CN101409240B - 可使用芯片的智能标签及倒装芯片模块生产设备 - Google Patents
可使用芯片的智能标签及倒装芯片模块生产设备 Download PDFInfo
- Publication number
- CN101409240B CN101409240B CN2008101024582A CN200810102458A CN101409240B CN 101409240 B CN101409240 B CN 101409240B CN 2008101024582 A CN2008101024582 A CN 2008101024582A CN 200810102458 A CN200810102458 A CN 200810102458A CN 101409240 B CN101409240 B CN 101409240B
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- chip
- holding box
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- vision system
- intelligent label
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000005540 biological transmission Effects 0.000 claims description 6
- 239000012780 transparent material Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 5
- 238000012797 qualification Methods 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 2
- 238000000018 DNA microarray Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002493 microarray Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/759—Means for monitoring the connection process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Labeling Devices (AREA)
Abstract
Description
Claims (5)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008101024582A CN101409240B (zh) | 2008-03-21 | 2008-03-21 | 可使用芯片的智能标签及倒装芯片模块生产设备 |
PCT/CN2008/071566 WO2009114973A1 (zh) | 2008-03-21 | 2008-07-07 | 可使用芯片的智能标签及倒装芯片模块生产设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008101024582A CN101409240B (zh) | 2008-03-21 | 2008-03-21 | 可使用芯片的智能标签及倒装芯片模块生产设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101409240A CN101409240A (zh) | 2009-04-15 |
CN101409240B true CN101409240B (zh) | 2010-09-08 |
Family
ID=40572166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101024582A Active CN101409240B (zh) | 2008-03-21 | 2008-03-21 | 可使用芯片的智能标签及倒装芯片模块生产设备 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101409240B (zh) |
WO (1) | WO2009114973A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102602700A (zh) * | 2012-03-12 | 2012-07-25 | 北京德鑫泉物联网科技股份有限公司 | 阵列式取放装置及取放方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102034717A (zh) * | 2010-09-21 | 2011-04-27 | 深圳市卡的智能科技有限公司 | 射频卡封装方法 |
CN102528800A (zh) * | 2012-01-18 | 2012-07-04 | 苏州光宝康电子有限公司 | 新型旋转机械手 |
CN105470173B (zh) * | 2015-12-15 | 2018-08-14 | 上海微电子装备(集团)股份有限公司 | 一种芯片接合系统及方法 |
CN108511329B (zh) * | 2018-06-15 | 2024-03-15 | 德阳帛汉电子有限公司 | 一种芯片清洗装置 |
CN109103134B (zh) * | 2018-09-01 | 2021-07-30 | 余晓飞 | 芯片的标签流水化制备设备 |
CN109300807B (zh) * | 2018-09-10 | 2023-11-14 | 佛山市南海区鑫来智能电子有限公司 | 一种芯片滴胶装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101051357A (zh) * | 2007-05-11 | 2007-10-10 | 北京德鑫泉科技发展有限公司 | 具有视觉、点胶及填装功能的智能填装头 |
CN101051358A (zh) * | 2007-05-23 | 2007-10-10 | 北京德鑫泉科技发展有限公司 | 智能标签及其覆胶方法和装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT414077B (de) * | 2001-08-14 | 2006-08-15 | Datacon Semiconductor Equip | Verfahren und einrichtung zur positionsveränderung von elektronischen bauteilen |
TW200504809A (en) * | 2003-06-12 | 2005-02-01 | Matrics Inc | Method and system for high volume transfer of dies to substrates |
CN1674046A (zh) * | 2004-03-23 | 2005-09-28 | 艾迪讯科技股份有限公司 | 射频识别电子标签芯片封装方法 |
JP2006031336A (ja) * | 2004-07-15 | 2006-02-02 | Fujitsu Ltd | Rfidタグの製造方法 |
JP4616719B2 (ja) * | 2005-07-20 | 2011-01-19 | 富士通株式会社 | Icチップ実装方法 |
FR2892842B1 (fr) * | 2005-10-28 | 2008-02-15 | Oberthur Card Syst Sa | Procede de fabrication d'une pluralite de cartes a microcircuit |
US7828217B2 (en) * | 2006-03-27 | 2010-11-09 | Muhlbauer Ag | Method and device for producing RFID smart labels or smart label inlays |
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2008
- 2008-03-21 CN CN2008101024582A patent/CN101409240B/zh active Active
- 2008-07-07 WO PCT/CN2008/071566 patent/WO2009114973A1/zh active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101051357A (zh) * | 2007-05-11 | 2007-10-10 | 北京德鑫泉科技发展有限公司 | 具有视觉、点胶及填装功能的智能填装头 |
CN101051358A (zh) * | 2007-05-23 | 2007-10-10 | 北京德鑫泉科技发展有限公司 | 智能标签及其覆胶方法和装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102602700A (zh) * | 2012-03-12 | 2012-07-25 | 北京德鑫泉物联网科技股份有限公司 | 阵列式取放装置及取放方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2009114973A1 (zh) | 2009-09-24 |
CN101409240A (zh) | 2009-04-15 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Intelligent label capable of using chip and equipment for producing flip-chip module Effective date of registration: 20110518 Granted publication date: 20100908 Pledgee: Beijing's first investment Company Limited by Guarantee Pledgor: GOLDEN SPRING INTERNET OF THINGS Inc. Registration number: 2011990000181 |
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Date of cancellation: 20120625 Granted publication date: 20100908 Pledgee: Beijing's first investment Company Limited by Guarantee Pledgor: GOLDEN SPRING INTERNET OF THINGS Inc. Registration number: 2011990000181 |
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Denomination of invention: Intelligent label capable of using chip and equipment for producing flip-chip module Effective date of registration: 20171113 Granted publication date: 20100908 Pledgee: China Co. truction Bank Corp Beijing Zhongguancun branch Pledgor: GOLDEN SPRING INTERNET OF THINGS Inc. Registration number: 2017990001047 |
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Date of cancellation: 20190308 Granted publication date: 20100908 Pledgee: China Co. truction Bank Corp Beijing Zhongguancun branch Pledgor: GOLDEN SPRING INTERNET OF THINGS Inc. Registration number: 2017990001047 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Intelligent label capable of using chip and equipment for producing flip-chip module Effective date of registration: 20190308 Granted publication date: 20100908 Pledgee: China Co. truction Bank Corp Beijing Zhongguancun branch Pledgor: GOLDEN SPRING INTERNET OF THINGS Inc. Registration number: 2019990000191 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
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Date of cancellation: 20220701 Granted publication date: 20100908 Pledgee: China Co. truction Bank Corp Beijing Zhongguancun branch Pledgor: GOLDEN SPRING INTERNET OF THINGS Inc. Registration number: 2019990000191 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Smart tags and flip chip module production equipment that can use chips Effective date of registration: 20230808 Granted publication date: 20100908 Pledgee: China Construction Bank Corporation Beijing Economic and Technological Development Zone sub branch Pledgor: GOLDEN SPRING INTERNET OF THINGS Inc. Registration number: Y2023980051299 |
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