CN116945720B - Adhesive film composite electrostatic adsorption device for noninductive adhesion task - Google Patents

Adhesive film composite electrostatic adsorption device for noninductive adhesion task Download PDF

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Publication number
CN116945720B
CN116945720B CN202310995919.8A CN202310995919A CN116945720B CN 116945720 B CN116945720 B CN 116945720B CN 202310995919 A CN202310995919 A CN 202310995919A CN 116945720 B CN116945720 B CN 116945720B
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layer
electrostatic adsorption
electrode
adhesive
insulating
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CN116945720A (en
Inventor
廖文和
田威
陈子超
段晋军
缪云飞
张家铭
李炳锐
叶佳轩
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Nanjing University of Aeronautics and Astronautics
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Nanjing University of Aeronautics and Astronautics
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
    • B64G1/00—Cosmonautic vehicles
    • B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
    • B64G1/64—Systems for coupling or separating cosmonautic vehicles or parts thereof, e.g. docking arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/536—Hardness

Abstract

The invention discloses a glue film composite electrostatic adsorption device facing a non-inductive adhesion task, which comprises an electrostatic adsorption layer, an adhesive layer, insulating silicon rubber and a hard back plate, wherein the adhesive layer is arranged on the outer side of the electrostatic adsorption layer in a surrounding manner, and the adhesive layer and the electrostatic adsorption layer are fixedly adhered to the hard back plate; the electrostatic adsorption layer comprises an insulating layer, flexible electrodes, a substrate layer and insulating filling glue, a plurality of groups of flexible electrodes are arranged between the insulating layer and the substrate layer, and the insulating filling glue is filled in electrode gaps of the flexible electrodes to bond the insulating layer, the flexible electrodes and the substrate layer; the adhesive layer is a single-sided pressure-sensitive adhesive; one surface of the insulating silicon rubber is adhered with the hard backboard, and the other surface is adhered with the electrostatic adsorption layer and the adhesive layer. The invention utilizes the characteristics of simple structure of adsorption technology after electrification and desorption and adhesive adsorption technology after outage of the electrostatic adsorption technology, combines the advantages of the two adsorption technologies, realizes reliable adhesion, can be desorbed after task completion, and improves the reliability and practicality of the device.

Description

Adhesive film composite electrostatic adsorption device for noninductive adhesion task
Technical Field
The invention belongs to the technical field of noninductive adhesion and electrostatic adsorption, and particularly relates to a glue film composite electrostatic adsorption device for noninductive adhesion tasks.
Background
In the on-orbit running process of the spacecraft, the instrument and the equipment are gradually aged and disabled, various faults and accidents possibly occurring at any time are added, and finally the whole spacecraft is scrapped. According to statistics, more than 5000 satellites are transmitted globally, most satellites cannot normally operate, and the cost of a single artificial satellite is quite expensive, so that the development of an on-orbit operation technology capable of extending the service life of the satellite is more important.
The on-orbit operation technology mainly comprises on-orbit assembly, on-orbit service, orbit cleaning and the like. The specific implementation case comprises the implementation of energy supply, fault maintenance, equipment replacement, function expansion and the like on the target spacecraft.
On the premise that the service spacecraft performs on-orbit operation on the target spacecraft, the service spacecraft can achieve the approaching and attaching tasks of the target spacecraft. The service spacecraft starts from a long distance, approaches the target spacecraft at a certain initial speed and generates great impact when the surface of the target spacecraft lands. When the impact resilience is greater than the adsorption force, the service spacecraft rebounds, resulting in attachment failure. Therefore, a stable non-inductive attachment is needed.
The literature on space wall climbing robot scheme facing to space non-cooperative spacecraft proposes an adsorption mode based on bionic gecko bristle dry adhesive to realize the attachment task of the space non-cooperative spacecraft, however, the adsorption mode of dry adhesive needs larger desorption force, controllable adsorption is difficult to realize, the requirement on the surface flatness of an adsorbed object is higher, and effective adsorption cannot be realized on an object with larger surface roughness. The application of several other adsorption techniques in space has still major drawbacks. The negative pressure adsorption technology cannot be used in a vacuum environment; the adsorption object range of the magnetic adsorption is narrow, only materials with ferromagnetism can be adsorbed, the controllable adsorption can not be realized by the adhesive adhesion, and the adsorption force is reduced after the adhesive is repeatedly used for many times.
