JP2006526687A5 - - Google Patents

Download PDF

Info

Publication number
JP2006526687A5
JP2006526687A5 JP2006509974A JP2006509974A JP2006526687A5 JP 2006526687 A5 JP2006526687 A5 JP 2006526687A5 JP 2006509974 A JP2006509974 A JP 2006509974A JP 2006509974 A JP2006509974 A JP 2006509974A JP 2006526687 A5 JP2006526687 A5 JP 2006526687A5
Authority
JP
Japan
Prior art keywords
thermal interface
foamed
interface material
film
foam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006509974A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006526687A (ja
JP4773339B2 (ja
Filing date
Publication date
Priority claimed from US10/449,679 external-priority patent/US7744991B2/en
Application filed filed Critical
Publication of JP2006526687A publication Critical patent/JP2006526687A/ja
Publication of JP2006526687A5 publication Critical patent/JP2006526687A5/ja
Application granted granted Critical
Publication of JP4773339B2 publication Critical patent/JP4773339B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006509974A 2003-05-30 2004-04-14 熱伝導性発泡体インターフェース材料 Expired - Fee Related JP4773339B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/449,679 US7744991B2 (en) 2003-05-30 2003-05-30 Thermally conducting foam interface materials
US10/449,679 2003-05-30
PCT/US2004/011355 WO2004108851A1 (en) 2003-05-30 2004-04-14 Thermally conductive foam interface materials

Publications (3)

Publication Number Publication Date
JP2006526687A JP2006526687A (ja) 2006-11-24
JP2006526687A5 true JP2006526687A5 (https=) 2009-10-22
JP4773339B2 JP4773339B2 (ja) 2011-09-14

Family

ID=33451845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006509974A Expired - Fee Related JP4773339B2 (ja) 2003-05-30 2004-04-14 熱伝導性発泡体インターフェース材料

Country Status (6)

Country Link
US (2) US7744991B2 (https=)
EP (1) EP1631636A1 (https=)
JP (1) JP4773339B2 (https=)
KR (1) KR101110965B1 (https=)
CN (1) CN1798816A (https=)
WO (1) WO2004108851A1 (https=)

