TW200739799A - Electrostatic chuck, assembly type chucking apparatus having the chuck, apparatus for attaching glass substrates, and assembly type apparatus for attaching glass substrates - Google Patents

Electrostatic chuck, assembly type chucking apparatus having the chuck, apparatus for attaching glass substrates, and assembly type apparatus for attaching glass substrates

Info

Publication number
TW200739799A
TW200739799A TW096111288A TW96111288A TW200739799A TW 200739799 A TW200739799 A TW 200739799A TW 096111288 A TW096111288 A TW 096111288A TW 96111288 A TW96111288 A TW 96111288A TW 200739799 A TW200739799 A TW 200739799A
Authority
TW
Taiwan
Prior art keywords
glass substrates
assembly type
chuck
attaching glass
chucking plate
Prior art date
Application number
TW096111288A
Other languages
Chinese (zh)
Inventor
Ho-Kap An
Yong-Gi Kim
Original Assignee
Komico Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komico Ltd filed Critical Komico Ltd
Publication of TW200739799A publication Critical patent/TW200739799A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

An electrostatic chuck includes a chucking plate including a high molecular material to stably chuck a substrate, an electrode disposed in the chucking plate to generate an electrostatic force for holding the substrate, a supporting member positioned under the chucking plate to support the chucking plate, a buffering member arranged between the chucking plate and the supporting member, a first adhesive disposed between the buffering member and the chucking plate to firmly attach the buffering member to the chucking plate, and a second adhesive disposed between the buffering member and the supporting member to firmly attach the buffering member to the supporting member.
TW096111288A 2006-04-03 2007-03-30 Electrostatic chuck, assembly type chucking apparatus having the chuck, apparatus for attaching glass substrates, and assembly type apparatus for attaching glass substrates TW200739799A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060030252A KR100984748B1 (en) 2006-04-03 2006-04-03 Electrostatic chuck, assemble-type chucking apparatus having the chuck, apparatus for attaching glass substrates having the chuck and assemble-type apparatus for attaching glass substrates having the chuck

Publications (1)

Publication Number Publication Date
TW200739799A true TW200739799A (en) 2007-10-16

Family

ID=38681172

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096111288A TW200739799A (en) 2006-04-03 2007-03-30 Electrostatic chuck, assembly type chucking apparatus having the chuck, apparatus for attaching glass substrates, and assembly type apparatus for attaching glass substrates

Country Status (3)

Country Link
JP (1) JP4668230B2 (en)
KR (1) KR100984748B1 (en)
TW (1) TW200739799A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009141003A (en) * 2007-12-04 2009-06-25 Nhk Spring Co Ltd Electrostatic chuck
NL1036544A1 (en) 2008-02-21 2009-08-24 Asml Netherlands Bv A lithographic apparatus having a chuck with a visco-elastic damping layer.
JP2009200393A (en) * 2008-02-25 2009-09-03 Nhk Spring Co Ltd Electrostatic chuck and method of manufacturing the same
JP5846186B2 (en) * 2010-01-29 2016-01-20 住友大阪セメント株式会社 Electrostatic chuck device and method of manufacturing electrostatic chuck device
US20140116622A1 (en) * 2012-10-31 2014-05-01 Semes Co. Ltd. Electrostatic chuck and substrate processing apparatus
KR101467107B1 (en) * 2013-07-05 2014-12-01 주식회사 야스 Chucking system of electrostatic chuck including fine electrodes
KR101709969B1 (en) 2015-02-25 2017-02-27 (주)티티에스 Manufacturing method for bipolar electro static chuck
KR102643141B1 (en) 2016-11-03 2024-03-04 삼성디스플레이 주식회사 Electrostatic chuck and electrostatic adsorption apparatus
KR102032025B1 (en) * 2017-09-22 2019-10-14 주식회사 야스 Efficient Adhesive Cuck and Dechuck System
KR102026438B1 (en) * 2017-12-13 2019-09-27 주식회사 에이씨엔 Laminating apparatus having glass type electro static chuck and Electro static chuck
KR101964631B1 (en) * 2018-04-06 2019-04-02 (주)아폴로테크 A electrostatic chuck
KR102644838B1 (en) 2018-10-23 2024-03-11 삼성디스플레이 주식회사 Electrostatic chuck and electrostatic adsorption apparaus having the same
KR102558203B1 (en) * 2021-05-06 2023-07-20 김순훈 Curved surface type laminating electrostatic chuck and laminating apparatus comprising the curved surface type laminating electrostatic chuck
KR102488086B1 (en) 2022-06-17 2023-01-13 주식회사 제스코 Electrostatic chuck
CN116945720B (en) * 2023-08-09 2024-01-09 南京航空航天大学 Adhesive film composite electrostatic adsorption device for noninductive adhesion task

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3484107B2 (en) * 1998-08-03 2004-01-06 株式会社巴川製紙所 Electrostatic chuck device
US7040525B2 (en) * 2002-03-20 2006-05-09 Lg.Philips Lcd Co., Ltd. Stage structure in bonding machine and method for controlling the same
JP2003301912A (en) * 2002-04-11 2003-10-24 Mitsuba Corp Actuator
JP2004235563A (en) * 2003-01-31 2004-08-19 Tomoegawa Paper Co Ltd Electrode sheet for electrostatic chuck device and electrostatic chuck device using it

Also Published As

Publication number Publication date
KR20070099188A (en) 2007-10-09
KR100984748B1 (en) 2010-10-01
JP2007279733A (en) 2007-10-25
JP4668230B2 (en) 2011-04-13

Similar Documents

Publication Publication Date Title
TW200739799A (en) Electrostatic chuck, assembly type chucking apparatus having the chuck, apparatus for attaching glass substrates, and assembly type apparatus for attaching glass substrates
TW571144B (en) Substrate assembling apparatus
WO2008129989A1 (en) Substrate holding mechanism and substrate assembling apparatus provided with the same
TW200625504A (en) Substrate holder, stage device and exposure device
TW200725701A (en) Deposition apparatus
TW200736858A (en) Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus
TW200735254A (en) Electrostatic chuck and producing method thereof
TW200707037A (en) Liquid crystal spacer, spacer diffusion liquid, liquid crystal display device manufacturing method, and liquid crystal display device
WO2009069541A1 (en) Mounting base for solar cell module, and mounting structure
TW200700930A (en) Separation apparatus and method
SG131887A1 (en) Lithographic apparatus and device manufacturing method
TW201114538A (en) Press bonding method and press bonding jig
TW200612136A (en) Jig for delivering liquid crystal display plate and method of fabricating liquid crystal display
MY154101A (en) Probe-unit base member and probe unit
TW200732105A (en) Method and apparatus for handling and aligning glass substrates
WO2008081561A1 (en) Perforated support plate
TW200632117A (en) Method of mounting substrate in film deposition apparatus and method of depositing film
WO2007107885A3 (en) Device for contact by adhesion to a glass or semiconductor plate (wafer) surface of the like, and system for gripping such a plate comprising such a device
WO2008088068A1 (en) Fine structure body manufacturing method, fine structure body and micro device
PT1782918E (en) Mounting attachment for a grinding tool, grinding tool and support member for a grinding tool
TW200610583A (en) Turntable device for spin-coating
TW200500712A (en) Method of producing liquid crystal display devices
TW200626914A (en) Apparatus for fixing a workpiece by magnetic force and fixing unit thereof
WO2009134088A3 (en) Holder stage
JP2011192674A5 (en) Alignment apparatus, substrate bonding apparatus, substrate holder and substrate bonding method