The electrostatic adsorption technology can be used in a vacuum environment, and has a wide adsorption object range, including a conductor material and an insulating material; the controllable adsorption function can be realized, and the adsorption after power-on and the desorption after power-off can be realized; the surface flatness of the adsorption object is not required to be high, and the object with larger surface roughness can be adsorbed; can realize effective adsorption to a large plane. Therefore, the electrostatic adsorption technology is the first technology in the task of non-inductive adhesion.
At present, the electrostatic adsorption technology is mainly applied to the production and manufacturing process of the electrostatic chuck. The electrostatic chuck is applied to processing technologies such as semiconductor wafer plasma etching, chemical vapor deposition and the like, and achieves the functions of fixed clamping after power-on and desorption after power-off. Because the surface flatness of the semiconductor wafer is high, the electrostatic chuck generally adopts hard materials such as alumina ceramics and azoxyceramics as insulating layers, but the rigid electrostatic chuck cannot realize effective adsorption to the adsorption surface with larger surface roughness. Therefore, the existing electrostatic adsorption device adopting the rigid electrostatic chuck needs to be upgraded and modified, and the defect that the electrostatic adsorption device cannot effectively adsorb an adsorption surface with large surface roughness is overcome.
Disclosure of Invention
The invention aims to solve the technical problem of providing a glue film composite electrostatic adsorption device for a non-inductive attaching task aiming at the defects of the prior art.
In order to achieve the technical purpose, the invention adopts the following technical scheme:
the adhesive film composite electrostatic adsorption device facing the non-inductive adhesion task comprises an electrostatic adsorption layer, an adhesive layer, insulating silicon rubber and a hard backboard, wherein the adhesive layer is arranged on the outer side of the electrostatic adsorption layer in a surrounding manner, and the adhesive layer and the electrostatic adsorption layer are fixedly adhered to the hard backboard;
the electrostatic adsorption layer comprises an insulating layer, flexible electrodes, a substrate layer and insulating filling glue, a plurality of groups of flexible electrodes are arranged between the insulating layer and the substrate layer, and the insulating filling glue is filled in electrode gaps of the flexible electrodes to bond the insulating layer, the flexible electrodes and the substrate layer;
the adhesive layer is a single-sided pressure-sensitive adhesive;
one surface of the insulating silicon rubber is adhered with the hard backboard, and the other surface is adhered with the electrostatic adsorption layer and the adhesive layer.
Preferably, the excitation voltage types of the flexible electrode include direct current excitation, sinusoidal excitation and square wave excitation.
Preferably, the insulating layer and the basal layer are polyimide film polymer flexible materials; the flexible electrode is made of silver or copper metal conductor materials; the insulating filling glue is epoxy glue or acrylic glue.
Preferably, the single-sided pressure-sensitive adhesive is selected from single-sided acrylic pressure-sensitive adhesives.
Preferably, the insulating silicon rubber is GD414 rubber.
Preferably, the area of the electrostatic adsorption layer and the area of the adhesive layer are calculated according to the type of the object to be adsorbed, the adsorption time, the impact speed, the rebound force and the swing torque parameter value.
Preferably, the insulating layer has a thickness of less than 30 μm and the flexible electrode has a thickness of less than 50 μm.
Preferably, the flexible electrode is an electrode with positive electrodes and negative electrodes alternately arranged in a concentric circle shape, a double-point double-line redundancy design is adopted, and two sides are respectively provided with a group of electrode positive and negative terminal wiring which can be simultaneously connected with excitation voltage for supplying power.
Preferably, the ratio of the electrode width value of the anode and the cathode of the flexible electrode to the electrode spacing value between the anode and the cathode is 2:1, a step of; the electrode width value and the electrode spacing value are smaller than 1mm, and the electrode width value and the electrode spacing value are obtained through calculation according to the parameters of the adsorption object, the required electrostatic adsorption force, the adsorption surface area, the excitation voltage type and the excitation voltage amplitude.
Preferably, a power supply line communication groove is arranged between the electrostatic adsorption layer and the adhesive layer, and a power supply line communication hole is arranged at a position corresponding to the hard backboard.