Families Citing this family (119)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7744991B2 (en) * 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials
KR100528925B1 (ko) * 2003-09-09 2005-11-15 삼성에스디아이 주식회사 방열시트 및 이를 구비한 플라즈마 디스플레이 장치
JP5068919B2 (ja) * 2003-09-25 2012-11-07 スリーエム イノベイティブ プロパティズ カンパニー 発泡シート形成性組成物、熱伝導性発泡シート及びその製造方法
KR20060127049A (ko) * 2003-12-18 2006-12-11 제온 코포레이션 열전도성 감압 접착제 조성물, 열전도성 발포 시트상성형체 및 그 제조 방법
DE20321638U1 (de) * 2003-12-23 2008-10-02 Lohmann Gmbh & Co. Kg Dichtungsband zur Klebung von Dampfsperren- und Dampfbremsfolien
US20100326645A1 (en) * 2004-01-21 2010-12-30 Wei Fan Thermal pyrolytic graphite laminates with vias
US20050167194A1 (en) * 2004-02-03 2005-08-04 Arner Investments Inc Accoustical Absorption Coating and Process
KR100564620B1 (ko) * 2004-03-31 2006-03-29 삼성전자주식회사 열방출 특성을 개선한 메모리 모듈, 메모리 모듈용 소켓및 이를 이용한 메모리 모듈용 소켓 사용방법
TWM261006U (en) * 2004-05-28 2005-04-01 Au Optronics Corp Heatsink sheet of optic-electric apparatus
JP2006213845A (ja) * 2005-02-04 2006-08-17 Nippon Zeon Co Ltd 熱伝導性感圧接着性シート状発泡成形体及びその製造方法
US20060228542A1 (en) * 2005-04-08 2006-10-12 Saint-Gobain Performance Plastics Corporation Thermal interface material having spheroidal particulate filler
KR100700346B1 (ko) * 2005-08-05 2007-03-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 기능성을 갖는 방열 점착테이프
WO2007059264A2 (en) * 2005-11-16 2007-05-24 P.H. Glatfelter Company Marine flexible laminate system
JP4206501B2 (ja) * 2006-03-01 2009-01-14 ヤスハラケミカル株式会社 熱伝導性ホットメルト接着剤組成物
JP5004538B2 (ja) * 2006-09-12 2012-08-22 日立化成ポリマー株式会社 熱伝導性湿気硬化型接着剤、及びその施工方法
JP4884180B2 (ja) * 2006-11-21 2012-02-29 東京エレクトロン株式会社 基板処理装置および基板処理方法
DE102006062247A1 (de) * 2006-12-22 2008-06-26 Tesa Ag Klebschicht für eine blasenfreie Verklebung
US7579686B2 (en) * 2006-12-29 2009-08-25 Intel Corporation Thermal interface material with hotspot heat remover
TWI371833B (en) * 2007-05-24 2012-09-01 Advanced Semiconductor Eng Package structure and electronic device using the same
KR100945039B1 (ko) * 2007-06-25 2010-03-05 (주)해은켐텍 고온 발포시트를 이용한 연성회로기판의 제조방법
US7965506B1 (en) * 2007-08-22 2011-06-21 Nvidia Corporation Heat sink apparatus and method for allowing air to flow directly to an integrated circuit package thereunder
US8545987B2 (en) * 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
JP2009263542A (ja) * 2008-04-25 2009-11-12 Three M Innovative Properties Co （メタ）アクリル系粘着性発泡体及びその製造方法
DE102009001145A1 (de) * 2009-02-25 2010-09-09 Leibniz-Institut Für Polymerforschung Dresden E.V. Verfahren zur Aushärtung und Oberflächenfunktionalisierung von Formteilen
DE102009015233A1 (de) * 2009-04-01 2010-10-14 Tesa Se Verfahren zur Herstellung eines geschäumten Massesystems
MX2011008921A (es) * 2009-05-05 2011-11-18 Parker Hannifin Corp Producto de espuma termicamente conductor.
KR101266195B1 (ko) 2009-09-16 2013-05-21 주식회사 엘지화학 양면 점착 테이프, 그 제조 방법 및 터치 패널
WO2011084804A2 (en) * 2009-12-21 2011-07-14 Saint-Gobain Performance Plastics Corporation Thermally conductive foam material
US20140183403A1 (en) 2012-12-27 2014-07-03 Peterson Chemical Technology, Inc. Increasing the Heat Flow of Flexible Cellular Foam Through the Incorporation of Highly Thermally Conductive Solids
