JP2007027551A - Icチップ実装方法 - Google Patents
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- JP2007027551A JP2007027551A JP2005209971A JP2005209971A JP2007027551A JP 2007027551 A JP2007027551 A JP 2007027551A JP 2005209971 A JP2005209971 A JP 2005209971A JP 2005209971 A JP2005209971 A JP 2005209971A JP 2007027551 A JP2007027551 A JP 2007027551A
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75821—Upper part of the bonding apparatus, i.e. bonding head
- H01L2224/75822—Rotational mechanism
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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Abstract
【解決手段】ベース13への搭載面とは反対側の面がテープ30でマウントされダイシングによりテープ30を残してICチップ11ごとに分離されたウェハ10を用意し、ウェハ10上のICチップ11を順次に第1のローラ51に押し当てて吸着させ、第1のローラ51上に吸着されたICチップ11を順次に第2のローラ52に受け渡し、第2のローラ52上のICチップ11を、走行するベース13上に順次に搭載する。
【選択図】 図3
Description
ベースへの搭載面とは反対側の面がテープでマウントされダイシングによりテープを残してICチップごとに分離されたウェハを用意し、
前記ウェハ上のICチップを順次に第1のローラに押し当てて吸着させ、
前記第1のローラ上に吸着されたICチップを順次に第2のローラに受け渡し、
前記第2のローラ上のICチップを、走行するベース上に順次に搭載することを特徴とする。
第1のローラ上に吸着されたICチップを、第2のローラ上で、ベース上の、ICチップの、互いに隣接する実装位置どうしの間隔と同一の間隔で配置されるように、第2のローラに受け渡すことが好ましい。
11 ICチップ
12 アンテナ
13 ベース
30 テープ
31 押上げ冶具
32 ピッキング冶具
33 ボンディングヘッド
34 加熱加圧冶具
51 第1のローラ
52 第2のローラ
Claims (3)
- ベース上に複数のICチップを実装するICチップ実装方法において、
ベースへの搭載面とは反対側の面がテープでマウントされダイシングにより該テープを残してICチップごとに分離されたウェハを用意し、
前記ウェハ上のICチップを順次に第1のローラに押し当てて吸着させ、
前記第1のローラ上に吸着されたICチップを順次に第2のローラに受け渡し、
前記第2のローラ上のICチップを、走行するベース上に順次に搭載することを特徴とするICチップ実装方法。 - 前記第2のローラを前記ベースの走行速度と同一の表面速度で回転させ、
前記第1のローラ上に吸着されたICチップを、前記第2のローラ上で、前記ベース上の、ICチップの、互いに隣接する実装位置どうしの間隔と同一の間隔で配置されるように、該第2のローラに受け渡すことを特徴とする請求項1記載のICチップ実装方法。 - 通信用のアンテナが所定間隔で複数形成されたベースを用意しておき、
前記アンテナを介して無線通信を行なう回路が搭載されたICチップを、前記ベース上の、前記アンテナに接続される各位置に順次搭載することを特徴とする請求項1記載のICチップ実装方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005209971A JP4616719B2 (ja) | 2005-07-20 | 2005-07-20 | Icチップ実装方法 |
TW094144239A TWI304945B (en) | 2005-07-20 | 2005-12-14 | Ic chip mounting method |
EP05257724A EP1746636A1 (en) | 2005-07-20 | 2005-12-15 | IC chip mounting method |
KR1020060000995A KR100691554B1 (ko) | 2005-07-20 | 2006-01-04 | Ic 칩 실장 방법 |
US11/324,600 US7595219B2 (en) | 2005-07-20 | 2006-01-04 | IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling base |
CNB2006100057683A CN100428434C (zh) | 2005-07-20 | 2006-01-06 | Ic芯片安装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005209971A JP4616719B2 (ja) | 2005-07-20 | 2005-07-20 | Icチップ実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007027551A true JP2007027551A (ja) | 2007-02-01 |
JP4616719B2 JP4616719B2 (ja) | 2011-01-19 |
Family
ID=37402747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005209971A Expired - Fee Related JP4616719B2 (ja) | 2005-07-20 | 2005-07-20 | Icチップ実装方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7595219B2 (ja) |
EP (1) | EP1746636A1 (ja) |
JP (1) | JP4616719B2 (ja) |
KR (1) | KR100691554B1 (ja) |
CN (1) | CN100428434C (ja) |
TW (1) | TWI304945B (ja) |
Cited By (6)
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CN105210171A (zh) * | 2012-10-30 | 2015-12-30 | 希百特股份有限公司 | 显示器和发光面板中的保留了相邻关系的led裸片分散 |