The invention has the following beneficial effects:
by combining the electrostatic adsorption technology and the adhesive adsorption technology, the adhesive film composite electrostatic adsorption device for the non-inductive adhesion task disclosed by the invention utilizes the characteristics of simple structure of adsorption technology after electrification and desorption and adhesive adsorption technology after outage of the electrostatic adsorption technology, combines the advantages of the two adsorption technologies, realizes reliability in adhesion, can be desorbed after task completion, and improves the reliability and practicality of the device.
Drawings
Fig. 1 is a front view of the adhesive film composite electrostatic adsorption device facing the task of non-inductive adhesion.
Fig. 2 is a cross-sectional view of fig. 1 of the adhesive film composite electrostatic adsorbing device for the task of non-inductive adhesion according to the present invention along the symmetry axis.
Fig. 3 is a schematic diagram of a double-point double-line redundancy design of a flexible electrode of an electrostatic adsorption layer of a glue film composite electrostatic adsorption device facing a non-inductive adhesion task.
Fig. 4 is a schematic diagram of an excitation circuit of a flexible electrode of an electrostatic adsorption system of the adhesive film composite electrostatic adsorption device facing a non-inductive adhesion task.
Wherein: 1. an insulating layer; 2. a flexible electrode; 3. a base layer; 4. insulating filling glue; 5. a single-sided pressure-sensitive adhesive; 6. an insulating silicone rubber; 7. a hard back plate; 9. electrode width; 10. electrode spacing; 11. an electrostatic adsorption layer; 12. an adhesive layer; 21. a first concentric circular electrode set; 22. and a second concentric electrode group.
Description of the embodiments
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings.
Referring to fig. 1-4, a glue film composite electrostatic adsorption device facing a non-inductive adhesion task comprises an electrostatic adsorption layer 11, an adhesive layer 12, insulating silicon rubber 6 and a hard backboard 7, wherein the adhesive layer 12 is arranged on the outer side of the electrostatic adsorption layer 11 in a surrounding manner, and the adhesive layer 12 and the electrostatic adsorption layer 11 are fixedly adhered to the hard backboard 7;
the electrostatic adsorption layer 11 comprises an insulating layer 1, a flexible electrode 2, a substrate layer 3 and insulating filling glue 4, a plurality of groups of flexible electrodes 2 are arranged between the insulating layer 1 and the substrate layer 3, and the insulating filling glue 4 is filled in electrode gaps of the flexible electrodes 2 to bond the insulating layer 1, the flexible electrodes 2 and the substrate layer 3;
the adhesive layer 12 is a single-sided pressure-sensitive adhesive 5;
one surface of the insulating silicone rubber 6 is adhered with the hard back plate 7, and the other surface is adhered with the electrostatic adsorption layer 11 and the adhesive layer 12.
The insulating silicon rubber 6 keeps stable bonding all the time, the adhesive layer 12 assists the electrostatic adsorption layer, so that the adsorption in the contact moment is more stable, then the adhesive layer 12 fails after being influenced by long-time high temperature, radiation and plasma, the electrostatic adsorption layer can provide long-time adsorption force after being continuously electrified, the adsorption force disappears after the power is cut off, and the device is automatically free from desorption.
The hard backboard 7 has high hardness and good insulating property, and can adapt to high and low temperature, radiation and plasma environments.
In particular, the excitation voltage types of the flexible electrode 2 include direct current excitation, sinusoidal excitation and square wave excitation.
In specific implementation, the insulating layer 1 and/or the substrate layer 3 may be made of polyimide PI, polyethylene terephthalate PET, polyvinylidene fluoride PVDF, polyethylene naphthalate PEN, polyphenylene sulfide PPS, polycarbonate PC, polyurethane PU, parylene, silicone plastic Silicone, biaxially oriented polypropylene film BOPP polymer film flexible material, PDMS, ECOFLEX0030, ECOFLEX0050 Silicone rubber material; the flexible electrode 2 is made of silver or copper metal conductor material, or conductive ink or carbon nano-catheter conductive material; the insulating filling glue 4 is epoxy glue or acrylic glue.
In specific implementation, the single-sided pressure-sensitive adhesive 5 is selected from single-sided acrylic pressure-sensitive adhesives.
In specific implementation, the insulating silicon rubber 6 is GD414 rubber.