US20110265973A1 (en) * 2010-05-03 2011-11-03 Scalia Jr William Henry Passive Heat Exchanger Comprising Thermally Conductive Foam
WO2012044528A1 (en) * 2010-09-30 2012-04-05 3M Innovative Properties Company Hot melt processable pressure sensitive adhesives containing fibrous materials
US20120085391A1 (en) * 2010-10-06 2012-04-12 Uday Varde Structure and method for mounting a photovoltaic material
DE102010062669A1 (de) * 2010-12-08 2012-06-14 Tesa Se Verfahren zur Herstellung geschäumter Polymermassen, geschäumte Polymermassen und Klebeband damit
US10347559B2 (en) 2011-03-16 2019-07-09 Momentive Performance Materials Inc. High thermal conductivity/low coefficient of thermal expansion composites
DE102012000907B4 (de) * 2012-01-19 2025-01-02 Sew-Eurodrive Gmbh & Co Kg Elektrogerät
CN104640954B (zh) 2012-04-13 2017-05-17 3M创新有限公司 压敏粘合剂泡沫和由其制得的制品
US9205605B2 (en) 2012-04-25 2015-12-08 Textron Innovations Inc. Multi-function detection liner for manufacturing of composites
EP2669073A1 (de) * 2012-05-29 2013-12-04 Basf Se Verfahren zur Herstellung von zumindest zweilagigen Schaumstoffplatten durch Verkleben
US20130344712A1 (en) * 2012-06-22 2013-12-26 Apple Inc. Interconnections between flexible and rigid components
US9606587B2 (en) * 2012-10-26 2017-03-28 Google Inc. Insulator module having structure enclosing atomspheric pressure gas
DE102012223515A1 (de) * 2012-12-18 2014-06-18 Hilti Aktiengesellschaft Dämmschichtbildende Zusammensetzung und deren Verwendung
US9520378B2 (en) * 2012-12-21 2016-12-13 Intel Corporation Thermal matched composite die
CN103398305B (zh) * 2013-07-25 2015-11-25 宁波市爱使电器有限公司 一种高密封高散热的led灯
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
US10174433B2 (en) 2013-12-05 2019-01-08 Honeywell International Inc. Stannous methanesulfonate solution with adjusted pH
US9826662B2 (en) * 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
TWI657132B (zh) 2013-12-19 2019-04-21 Henkel IP & Holding GmbH 具有基質及經密封相變材料分散於其中之組合物及以其組裝之電子裝置
US20150218425A1 (en) * 2014-02-05 2015-08-06 Apple Inc. Stretch release conductive adhesive
WO2016004565A1 (en) 2014-07-07 2016-01-14 Honeywell International Inc. Thermal interface material with ion scavenger
EP2975096B1 (en) * 2014-07-17 2021-11-17 3M Innovative Properties Company Pressure sensitive adhesive assembly suitable for bonding to uneven substrates
EP2975097B1 (en) * 2014-07-17 2022-03-09 3M Innovative Properties Company Pressure sensitive adhesive assembly comprising thermoplastic filler material
US9442514B1 (en) 2014-07-23 2016-09-13 Google Inc. Graphite layer between carbon layers
JP6542891B2 (ja) 2014-12-05 2019-07-10 ハネウェル・インターナショナル・インコーポレーテッドＨｏｎｅｙｗｅｌｌ Ｉｎｔｅｒｎａｔｉｏｎａｌ Ｉｎｃ． 低い熱インピーダンスを有する高性能熱界面材料
WO2016103783A1 (ja) * 2014-12-26 2016-06-30 リンテック株式会社 熱伝導性接着シート、その製造方法及びそれを用いた電子デバイス
CN107429136B (zh) 2015-02-27 2020-07-17 3M创新有限公司 双面涂布胶带
ES2914973T3 (es) * 2015-03-05 2022-06-20 Henkel Ag & Co Kgaa Adhesivo termoconductor
DE102015206076A1 (de) * 2015-04-02 2016-10-06 Tesa Se Wiederablösbarer Haftklebestreifen
EP3581630B1 (de) * 2015-04-02 2021-07-14 tesa SE Wiederablösbarer haftklebestreifen