WO2017163775A1 (ja) * | 2016-03-25 | 2017-09-28 | 株式会社写真化学 | デバイスチップを用いた電子デバイスの製造方法およびその製造装置 |
JP2018064113A (ja) * | 2017-12-15 | 2018-04-19 | 株式会社写真化学 | デバイスチップを用いた電子デバイスの製造装置 |
JP2018190970A (ja) * | 2017-05-10 | 2018-11-29 | パロ アルト リサーチ センター インコーポレイテッド | 高位置合わせ粒子転写システム |
JP2021108372A (ja) * | 2016-06-29 | 2021-07-29 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | マイクロデバイスの移動のためのシステム及び方法 |
JP6978129B1 (ja) * | 2021-03-18 | 2021-12-08 | 株式会社写真化学 | デバイスチップの移載機構 |
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CN101409240B (zh) * | 2008-03-21 | 2010-09-08 | 北京德鑫泉科技发展有限公司 | 可使用芯片的智能标签及倒装芯片模块生产设备 |
CN101925989B (zh) * | 2008-10-14 | 2012-07-04 | 德州仪器公司 | 用于半导体封装的滚压囊封方法 |
US9077074B2 (en) | 2012-10-11 | 2015-07-07 | Blackberry Limited | Antenna wrapped around to speaker lid |
KR20160048301A (ko) * | 2014-10-23 | 2016-05-04 | 삼성전자주식회사 | 본딩 장치 및 그를 포함하는 기판 제조 설비 |
CN104752283B (zh) * | 2015-04-07 | 2018-02-13 | 嘉兴景焱智能装备技术有限公司 | 芯片倒装装置 |
JP6582975B2 (ja) * | 2015-12-28 | 2019-10-02 | 富士通株式会社 | 半導体実装装置、半導体実装装置のヘッド及び積層チップの製造方法 |
GB2549250B (en) | 2016-02-15 | 2021-06-30 | Pragmatic Printing Ltd | Apparatus and method for manufacturing plurality of electronic circuits |
KR102417917B1 (ko) * | 2016-04-26 | 2022-07-07 | 삼성전자주식회사 | 공정 시스템 및 그 동작 방법 |
DE102016115186A1 (de) * | 2016-08-16 | 2018-02-22 | Osram Opto Semiconductors Gmbh | Verfahren zum Montieren von Halbleiterchips und Vorrichtung zum Übertragen von Halbleiterchips |
GB2563600B (en) * | 2017-06-19 | 2022-05-11 | Pragmatic Printing Ltd | Apparatus and method for manufacturing plurality of electronic circuits |
KR101969555B1 (ko) * | 2017-08-18 | 2019-04-16 | 주식회사 한라정밀엔지니어링 | 반도체 칩 분리 장치 및 반도체 칩 분리 방법 |
TWI690980B (zh) * | 2018-12-07 | 2020-04-11 | 台灣愛司帝科技股份有限公司 | 晶片移轉方法及晶片移轉設備 |
CN109407367B (zh) * | 2019-01-07 | 2021-09-28 | 京东方科技集团股份有限公司 | 一种面光源的打件装置及其打件方法 |
AR118939A1 (es) * | 2020-05-15 | 2021-11-10 | Marisa Rosana Lattanzi | Máquina combinada para elaborar separadores laminares de productos que se contienen en cajas y cajones |
US20220059406A1 (en) * | 2020-08-21 | 2022-02-24 | Advanced Semiconductor Engineering, Inc. | Method for manufacturing semiconductor package |
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JP2003030614A (ja) * | 2001-07-11 | 2003-01-31 | Toppan Printing Co Ltd | 非接触方式icチップの装着方法と該装着方法を用いて作製したicチップを装着した包装材料 |
JP2005149130A (ja) * | 2003-11-14 | 2005-06-09 | Dainippon Printing Co Ltd | 非接触icタグ付シートの製造方法および製造装置 |
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- 2005-12-15 EP EP05257724A patent/EP1746636A1/en not_active Withdrawn
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Also Published As
Publication number | Publication date |
---|---|
EP1746636A1 (en) | 2007-01-24 |
JP4616719B2 (ja) | 2011-01-19 |
CN100428434C (zh) | 2008-10-22 |
KR100691554B1 (ko) | 2007-03-12 |
TWI304945B (en) | 2009-01-01 |
KR20070011065A (ko) | 2007-01-24 |
US20070020801A1 (en) | 2007-01-25 |
TW200705281A (en) | 2007-02-01 |
US7595219B2 (en) | 2009-09-29 |
CN1901148A (zh) | 2007-01-24 |
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