JP2006526687A5 - - Google Patents

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Publication number
JP2006526687A5
JP2006526687A5 JP2006509974A JP2006509974A JP2006526687A5 JP 2006526687 A5 JP2006526687 A5 JP 2006526687A5 JP 2006509974 A JP2006509974 A JP 2006509974A JP 2006509974 A JP2006509974 A JP 2006509974A JP 2006526687 A5 JP2006526687 A5 JP 2006526687A5
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Japan
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thermal interface
foamed
interface material
film
foam
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JP2006509974A
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Japanese (ja)
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JP4773339B2 (ja
JP2006526687A (ja
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Priority claimed from US10/449,679 external-priority patent/US7744991B2/en
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Publication of JP2006526687A5 publication Critical patent/JP2006526687A5/ja
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Publication of JP4773339B2 publication Critical patent/JP4773339B2/ja
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JP2006509974A 2003-05-30 2004-04-14 熱伝導性発泡体インターフェース材料 Expired - Fee Related JP4773339B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/449,679 US7744991B2 (en) 2003-05-30 2003-05-30 Thermally conducting foam interface materials
US10/449,679 2003-05-30
PCT/US2004/011355 WO2004108851A1 (en) 2003-05-30 2004-04-14 Thermally conductive foam interface materials

Publications (3)

Publication Number Publication Date
JP2006526687A JP2006526687A (ja) 2006-11-24
JP2006526687A5 true JP2006526687A5 (https=) 2009-10-22
JP4773339B2 JP4773339B2 (ja) 2011-09-14

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JP2006509974A Expired - Fee Related JP4773339B2 (ja) 2003-05-30 2004-04-14 熱伝導性発泡体インターフェース材料

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US (2) US7744991B2 (https=)
EP (1) EP1631636A1 (https=)
JP (1) JP4773339B2 (https=)
KR (1) KR101110965B1 (https=)
CN (1) CN1798816A (https=)
WO (1) WO2004108851A1 (https=)

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