CN106158790B (zh) * 2015-04-10 2018-11-16 台达电子工业股份有限公司 功率模块及其热界面结构
US10155896B2 (en) 2015-06-30 2018-12-18 Laird Technologies, Inc. Thermal interface materials with low secant modulus of elasticity and high thermal conductivity
US10692797B2 (en) 2015-06-30 2020-06-23 Laird Technologies, Inc. Thermal interface materials with low secant modulus of elasticity and high thermal conductivity
US9828539B2 (en) 2015-06-30 2017-11-28 Laird Technologies, Inc. Thermal interface materials with low secant modulus of elasticity and high thermal conductivity
EP3127973B1 (en) * 2015-08-07 2019-04-03 3M Innovative Properties Company Thermally conductive pressure sensitive adhesive
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN105349063B (zh) * 2015-12-03 2017-08-04 杭州汉高新材料科技有限公司 汽车热熔发泡压敏胶及其制造方法
JP6786221B2 (ja) * 2016-01-28 2020-11-18 日東電工株式会社 粘着シート
US10781349B2 (en) 2016-03-08 2020-09-22 Honeywell International Inc. Thermal interface material including crosslinker and multiple fillers
JP2017183617A (ja) * 2016-03-31 2017-10-05 積水化学工業株式会社 発泡複合シート
CN107525424B (zh) * 2016-06-21 2020-11-20 株式会社西部技研 热交换器及其制造方法
US10741519B2 (en) 2016-07-11 2020-08-11 Laird Technologies, Inc. Systems of applying materials to components
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
JP6769801B2 (ja) * 2016-09-21 2020-10-14 日東電工株式会社 発泡部材、電気電子機器、及び発泡体の製造方法
KR101832938B1 (ko) 2016-11-18 2018-03-23 대준이앤씨 주식회사 건축물의 온도감응형 내·외벽 패널
JP6620736B2 (ja) * 2016-12-28 2019-12-18 トヨタ自動車株式会社 複合材料およびその製造方法
CN110313056B (zh) * 2017-01-17 2024-02-20 莱尔德技术股份有限公司 可压缩发泡热界面材料及其制备方法和使用方法
KR101919906B1 (ko) * 2017-02-16 2018-11-19 한국과학기술원 생체 모방형 고신축성 전도성 건식 접착 패치, 이의 제조 방법 및 이를 포함하는 웨어러블 기기
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10385469B2 (en) * 2017-09-11 2019-08-20 Toyota Motor Engineering & Manufacturing North America, Inc. Thermal stress compensation bonding layers and power electronics assemblies incorporating the same
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11732104B2 (en) 2017-11-16 2023-08-22 3M Innovative Properties Company Polymer matrix composites comprising dielectric particles and methods of making the same
US10913834B2 (en) 2017-11-16 2021-02-09 3M Innovative Properties Company Polymer matrix composites comprising indicator particles and methods of making the same
WO2019097445A1 (en) 2017-11-16 2019-05-23 3M Innovative Properties Company Polymer matrix composites comprising thermally conductive particles and methods of making the same
US10927228B2 (en) 2017-11-16 2021-02-23 3M Innovative Properties Company Polymer matrix composites comprising intumescent particles and methods of making the same
WO2019097446A1 (en) 2017-11-16 2019-05-23 3M Innovative Properties Company Polymer matrix composites comprising functional particles and methods of making the same
US10836873B2 (en) 2017-11-16 2020-11-17 3M Innovative Properties Company Polymer matrix composites comprising thermally insulating particles and methods of making the same
KR102722514B1 (ko) 2017-11-16 2024-10-29 쓰리엠 이노베이티브 프로퍼티즈 캄파니 중합체 매트릭스 복합재의 제조 방법
CN108342168B (zh) * 2017-12-26 2020-08-07 苏州环明电子科技有限公司 一种导热压敏胶带及其制备方法和使用方法
