JP2007036059A - 半田付け実装構造およびその製造方法、並びにその利用 - Google Patents
半田付け実装構造およびその製造方法、並びにその利用 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 238000002844 melting Methods 0.000 claims description 66
- 230000008018 melting Effects 0.000 claims description 66
- 238000000034 method Methods 0.000 claims description 35
- 238000010438 heat treatment Methods 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000005476 soldering Methods 0.000 description 14
- 230000004907 flux Effects 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 10
- 230000035882 stress Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
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- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
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- 230000001771 impaired effect Effects 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910018956 Sn—In Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
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Abstract
【解決手段】 本発明のカメラモジュール構造は、プリント基板1に形成された基板電極2と、そのプリント基板1に実装されたカメラモジュール3に形成された実装電極4とが、半田接合部5を介して接合され、基板電極2と実装電極4とが、セルフアライメントにより位置合わせされている。そして、半田接合部5が、特性の異なる第1の半田6と第2の半田7から構成されている。
【選択図】 図1
Description
2 基板電極
3 カメラモジュール(実装部品)
4 実装電極
5 半田接合部
6 第1の半田
7 第2の半田(半田ボール)
10 カメラモジュール構造(半田付け実装構造)
20a,20b 凹部
Claims (13)
- 基板に形成された基板電極と、その基板に実装された実装部品に形成された実装電極とが、半田接合部を介して接合され、
上記半田接合部が、複数種類の半田を含んで構成されていることを特徴とする半田付け実装構造。 - 上記半田接合部は、相対的に溶融温度または溶融時の表面張力の低い第1の半田と、第1の半田よりも溶融温度または溶融時の表面張力の高い第2の半田とを含むことを特徴とする請求項1に記載の半田付け実装構造。
- 上記基板電極および実装電極は、上記半田接合部に覆われていることを特徴とする請求項1に記載の半田付け実装構造。
- 第2の半田が球状であるとともに、
第2の半田が、基板電極および実装電極のそれぞれに形成された凹部に挟持されていることを特徴とする請求項1に記載の半田付け実装構造。 - 上記第2の半田は、基板電極および実装電極に面接触するように形成されていることを特徴とする請求項1に記載の半田付け実装構造。
- 上記複数種類の半田が、鉛フリー半田であることを特徴とする請求項1に記載の半田付け実装構造。
- 上記実装部品が、光学素子であることを特徴とする請求項1に記載の半田付け実装構造。
- 基板に形成された基板電極と、その基板に実装される実装部品に形成された実装電極とを、半田接合部によって接合された半田付け実装構造の製造方法であって、
複数種類の半田により半田接合部を形成し、それら複数種類の半田のセルフアライメントにより、基板電極と実装電極との位置合わせを行うことを特徴とする半田付け実装構造の製造方法。 - 上記複数種類の半田として、相対的に溶融温度の低い第1の半田と、第1の半田よりも溶融温度の高い第2の半田とを用い、第1の半田の溶融温度以上、第2の半田の溶融温度未満に加熱することを特徴とする請求項8に記載の半田付け実装構造の製造方法。
- 上記複数種類の半田として、相対的に溶融時の表面張力の低い第1の半田と、第1の半田よりも溶融時の表面張力の高い第2の半田とを用い、第1の半田および第2の半田の溶融温度以上に加熱することを特徴とする請求項8に記載の半田付け実装構造の製造方法。
- 上記第2の半田として、半田ボールを用いることを特徴とする請求項9に記載の半田付け実装構造の製造方法。
- 請求項1〜7のいずれか1項に記載の半田付け実装構造を備えることを特徴とする電子機器。
- 基板に形成された基板電極と、その基板に実装される実装部品に形成された実装電極とを、半田接合部によって接合する半田付け実装方法であって、
複数種類の半田により半田接合部を形成し、それら複数種類の半田のセルフアライメントにより、基板電極と実装電極との位置合わせを行うことを特徴とする半田付け実装方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005219548A JP4040644B2 (ja) | 2005-07-28 | 2005-07-28 | 半田付け実装構造の製造方法および半田付け実装方法 |
CN2006800274151A CN101233793B (zh) | 2005-07-28 | 2006-07-21 | 钎焊安装结构的制造方法以及钎焊安装方法 |
EP06768352A EP1912484A4 (en) | 2005-07-28 | 2006-07-21 | BRAZING MOUNTING STRUCTURE, METHOD OF MANUFACTURING SAME AND METHOD OF MOUNTING BRAZING STRUCTURE |
US11/989,453 US20090166069A1 (en) | 2005-07-28 | 2006-07-21 | Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure |
PCT/JP2006/314474 WO2007013365A1 (ja) | 2005-07-28 | 2006-07-21 | 半田付け実装構造およびその製造方法、並びにその利用 |
