JP2007072066A - 電気光学装置及び電子機器、インターフェース基板 - Google Patents
電気光学装置及び電子機器、インターフェース基板 Download PDFInfo
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
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- H—ELECTRICITY
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09354—Ground conductor along edge of main surface
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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Abstract
【解決手段】 電気光学パネルに接続され、フィルム基板に、複数の端子と、複数の配線と、第1の導電部材とを備えるインターフェース基板であって、複数の端子は、フィルム基板の一方の面に配列されている。複数の配線は、FPCにパターン形成された配線であり、フィルム基板の一方の面に配列され、複数の端子と電気的に接続されている。第1の導電部材は、銅(Cu)などで形成された金属膜であり、複数の配線のうち、すくなくとも1本の配線に平面的に重なり、且つ1本の配線に沿って、フィルム基板の他方の面に形成されている。また、第1の導電部材は、グラウンド配線に結線され、常に電位が0Vに設定されている。このようにすることで、金属膜が沿って形成された配線に流れる高周波信号のロスを抑え、データ伝送を安定して行うことができる。
【選択図】図4
Description
まず、図1又は図2を参照して、本実施形態に係る液晶表示装置100の構成等について説明する。
を介して、外部接続用配線35と電気的に接続されている一方、ドライバIC40の出力側は、ACFを介して、複数のソース線32、ゲート線33、配線15と電気的に接続されている。また、ドライバIC40は、図3に示すように、レシーバ40aを有しており、そのレシーバ40aは、FPC41側から差動伝送方式によって伝送される差動信号を一対の外部接続用配線35b及び35cを介して受信する。ここで、差動伝送方式とは、1つの信号からプラス信号及びその反転信号としてのマイナス信号の2相の信号を発生し、2本の信号線を対に用いて伝送する方式である。この方式を採用することにより、低振幅で、且つ、高速データ伝送をすることができるという利点がある。差動伝送方式によってデータ伝送を行う場合には、差動信号の波形歪みの発生を防止するため、その差動信号が入力される2本の信号線の間に終端抵抗体50が設けられる。
次に、本発明のFPC41の構造について詳細に説明する。図4は、本発明のFPC41と、素子基板91の張り出し領域31を示す模式図である。
本発明のFPC41は、上述した液晶表示装置に適用することができるだけでなく、代わりに有機EL(electroluminescence)表示装置などの他の表示装置にも適用することができるのは言うまでもない。
次に、本実施形態に係る液晶表示装置100を電子機器の表示装置として用いる場合の実施形態について説明する。
Claims (8)
- 電気光学パネル及びインターフェース基板を有し、画像表示のための信号が前記インターフェース基板を介して前記電気光学パネルに供給される電気光学装置であって、
前記インターフェース基板が、
可撓性を有するフィルム基板と、
前記フィルム基板の一方の面に配列されてなる複数の端子と、
前記フィルム基板の前記一方の面に配列され、前記複数の端子と電気的に接続されてなる複数の配線と、
前記フィルム基板の他方の面に形成され、グラウンド配線に結線されてなる第1の導電部材と、を備え、
前記第1の導電部材は、前記複数の配線のうち、少なくとも1本の配線に平面的に重なり、且つ前記1本の配線に沿って形成されてなることを特徴とする電気光学装置。 - 前記第1の導電部材の幅は、前記1本の配線の幅の3倍以上となることを特徴とする請求項1に記載の電気光学装置。
- 前記複数の配線のうち、第1の配線及び第2の配線は、差動伝送方式における差動信号を伝送するために用いられ、
前記第1の配線は、1つの信号から発生されたプラス信号を伝送し、
前記第2の配線は、前記プラス信号の反転信号たるマイナス信号を伝送し、
前記第1の導電部材は、前記第1の配線及び前記第2の配線に平面的に重なり、且つ前記第1の配線及び前記第2の配線に沿って形成されてなることを特徴とする請求項1又は2に記載の電気光学装置。 - 前記複数の端子に跨って、前記フィルム基板の他方の面に形成されてなる第2の導電部材を備え、
前記第2の導電部材は、前記第1の導電部材と接していることを特徴とする請求項1乃至3のいずれか一項に記載の電気光学装置。 - 前記第2の導電部材は、前記フィルム基板の一端よりも内側にオフセットされて形成されてなることを特徴とする請求項4に記載の電気光学装置。
- 請求項1乃至5のいずれか一項に記載の電気光学装置を表示部に備えることを特徴とする電子機器。
- 可撓性を有するフィルム基板と、
前記フィルム基板の一方の面に配列されてなる複数の端子と、
前記フィルム基板の前記一方の面に配列され、前記複数の端子と電気的に接続されてなる複数の配線と、
前記フィルム基板の他方の面に形成され、グラウンド配線に結線されてなる第1の導電部材と、を備え、
前記第1の導電部材は、前記複数の配線のうち、少なくとも1本の配線に平面的に重なり、且つ前記1本の配線に沿って形成されてなることを特徴とするインターフェース基板。 - 前記フィルム基板の他方の面に形成され、前記複数の端子に跨って形成されてなる第2の導電部材を備え、