WO2019136151A2 (en) * 2018-01-05 2019-07-11 Neograf Solutions, Llc Thermal interface material
US10741471B2 (en) * 2018-01-19 2020-08-11 Laird Technologies, Inc. Highly compliant non-silicone putties and thermal interface materials including the same
DE102018101453A1 (de) * 2018-01-23 2019-07-25 Borgwarner Ludwigsburg Gmbh Heizvorrichtung und Verfahren zum Herstellung eines Heizstabes
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US11141823B2 (en) * 2018-04-28 2021-10-12 Laird Technologies, Inc. Systems and methods of applying materials to components
US11193016B2 (en) 2018-05-09 2021-12-07 3M Innovative Properties Company Curable and cured compositions
WO2019239267A1 (en) 2018-06-14 2019-12-19 3M Innovative Properties Company Method of treating a surface, surface-modified abrasive particles, and resin-bond abrasive articles
US11168237B2 (en) 2018-06-14 2021-11-09 3M Innovative Properties Company Adhesion promoters for curable compositions
CN109112855A (zh) * 2018-07-03 2019-01-01 绍兴百立盛新材料科技有限公司 一种具有降温效果的印花浆料及其制备方法和应用
EP3830175B1 (en) 2018-07-30 2022-06-15 3M Innovative Properties Company Foams and methods of making
US10672679B2 (en) * 2018-08-31 2020-06-02 Micron Technology, Inc. Heat spreaders for multiple semiconductor device modules
WO2020053826A1 (en) * 2018-09-13 2020-03-19 3M Innovative Properties Company Foam compositions and methods of making same
CA3123036A1 (en) 2018-12-20 2020-06-25 Stijn COERTJENS Adhesive with high filler content
US11505143B2 (en) * 2019-02-27 2022-11-22 Ford Global Technologies, Llc Supercapacitor mounting assemblies and vehicle mounting locations
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN113825790A (zh) * 2019-05-15 2021-12-21 3M创新有限公司 包含导热颗粒和吸热颗粒的(共)聚合物基质复合材料及其制备方法
CN113840867A (zh) * 2019-05-15 2021-12-24 3M创新有限公司 包含导热颗粒和膨胀颗粒的(共)聚合物基质复合材料及其制备方法
US11483948B2 (en) * 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
EP4077459B1 (en) 2019-12-19 2026-04-08 3M Innovative Properties Company Two-part compositions including a uretdione-containing material and inorganic filler, products, and methods
JP6884456B1 (ja) * 2020-02-21 2021-06-09 積水ポリマテック株式会社 熱伝導性シート及びその製造方法
US20230066746A1 (en) * 2020-03-13 2023-03-02 Ddp Specialty Electronic Materials Us, Llc Thermal interface material comprising magnesium hydroxide
US11814566B2 (en) * 2020-07-13 2023-11-14 L&P Property Management Company Thermally conductive nanomaterials in flexible foam
US11597862B2 (en) 2021-03-10 2023-03-07 L&P Property Management Company Thermally conductive nanomaterial coatings on flexible foam or fabrics
CN113444363B (zh) * 2021-07-16 2023-03-10 福建三盛实业有限公司 一种tpe超临界微孔发泡物及其制备方法
US20230160646A1 (en) * 2021-11-19 2023-05-25 Amulaire Thermal Technology, Inc. Immersion heat dissipation structure
CN114889508A (zh) * 2022-06-28 2022-08-12 安徽梵齐诺拒火材料开发有限公司 隔温座椅垫
CN115284650A (zh) * 2022-08-03 2022-11-04 苏州丰连实业有限公司 一种采用碳捕捉技术制备的微孔片材及设备
TWI878798B (zh) * 2023-02-17 2025-04-01 康銘實業股份有限公司 具有熱阻絕與助燃氣體阻絕功能的複合材料
CN116715925A (zh) * 2023-07-25 2023-09-08 国网智能电网研究院有限公司 一种橡胶隔振垫及其制备方法和应用
CN117374029A (zh) * 2023-12-07 2024-01-09 深圳平创半导体有限公司 具有双面散热结构的碳化硅器件、方法及车辆电驱装置

