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009039580A Pending JP2009239261A (ja) 2008-03-07 2009-02-23 電子ユニット、電子装置

Country Status (2)

Country Link
US (1) US8289721B2 (enExample)
JP (1) JP2009239261A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8059418B2 (en) * 2009-04-03 2011-11-15 Trw Automotive U.S. Llc Assembly with a printed circuit board
JP5540308B2 (ja) 2009-10-16 2014-07-02 株式会社ミツトヨ ロータリーエンコーダ
JP6000751B2 (ja) 2012-08-27 2016-10-05 キヤノン株式会社 撮像装置
JP6000752B2 (ja) * 2012-08-27 2016-10-05 キヤノン株式会社 撮像装置
JP6248591B2 (ja) * 2013-12-05 2017-12-20 日本精工株式会社 電子制御ユニット及び電動パワーステアリング装置
JP6331424B2 (ja) * 2014-01-30 2018-05-30 日本精工株式会社 電子制御ユニットおよび電動パワーステアリング装置
CN206148075U (zh) * 2016-10-28 2017-05-03 京东方科技集团股份有限公司 一种显示装置
US10605820B2 (en) * 2017-10-25 2020-03-31 Honeywell International Inc. Shock-isolated mounting device with a thermally-conductive link
JP7496202B2 (ja) * 2019-11-27 2024-06-06 ナブテスコ株式会社 航空機用の電子機器
US20230101209A1 (en) * 2020-01-24 2023-03-30 Hewlett-Packard Development Company, L.P. Electronic device mounting screw assemblies
DE102020102599A1 (de) 2020-02-03 2021-08-05 Webasto SE Anordnung und Verfahren zum elektrischen Verbinden einer ersten Kontaktfläche eines ersten elektrischen Bauteils mit einer zweiten Kontaktfläche eines zweiten elektrischen Bauteils sowie Hochvoltheizer-Vorrichtung für ein Fahrzeug

Family Cites Families (25)

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Publication number Priority date Publication date Assignee Title
US4771365A (en) * 1987-10-30 1988-09-13 Honeywell Inc. Passive cooled electronic chassis
EP0608418B1 (en) * 1992-05-20 1998-11-04 Seiko Epson Corporation Cartridge for electronic apparatus
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US5655143A (en) * 1994-04-21 1997-08-05 Alpert; Martin A. PCMICIA card-like device with internal retractable cord mechanism
US5956231A (en) * 1994-10-07 1999-09-21 Hitachi, Ltd. Semiconductor device having power semiconductor elements
JP2882313B2 (ja) * 1995-06-06 1999-04-12 住友電装株式会社 基板収納ケース
IN192428B (enExample) * 1996-09-26 2004-04-24 Matsushita Electric Industrial Co Ltd
JPH11204958A (ja) * 1998-01-07 1999-07-30 Canon Inc 電源装置及び該電源装置を用いた記録装置
US6137164A (en) * 1998-03-16 2000-10-24 Texas Instruments Incorporated Thin stacked integrated circuit device
US5973923A (en) * 1998-05-28 1999-10-26 Jitaru; Ionel Packaging power converters
TW393666B (en) * 1998-06-15 2000-06-11 Acer Display Tech Inc A plasma display device having a heated airflow guiding groove
JP3681542B2 (ja) * 1998-07-01 2005-08-10 富士通株式会社 プリント回路基板および多段バンプ用中継基板
US6532152B1 (en) * 1998-11-16 2003-03-11 Intermec Ip Corp. Ruggedized hand held computer
US6304450B1 (en) * 1999-07-15 2001-10-16 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US6414849B1 (en) * 1999-10-29 2002-07-02 Stmicroelectronics, Inc. Low stress and low profile cavity down flip chip and wire bond BGA package
JP3722209B2 (ja) * 2000-09-05 2005-11-30 セイコーエプソン株式会社 半導体装置
US7034387B2 (en) * 2003-04-04 2006-04-25 Chippac, Inc. Semiconductor multipackage module including processor and memory package assemblies
JP4269631B2 (ja) * 2002-10-15 2009-05-27 パナソニック電工株式会社 電子回路モジュール
US6770813B1 (en) * 2003-05-16 2004-08-03 Visteon Global Technologies, Inc. Mountable microelectronic package
US20040246682A1 (en) * 2003-06-09 2004-12-09 Sumitomo Metal (Smi) Eectronics Devices Inc. Apparatus and package for high frequency usages and their manufacturing method
US6909176B1 (en) * 2003-11-20 2005-06-21 Altera Corporation Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate
EP1803146A2 (en) * 2004-09-04 2007-07-04 Applied Materials, Inc. Substrate carrier having reduced height
JP2006120378A (ja) 2004-10-20 2006-05-11 Funai Electric Co Ltd 電子機器
JP2005260252A (ja) * 2005-03-30 2005-09-22 Fujitsu Ltd 電子部品を保護する機能を有するスペ―サを備えた電子機器
KR100839421B1 (ko) * 2007-02-07 2008-06-19 삼성에스디아이 주식회사 플라즈마 디스플레이 장치

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