KR1020087004276A KR100982183B1 (ko) | 2005-07-28 | 2006-07-21 | 납땜 실장 구조의 제조 방법 |
TW095127496A TWI330056B (en) | 2005-07-28 | 2006-07-27 | Soldered package, manufacturing method of same, and utilization of same |
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JP2005219548A JP4040644B2 (ja) | 2005-07-28 | 2005-07-28 | 半田付け実装構造の製造方法および半田付け実装方法 |
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JP2007036059A true JP2007036059A (ja) | 2007-02-08 |
JP4040644B2 JP4040644B2 (ja) | 2008-01-30 |
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Country Status (7)
Country | Link |
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US (1) | US20090166069A1 (ja) |
EP (1) | EP1912484A4 (ja) |
JP (1) | JP4040644B2 (ja) |
KR (1) | KR100982183B1 (ja) |
CN (1) | CN101233793B (ja) |
TW (1) | TWI330056B (ja) |
WO (1) | WO2007013365A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007214172A (ja) * | 2006-02-07 | 2007-08-23 | Nec Corp | Lsiパッケージ及びコア入りはんだバンプ並びにlsiパッケージ実装方法 |
JP2009277777A (ja) * | 2008-05-13 | 2009-11-26 | Tamura Seisakusho Co Ltd | はんだボール搭載方法及び電子部品実装用部材 |
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2006
- 2006-07-21 KR KR1020087004276A patent/KR100982183B1/ko not_active IP Right Cessation
- 2006-07-21 EP EP06768352A patent/EP1912484A4/en not_active Withdrawn
- 2006-07-21 CN CN2006800274151A patent/CN101233793B/zh not_active Expired - Fee Related
- 2006-07-21 WO PCT/JP2006/314474 patent/WO2007013365A1/ja active Application Filing
- 2006-07-21 US US11/989,453 patent/US20090166069A1/en not_active Abandoned
- 2006-07-27 TW TW095127496A patent/TWI330056B/zh not_active IP Right Cessation
Cited By (10)
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JP2007214172A (ja) * | 2006-02-07 | 2007-08-23 | Nec Corp | Lsiパッケージ及びコア入りはんだバンプ並びにlsiパッケージ実装方法 |
JP2009277777A (ja) * | 2008-05-13 | 2009-11-26 | Tamura Seisakusho Co Ltd | はんだボール搭載方法及び電子部品実装用部材 |
JP2011054649A (ja) * | 2009-08-31 | 2011-03-17 | Ihi Corp | 電子装置の製造方法及び電子装置 |
WO2012132880A1 (ja) * | 2011-03-25 | 2012-10-04 | 株式会社村田製作所 | セラミック多層基板 |
CN103460818A (zh) * | 2011-03-25 | 2013-12-18 | 株式会社村田制作所 | 陶瓷多层基板 |
JPWO2012132880A1 (ja) * | 2011-03-25 | 2014-07-28 | 株式会社村田製作所 | セラミック多層基板 |
JP5590223B2 (ja) * | 2011-03-25 | 2014-09-17 | 株式会社村田製作所 | セラミック多層基板 |
US9681534B2 (en) | 2011-03-25 | 2017-06-13 | Murata Manufacturing Co., Ltd. | Ceramic multilayer substrate |
WO2015011753A1 (ja) * | 2013-07-22 | 2015-01-29 | 富士機械製造株式会社 | 部品装着検査装置 |
JPWO2015011753A1 (ja) * | 2013-07-22 | 2017-03-02 | 富士機械製造株式会社 | 部品装着検査装置 |
Also Published As
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US20090166069A1 (en) | 2009-07-02 |
JP4040644B2 (ja) | 2008-01-30 |
TWI330056B (en) | 2010-09-01 |
EP1912484A1 (en) | 2008-04-16 |
CN101233793A (zh) | 2008-07-30 |
EP1912484A4 (en) | 2009-12-30 |
WO2007013365A1 (ja) | 2007-02-01 |
CN101233793B (zh) | 2012-10-24 |
TW200742512A (en) | 2007-11-01 |
KR20080027398A (ko) | 2008-03-26 |
KR100982183B1 (ko) | 2010-09-14 |
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