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE24906E (en) 1955-11-18 1960-12-13 Pressure-sensitive adhesive sheet material
US3692679A (en) * 1970-06-18 1972-09-19 Ethyl Corp Stabilized organic material
US4059714A (en) * 1976-08-02 1977-11-22 Nordson Corporation Hot melt thermoplastic adhesive foam system
US4234662A (en) * 1979-04-26 1980-11-18 National Starch And Chemical Corporation Pressure sensitive hot melt adhesive curable by exposure to electron beam radiation
US4310509A (en) * 1979-07-31 1982-01-12 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive having a broad spectrum antimicrobial therein
US4323557A (en) * 1979-07-31 1982-04-06 Minnesota Mining & Manufacturing Company Pressure-sensitive adhesive containing iodine
US4361663A (en) * 1981-11-09 1982-11-30 Exxon Research And Engineering Co. Pressure sensitive adhesive compositions
US4472480A (en) * 1982-07-02 1984-09-18 Minnesota Mining And Manufacturing Company Low surface energy liner of perfluoropolyether
US4606962A (en) * 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
US4851278A (en) * 1986-08-11 1989-07-25 Minnesota Mining And Manufacturing Company Acrylate hot melt adhesive containing zinc carboxylate
US5187235A (en) * 1986-10-08 1993-02-16 Avery Dennison Corporation Energy-curable acrylic pressure-sensitive adhesives
US5100728A (en) * 1987-07-01 1992-03-31 Avery Dennison Corporation High performance pressure sensitive adhesive tapes and process for making the same
DE3828400A1 (de) * 1988-08-20 1990-03-08 Basf Ag Strahlenvernetzbare haftklebegemische
DE3942232A1 (de) * 1989-12-21 1991-06-27 Beiersdorf Ag Schmelzhaftkleber auf acrylatbasis
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
US5429856A (en) * 1990-03-30 1995-07-04 Minnesota Mining And Manufacturing Company Composite materials and process
US5232970A (en) * 1990-08-31 1993-08-03 The Dow Chemical Company Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications
EP0511162A1 (de) * 1991-04-24 1992-10-28 Ciba-Geigy Ag Wärmeleitende Klebfilme, Laminate mit wärmeleitenden Klebschichten und deren Verwendung
CA2093191A1 (en) 1992-04-15 1993-10-16 Richard J. Webb Psa containing thermally conductive, electrically insulative particles and a transfer tape from this psa
US5539033A (en) * 1992-11-06 1996-07-23 Minnesota Mining And Manufacturing Company Solventless compounding and coating of non-thermoplastic hydrocarbon elastomers
US5416127A (en) * 1993-01-28 1995-05-16 National Starch And Chemical Investment Holding Corporation Radiation curable hot melt pressure sensitive adhesives
KR960007660A (ko) * 1994-08-12 1996-03-22 아크릴계 시트, 아크릴계 접착시트 및 이들의 제조방법
US5804610A (en) * 1994-09-09 1998-09-08 Minnesota Mining And Manufacturing Company Methods of making packaged viscoelastic compositions
AU723258B2 (en) * 1996-04-29 2000-08-24 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5890915A (en) * 1996-05-17 1999-04-06 Minnesota Mining And Manufacturing Company Electrical and thermal conducting structure with resilient conducting paths
US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
EP0942059B1 (en) 1996-11-29 2004-10-27 Nitto Denko Corporation Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same
US5904796A (en) * 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US6197397B1 (en) * 1996-12-31 2001-03-06 3M Innovative Properties Company Adhesives having a microreplicated topography and methods of making and using same
JPH10316953A (ja) * 1997-05-16 1998-12-02 Nitto Denko Corp 剥離可能な熱伝導性感圧接着剤とその接着シ―ト類
US6432497B2 (en) 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
US6103152A (en) * 1998-07-31 2000-08-15 3M Innovative Properties Co. Articles that include a polymer foam and method for preparing same
US6277488B1 (en) * 1998-10-28 2001-08-21 3M Innovative Properties Company Adhesive composition containing a block copolymer composition and polyphenylene oxide resin and products thereof
DE19851166C2 (de) 1998-11-06 2000-11-30 Hermann Otto Gmbh Verschäumbare, elektrisch- und wärmeleitfähige Dicht- und Klebstoffe, Verfahren zur Herstellung und ihre Verwendung
JP2001284859A (ja) * 2000-03-31 2001-10-12 Jsr Corp 熱伝導性シートおよびその用途
US6630531B1 (en) 2000-02-02 2003-10-07 3M Innovative Properties Company Adhesive for bonding to low surface energy surfaces
JP2001279196A (ja) * 2000-03-30 2001-10-10 Sliontec Corp 無基材熱伝導性粘着テープ・シート及びその製造方法
JP2001291807A (ja) 2000-04-10 2001-10-19 Three M Innovative Properties Co 熱伝導性シート
JP2001311008A (ja) * 2000-04-28 2001-11-09 Three M Innovative Properties Co 熱伝導性シート
JP2001323228A (ja) * 2000-05-15 2001-11-22 Nitto Denko Corp 加熱剥離型粘着シート
JP2002030212A (ja) * 2000-06-29 2002-01-31 Three M Innovative Properties Co 熱伝導性シート
JP2002080817A (ja) 2000-09-04 2002-03-22 Three M Innovative Properties Co 架橋型発泡粘着剤及びその製造方法
JP2002128931A (ja) 2000-10-30 2002-05-09 Sekisui Chem Co Ltd 熱伝導性樹脂シート
JP4584439B2 (ja) * 2000-10-30 2010-11-24 アキレス株式会社 放熱樹脂シート
US6586483B2 (en) * 2001-01-08 2003-07-01 3M Innovative Properties Company Foam including surface-modified nanoparticles
US7078582B2 (en) * 2001-01-17 2006-07-18 3M Innovative Properties Company Stretch removable adhesive articles and methods
US20020164446A1 (en) * 2001-01-17 2002-11-07 Zhiming Zhou Pressure sensitive adhesives with a fibrous reinforcing material
US6780484B2 (en) * 2001-02-02 2004-08-24 3M Innovative Properties Company Adhesive article and method of preparing
JP4660949B2 (ja) * 2001-03-27 2011-03-30 日本ゼオン株式会社 感圧接着性組成物およびそれを用いたシート
JP2002294192A (ja) * 2001-03-29 2002-10-09 Three M Innovative Properties Co 熱伝導性難燃性感圧接着剤及びシート
JP2002317064A (ja) * 2001-04-20 2002-10-31 Sekisui Chem Co Ltd 熱伝導材
US6894204B2 (en) * 2001-05-02 2005-05-17 3M Innovative Properties Company Tapered stretch removable adhesive articles and methods
JP2003049144A (ja) 2001-08-08 2003-02-21 Sekisui Chem Co Ltd 熱伝導性感圧接着剤及び熱伝導性感圧接着シート
US7063887B2 (en) * 2002-02-04 2006-06-20 3M Innovative Properties Company Stretch releasable foams, articles including same and methods for the manufacture thereof
US20030175497A1 (en) 2002-02-04 2003-09-18 3M Innovative Properties Company Flame retardant foams, articles including same and methods for the manufacture thereof
US6866928B2 (en) * 2002-04-08 2005-03-15 3M Innovative Properties Company Cleanly removable tapes and methods for the manufacture thereof
DE10259451A1 (de) 2002-12-19 2004-07-08 Tesa Ag Haftklebeartikel mit wenigstens einer Schicht aus einer thermisch leitfähigen Haftklebemasse und Verfahren zu seiner Herstellung
EP1433829A1 (en) 2002-12-23 2004-06-30 3M Innovative Properties Company Thermally-formable and cross-linkable precursor of a thermally conductive material
US7229683B2 (en) * 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
US7744991B2 (en) * 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials

