JP2007500945A5 - - Google Patents

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Publication number
JP2007500945A5
JP2007500945A5 JP2006522082A JP2006522082A JP2007500945A5 JP 2007500945 A5 JP2007500945 A5 JP 2007500945A5 JP 2006522082 A JP2006522082 A JP 2006522082A JP 2006522082 A JP2006522082 A JP 2006522082A JP 2007500945 A5 JP2007500945 A5 JP 2007500945A5
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JP
Japan
Prior art keywords
plane
feature
reference member
defining
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006522082A
Other languages
English (en)
Japanese (ja)
Other versions
JP4571133B2 (ja
JP2007500945A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2004/024574 external-priority patent/WO2005013332A2/en
Publication of JP2007500945A publication Critical patent/JP2007500945A/ja
Publication of JP2007500945A5 publication Critical patent/JP2007500945A5/ja
Application granted granted Critical
Publication of JP4571133B2 publication Critical patent/JP4571133B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2006522082A 2003-07-28 2004-07-28 プローブカードを平坦化するための装置 Expired - Lifetime JP4571133B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49062103P 2003-07-28 2003-07-28
PCT/US2004/024574 WO2005013332A2 (en) 2003-07-28 2004-07-28 Apparatus for planarizing a probe card and method using same

Publications (3)

Publication Number Publication Date
JP2007500945A JP2007500945A (ja) 2007-01-18
JP2007500945A5 true JP2007500945A5 (enExample) 2007-09-06
JP4571133B2 JP4571133B2 (ja) 2010-10-27

Family

ID=34115416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006522082A Expired - Lifetime JP4571133B2 (ja) 2003-07-28 2004-07-28 プローブカードを平坦化するための装置

Country Status (5)

Country Link
US (2) US7098650B2 (enExample)
JP (1) JP4571133B2 (enExample)
KR (1) KR101181639B1 (enExample)
TW (1) TWI351524B (enExample)
WO (1) WO2005013332A2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7262611B2 (en) 2000-03-17 2007-08-28 Formfactor, Inc. Apparatuses and methods for planarizing a semiconductor contactor
JP4951523B2 (ja) * 2005-11-15 2012-06-13 株式会社アドバンテスト テストヘッド、電子部品試験装置、及び電子部品試験装置へのパフォーマンスボードの装着方法
WO2007057944A1 (ja) 2005-11-15 2007-05-24 Advantest Corporation 電子部品試験装置及び電子部品試験装置へのパフォーマンスボードの装着方法
US7746089B2 (en) * 2006-09-29 2010-06-29 Formfactor, Inc. Method and apparatus for indirect planarization
JP2010050437A (ja) * 2008-07-25 2010-03-04 Yokogawa Electric Corp Ｉｃテスタ
JP2010175507A (ja) 2009-02-02 2010-08-12 Micronics Japan Co Ltd 電気的接続装置
JPWO2011013231A1 (ja) * 2009-07-30 2013-01-07 株式会社アドバンテスト プローブカード保持装置及びプローバ
US8278956B2 (en) * 2010-04-08 2012-10-02 Advantest America, Inc Probecard system and method
JP5952645B2 (ja) * 2012-06-06 2016-07-13 東京エレクトロン株式会社 ウエハ検査用インターフェース及びウエハ検査装置
SG11201405000UA (en) * 2012-06-29 2014-09-26 Hydrovision Asia Pte Ltd An improved suspended sediment meter
US9134343B2 (en) * 2012-09-28 2015-09-15 Intel Corporation Sort probe gripper
KR101255113B1 (ko) 2012-10-31 2013-04-19 주식회사 프로이천 완충부재를 구비한 프로브 블록의 제조방법
JP6042761B2 (ja) * 2013-03-28 2016-12-14 東京エレクトロン株式会社 プローブ装置
JP6184301B2 (ja) * 2013-11-14 2017-08-23 株式会社日本マイクロニクス 検査装置
KR102566685B1 (ko) 2016-07-18 2023-08-14 삼성전자주식회사 프로브 카드용 클램핑 장치 및 이를 포함하는 프로브 카드
US11022628B2 (en) 2019-09-13 2021-06-01 Reid-Ashman Manufacturing, Inc. Probe card support apparatus for automatic test equipment
CN116559506B (zh) * 2023-04-28 2025-11-18 强一半导体(苏州)股份有限公司 一种薄膜探针卡

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3810016A (en) * 1971-12-17 1974-05-07 Western Electric Co Test probe for semiconductor devices
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JPS6362245A (ja) * 1986-09-02 1988-03-18 Canon Inc ウエハプロ−バ
JPH0833433B2 (ja) * 1987-11-30 1996-03-29 東京エレクトロン株式会社 プローブ装置
US5081415A (en) * 1990-08-07 1992-01-14 United Microelectronics Corporation Load board insertion system
US5059898A (en) * 1990-08-09 1991-10-22 Tektronix, Inc. Wafer probe with transparent loading member
US5559446A (en) * 1993-07-19 1996-09-24 Tokyo Electron Kabushiki Kaisha Probing method and device
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US7064566B2 (en) * 1993-11-16 2006-06-20 Formfactor, Inc. Probe card assembly and kit
JP3135825B2 (ja) * 1995-09-27 2001-02-19 株式会社東芝 プローブカードおよびそのプローブカードを使用した半導体集積回路のプロービング試験方法
US6060891A (en) * 1997-02-11 2000-05-09 Micron Technology, Inc. Probe card for semiconductor wafers and method and system for testing wafers
US6798224B1 (en) * 1997-02-11 2004-09-28 Micron Technology, Inc. Method for testing semiconductor wafers
JPH1123615A (ja) * 1997-05-09 1999-01-29 Hitachi Ltd 接続装置および検査システム
JP3315339B2 (ja) * 1997-05-09 2002-08-19 株式会社日立製作所 半導体素子の製造方法並びに半導体素子へのプロービング方法およびその装置
US6078186A (en) * 1997-12-31 2000-06-20 Micron Technology, Inc. Force applying probe card and test system for semiconductor wafers
JP2001056346A (ja) * 1999-08-19 2001-02-27 Fujitsu Ltd プローブカード及び複数の半導体装置が形成されたウエハの試験方法
JP3343541B2 (ja) * 2000-02-18 2002-11-11 日本電子材料株式会社 プローブカード
DE10039336C2 (de) * 2000-08-04 2003-12-11 Infineon Technologies Ag Verfahren zum Testen von Halbleiterschaltungen und Testvorrichtung zur Durchführung des Verfahrens
KR100347765B1 (ko) * 2000-10-18 2002-08-09 삼성전자 주식회사 웨이퍼의 전기적 특성을 검사하는 방법 및 장치
TWI272394B (en) * 2004-02-24 2007-02-01 Mjc Probe Inc Multi-function probe card

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