前記第2の導電部材は、前記第1の導電部材と接していることを特徴とする請求項7に記載のインターフェース基板。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005257607A JP4093258B2 (ja) | 2005-09-06 | 2005-09-06 | 電気光学装置及び電子機器 |
KR1020060085046A KR100831506B1 (ko) | 2005-09-06 | 2006-09-05 | 전기 광학 장치, 전자기기 및 인터페이스 기판 |
TW095132775A TWI346827B (en) | 2005-09-06 | 2006-09-05 | Electro-optical device, and interface board |
CNB2006101289739A CN100543531C (zh) | 2005-09-06 | 2006-09-06 | 电光装置、电子设备及接口基板 |
US11/515,929 US7554643B2 (en) | 2005-09-06 | 2006-09-06 | Electro-optical device, electronic apparatus, and interface board |
CN200810137651XA CN101329455B (zh) | 2005-09-06 | 2006-09-06 | 电光装置和电子设备 |
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JP2005257607A JP4093258B2 (ja) | 2005-09-06 | 2005-09-06 | 電気光学装置及び電子機器 |
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JP (1) | JP4093258B2 (ja) |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009098625A (ja) * | 2007-09-28 | 2009-05-07 | Epson Imaging Devices Corp | 電気光学装置及びその製造方法並びに電子機器 |
JP2009192921A (ja) * | 2008-02-15 | 2009-08-27 | Hitachi Displays Ltd | 表示装置 |
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JP4523051B2 (ja) * | 2008-05-09 | 2010-08-11 | 日東電工株式会社 | 配線回路基板の製造方法 |
EP2310443B1 (en) | 2008-06-30 | 2018-05-30 | Kolon Industries, Inc. | Plastic substrate and device including the same |
CN101488330B (zh) * | 2008-12-19 | 2011-09-14 | 华为终端有限公司 | 一种实现液晶屏幕和主板连接的传输装置和电子设备 |
TWI424735B (zh) * | 2009-07-10 | 2014-01-21 | Inventec Appliances Corp | 行動通訊裝置及其影像處理方法 |
CN104049393A (zh) * | 2014-06-12 | 2014-09-17 | 深圳市华星光电技术有限公司 | 一种覆晶薄膜基板及其制作方法和显示面板 |
KR102310301B1 (ko) * | 2014-07-18 | 2021-10-12 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102328314B1 (ko) * | 2017-09-15 | 2021-11-17 | 엘지디스플레이 주식회사 | 전계 발광 표시 장치 및 전계 발광 표시 장치용 드라이버 ic 필름부 |
JP6958396B2 (ja) * | 2018-01-31 | 2021-11-02 | 住友大阪セメント株式会社 | フレキシブル基板及び光デバイス |
WO2024122687A1 (ko) * | 2022-12-08 | 2024-06-13 | 엘지전자 주식회사 | 패널 인터페이스 |
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JP2009192921A (ja) * | 2008-02-15 | 2009-08-27 | Hitachi Displays Ltd | 表示装置 |
Also Published As
Publication number | Publication date |
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CN101329455B (zh) | 2012-03-14 |
KR100831506B1 (ko) | 2008-05-22 |
US7554643B2 (en) | 2009-06-30 |
TW200732802A (en) | 2007-09-01 |
TWI346827B (en) | 2011-08-11 |
CN101329455A (zh) | 2008-12-24 |
CN100543531C (zh) | 2009-09-23 |
JP4093258B2 (ja) | 2008-06-04 |
CN1928639A (zh) | 2007-03-14 |
US20070052904A1 (en) | 2007-03-08 |
KR20070027452A (ko) | 2007-03-09 |
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