In specific implementation, the area of the electrostatic adsorption layer 11 and the area of the adhesive layer 12 are calculated according to the type of the object to be adsorbed, the adsorption time, the impact speed, the rebound force and the swing torque parameter value.
In particular, the thickness of the insulating layer 1 is less than 30 μm, and the thickness of the flexible electrode 2 is less than 50 μm. Under the same condition, the smaller the thickness of the insulating layer 1 is, the larger the electrostatic adsorption force is, but the breakdown is easy to occur, under the condition of ensuring no breakdown, the thickness of the insulating layer 1 is as small as possible, the influence of the selection of the thickness of the insulating layer on the electrostatic adsorption force is obvious, and the electrostatic adsorption force is calculated and obtained according to the adsorption object, the required electrostatic adsorption force, the adsorption surface area, the excitation voltage type and the excitation voltage amplitude parameter.
Referring to fig. 3, in the implementation, the flexible electrode 2 is an electrode with positive and negative electrodes alternately arranged in a concentric circle shape, and adopts a double-point double-line redundancy design, and two sides of the flexible electrode are respectively provided with a group of electrode positive and negative terminal wires, so that the flexible electrode can be simultaneously connected with an excitation voltage for supplying power.
Referring to fig. 3, in the implementation, the flexible electrode 2 is composed of two sets of multiple circles of first concentric circle electrode sets 21 and second concentric circle electrode sets 22 which are alternately arranged, and the ratio of the electrode width 9 value of the positive electrode and the negative electrode of the flexible electrode 2 to the electrode spacing 10 value between the positive electrode and the negative electrode is 2:1, a step of; the electrode width 9 value and the electrode spacing 10 value are smaller than 1mm, under the same condition, the smaller the electrode spacing 10 is, the larger the electrostatic adsorption force is, but the more breakdown is easy to occur, the electrode spacing 10 is as small as possible on the premise of no breakdown, and the electrode width 9 value and the electrode spacing 10 value are obtained through calculation according to the adsorption object, the required electrostatic adsorption force, the adsorption surface area, the excitation voltage type and the excitation voltage amplitude parameter.
In specific implementation, a power supply line communication groove is provided between the electrostatic adsorption layer 11 and the adhesive layer 12, and a power supply line communication hole is provided at a position corresponding to the hard back plate 7.
Referring to fig. 4, wiring and circuit design: the first concentric circle electrode group 21 and the second concentric circle electrode group 22 are connected with the high voltage module output excitation voltage power supply line through a group of electrode positive and negative terminal wiring on each of two sides. The double-point double-line redundancy design does not affect the normal adsorption function. If a group of positive and negative terminal lines are broken accidentally during the impact adhesion task and the other group of positive and negative terminal lines are intact, the electrostatic adsorption layer 11 can still maintain the normal adsorption function. The power supply line is connected with the high-voltage module behind the hard backboard 7 through a communication groove between the electrostatic adsorption layer 11 and the single-sided pressure sensitive adhesive 5 and a communication hole at a corresponding position of the hard backboard 7. The high-voltage module is connected with the control module, the control module provides the required input voltage for the high-voltage module, and the control module controls whether the high-voltage module outputs the excitation voltage or not by controlling whether the input voltage of the high-voltage module is output or not, so that the controllable adsorption of the electrostatic adsorption layer 11 is realized. The type of excitation voltage may be direct current, sinusoidal, square wave or arbitrary.
Electrostatic adsorption theory of operation: the electrostatic adsorption layer 11 is attached to the surface of the object to be adsorbed, and after an excitation voltage is applied, an electric field generated by the electrostatic adsorption layer makes the conductor generate induced charges due to an electrostatic induction phenomenon, so that the dielectric medium generates polarized charges due to a polarization phenomenon, and the generated charges and charges with opposite polarities on the surface of the electrostatic adsorption layer are attracted to each other, thereby forming electrostatic adsorption force.
According to the adhesive film composite electrostatic adsorption device facing the non-inductive adhesion task, the electrostatic adsorption technology and the adhesive adsorption technology are combined, and the advantages of the two adsorption technologies are combined by utilizing the characteristics of simple structure of adsorption technology after electrification and desorption technology after outage and adhesive adsorption technology after electrification of the electrostatic adsorption technology, so that the reliability in adhesion is realized, the desorption after task completion is realized, and the reliability and the practicability of the device are improved.