Similar Documents

Publication Publication Date Title
JP2006526687A5 (https=)
TW549011B (en) Dissipation of heat from a circuit board having bare silicon chips mounted thereon
JP5042390B2 (ja) レーザー接着用積層体、シューズ、及びシューズの製造方法
JP5608226B2 (ja) 剥離可能な接着物品
JP4578407B2 (ja) 架橋ポリオレフィン系樹脂発泡シートの製造方法
TWI353819B (en) Use of a composite material as an impact protectio
JP3748025B2 (ja) シリコーンゴムの圧縮永久歪を低減させる方法
JP2004080040A (ja) 高度に充填されているか又は低度に架橋されている熱伝導性インタフェースパッドを与えるための可とう性表面層フィルム
WO2007016617A3 (en) Silicone compositions, methods of manufacture, and articles formed therefrom
ATE557074T1 (de) Thermisches verbindungsmaterial und verfahren zu dessen herstellung
TWI304435B (en) Adhesive sheet comprising hollow parts and method for preparing the same
JP2002128931A (ja) 熱伝導性樹脂シート
JP2001168246A (ja) 熱伝導性シート及びその製造方法
JP2014193598A (ja) 熱伝導性複合シリコーンゴムシート
CN110856563A (zh) 热熔胶膜组成物与鞋底的制作方法
CN106661396A (zh) 用于改善薄膜的阻尼性能的方法
JP2017069341A (ja) 電子機器用熱伝導性シート
JP5042899B2 (ja) 熱伝導性シート及びその製造方法
JP2002317064A (ja) 熱伝導材
JP3439246B2 (ja) 絶縁性と制振性と熱伝導性を有するゴムおよび／またはプラスチック成型物
JP2000026733A (ja) シリコーンゲルシート、組成物およびその製法
JPH05310993A (ja) 制振性と熱伝導性を有するゴムおよび／またはプラスチック成型物
KR20250136323A (ko) 시트상 방열부재
JP2023166451A (ja) 放熱シートとその製造方法
JP3092699B2 (ja) 放熱スペーサーとその用途およびシリコーン組成物