TW200629462A - Supporting plate attaching method - Google Patents

Supporting plate attaching method

Info

Publication number
TW200629462A
TW200629462A TW094141922A TW94141922A TW200629462A TW 200629462 A TW200629462 A TW 200629462A TW 094141922 A TW094141922 A TW 094141922A TW 94141922 A TW94141922 A TW 94141922A TW 200629462 A TW200629462 A TW 200629462A
Authority
TW
Taiwan
Prior art keywords
support plate
pressure
adhesive layer
supporting plate
attaching method
Prior art date
Application number
TW094141922A
Other languages
Chinese (zh)
Other versions
TWI430387B (en
Inventor
Yoshihiro Inao
Atsushi Miyanari
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200629462A publication Critical patent/TW200629462A/en
Application granted granted Critical
Publication of TWI430387B publication Critical patent/TWI430387B/en

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

To provide an adhering method for pressure-bonding the support plate by easily removing the gas between a substrate such as semiconductor wafer or the like and the support plate. A bonding agent layer 1 is formed over a circuit forming surface by coating an adhesive to the circuit forming surface of a substrate W such as semiconductor wafer or the like. Next, adhesive layer 1 is heated and finished as a dried and fixed layer. Thereafter, a support plate 2 provided with through-holes 3 in the thickness direction for the entire part of the plate is stacked on the adhesive layer 1. Under this condition, the support plate 2 is pushed and pressure-bonded to the adhesive layer 1 under the pressure-reduced and heated state.
TW094141922A 2004-11-29 2005-11-29 Supporting plate attaching method TWI430387B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004344737A JP4652030B2 (en) 2004-11-29 2004-11-29 Attaching the support plate

Publications (2)

Publication Number Publication Date
TW200629462A true TW200629462A (en) 2006-08-16
TWI430387B TWI430387B (en) 2014-03-11

Family

ID=36634584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141922A TWI430387B (en) 2004-11-29 2005-11-29 Supporting plate attaching method

Country Status (4)

Country Link
JP (1) JP4652030B2 (en)
KR (1) KR101099248B1 (en)
CN (1) CN100530527C (en)
TW (1) TWI430387B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5027460B2 (en) * 2006-07-28 2012-09-19 東京応化工業株式会社 Wafer bonding method, thinning method, and peeling method
US8466226B2 (en) 2006-11-15 2013-06-18 Rohm And Haas Company Adhesives for elastomers
JP4825695B2 (en) 2007-01-19 2011-11-30 東京応化工業株式会社 Liquid solvent contact unit
JP5090789B2 (en) * 2007-05-30 2012-12-05 東京応化工業株式会社 Bonding apparatus, method for preventing dissolution of adhesive, and bonding method
JP2009130218A (en) * 2007-11-26 2009-06-11 Tokyo Ohka Kogyo Co Ltd Bonding device and bonding method
JP4742252B2 (en) * 2008-12-10 2011-08-10 カシオ計算機株式会社 Manufacturing method of semiconductor device
KR101027858B1 (en) * 2009-01-13 2011-04-07 도레이첨단소재 주식회사 Wafer support adhesive film for processing in semiconductor thin film wafer fabrication
JP5520491B2 (en) * 2009-01-27 2014-06-11 株式会社日立ハイテクノロジーズ Sample stage device
JP6869101B2 (en) * 2017-05-12 2021-05-12 株式会社ダイセル Adhesive layer forming device, semiconductor chip manufacturing line, and manufacturing method of laminate
JP7220135B2 (en) * 2018-11-01 2023-02-09 信越化学工業株式会社 LAMINATED PRODUCTION METHOD AND SUBSTRATE MANUFACTURING METHOD
JP7335136B2 (en) * 2019-11-06 2023-08-29 株式会社ディスコ Resin protective member forming device
JP7396863B2 (en) * 2019-11-06 2023-12-12 株式会社ディスコ Method of forming protective member

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61208842A (en) * 1985-03-14 1986-09-17 Nippon Telegr & Teleph Corp <Ntt> Semiconductor wafer supporting substrate
JP2001077304A (en) * 1999-06-28 2001-03-23 Mitsubishi Gas Chem Co Inc Method for manufacturing electronic parts
JP2002059363A (en) * 2000-08-23 2002-02-26 Chemitoronics Co Ltd Wafer base material
KR100575867B1 (en) * 2002-12-26 2006-05-03 주식회사 하이닉스반도체 Method for adhering semiconductor die
JP4364535B2 (en) * 2003-03-27 2009-11-18 シャープ株式会社 Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
CN100530527C (en) 2009-08-19
TWI430387B (en) 2014-03-11
KR20060059826A (en) 2006-06-02
JP2006156683A (en) 2006-06-15
JP4652030B2 (en) 2011-03-16
KR101099248B1 (en) 2011-12-27
CN1815688A (en) 2006-08-09

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