While the invention has been described in detail with respect to the general description and specific embodiments thereof, it will be apparent to those skilled in the art that various modifications and improvements can be made thereto. Accordingly, such modifications or improvements may be made without departing from the spirit of the invention and are intended to be within the scope of the invention as claimed.

Claims (10)

1. Adhesive film combined type electrostatic adsorption device towards no sense adhesion task, its characterized in that: the device comprises an electrostatic adsorption layer (11), an adhesive layer (12), insulating silicon rubber (6) and a hard backboard (7), wherein the adhesive layer (12) is arranged on the outer side of the electrostatic adsorption layer (11) in a surrounding mode, and the adhesive layer (12) and the electrostatic adsorption layer (11) are fixedly adhered to the hard backboard (7);
the electrostatic adsorption layer (11) comprises an insulating layer (1), a flexible electrode (2), a substrate layer (3) and insulating filling glue (4), wherein a plurality of groups of flexible electrodes (2) are arranged between the insulating layer (1) and the substrate layer (3), and the insulating filling glue (4) is filled in electrode gaps of the flexible electrodes (2) to bond the insulating layer (1), the flexible electrodes (2) and the substrate layer (3);
the adhesive layer (12) is a single-sided pressure-sensitive adhesive (5);
one surface of the insulating silicon rubber (6) is adhered with the hard backboard (7), and the other surface is adhered with the electrostatic adsorption layer (11) and the adhesive layer (12).
2. The adhesive film composite electrostatic adsorption device for non-inductive adhesion tasks according to claim 1, wherein: the excitation voltage types of the flexible electrode (2) include direct current excitation, sinusoidal excitation and square wave excitation.
3. The adhesive film composite electrostatic adsorption device for non-inductive adhesion tasks according to claim 1, wherein: the insulating layer (1) and the basal layer (3) are made of polyimide film polymer flexible materials; the flexible electrode (2) is made of silver or copper metal conductor materials; the insulating filling glue (4) is epoxy glue or acrylic glue.
4. The adhesive film composite electrostatic adsorption device for non-inductive adhesion tasks according to claim 1, wherein: the single-sided pressure-sensitive adhesive (5) is selected from single-sided acrylic pressure-sensitive adhesives.
5. The adhesive film composite electrostatic adsorption device for non-inductive adhesion tasks according to claim 1, wherein: and the insulating silicon rubber (6) is GD414 rubber.
6. The adhesive film composite electrostatic adsorption device for non-inductive adhesion tasks according to claim 1, wherein: the area of the electrostatic adsorption layer (11) and the area of the adhesive layer (12) are calculated according to the type of the adsorbed object, the adsorption time, the impact speed, the rebound force and the swing torque parameter value.
7. The adhesive film composite electrostatic adsorption device for non-inductive adhesion tasks according to claim 1, wherein: the thickness of the insulating layer (1) is less than 30 mu m, and the thickness of the flexible electrode (2) is less than 50 mu m.
8. The adhesive film composite electrostatic adsorption device for non-inductive adhesion tasks according to claim 1, wherein: the flexible electrode (2) is an electrode with concentric circles of alternately arranged positive and negative electrodes, adopts a double-point double-line redundancy design, is respectively provided with a group of electrode positive and negative terminal wiring at two sides, and can be simultaneously connected with excitation voltage for supplying power.
9. The non-inductive attachment task oriented adhesive film composite electrostatic adsorption device of claim 8, wherein: the ratio of the electrode width (9) value of the anode and the cathode of the flexible electrode (2) to the electrode spacing (10) value between the anode and the cathode is 2:1, a step of; the electrode width (9) value and the electrode spacing (10) value are smaller than 1mm, and the electrode width (9) value and the electrode spacing (10) value are obtained through calculation according to the parameters of the adsorption object, the required electrostatic adsorption force, the adsorption surface area, the excitation voltage type and the excitation voltage amplitude.
10. The adhesive film composite electrostatic adsorption device for non-inductive adhesion tasks according to claim 1, wherein: and a power supply line communication groove is arranged between the electrostatic adsorption layer (11) and the adhesive layer (12), and a power supply line communication hole is arranged at a position corresponding to the hard backboard (7).
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