JP2006519482A5 - - Google Patents

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Publication number
JP2006519482A5
JP2006519482A5 JP2006501464A JP2006501464A JP2006519482A5 JP 2006519482 A5 JP2006519482 A5 JP 2006519482A5 JP 2006501464 A JP2006501464 A JP 2006501464A JP 2006501464 A JP2006501464 A JP 2006501464A JP 2006519482 A5 JP2006519482 A5 JP 2006519482A5
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JP
Japan
Prior art keywords
plasma chamber
sccm
plasma
silicon
chamber
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Application number
JP2006501464A
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English (en)
Japanese (ja)
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JP4733627B2 (ja
JP2006519482A (ja
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Publication date
Priority claimed from DE10308381A external-priority patent/DE10308381B4/de
Application filed filed Critical
Publication of JP2006519482A publication Critical patent/JP2006519482A/ja
Publication of JP2006519482A5 publication Critical patent/JP2006519482A5/ja
Application granted granted Critical
Publication of JP4733627B2 publication Critical patent/JP4733627B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006501464A 2003-02-27 2004-01-20 珪素の析出法 Expired - Fee Related JP4733627B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10308381.2 2003-02-27
DE10308381A DE10308381B4 (de) 2003-02-27 2003-02-27 Verfahren zur Abscheidung von Silizium
PCT/DE2004/000066 WO2004076713A1 (de) 2003-02-27 2004-01-20 Verfahren zur abscheidung von silizium

Publications (3)

Publication Number Publication Date
JP2006519482A JP2006519482A (ja) 2006-08-24
JP2006519482A5 true JP2006519482A5 (enExample) 2007-01-25
JP4733627B2 JP4733627B2 (ja) 2011-07-27

Family

ID=32863924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006501464A Expired - Fee Related JP4733627B2 (ja) 2003-02-27 2004-01-20 珪素の析出法

Country Status (15)

Country Link
US (1) US7981776B2 (enExample)
EP (1) EP1601813B1 (enExample)
JP (1) JP4733627B2 (enExample)
KR (1) KR101127047B1 (enExample)
CN (1) CN1754007A (enExample)
AT (1) ATE403763T1 (enExample)
AU (1) AU2004215243B2 (enExample)
CA (1) CA2517598C (enExample)
CY (1) CY1108484T1 (enExample)
DE (2) DE10308381B4 (enExample)
ES (1) ES2311792T3 (enExample)
PT (1) PT1601813E (enExample)
RU (1) RU2005129984A (enExample)
SI (1) SI1601813T1 (enExample)
WO (1) WO2004076713A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006216624A (ja) * 2005-02-01 2006-08-17 Mitsubishi Heavy Ind Ltd 太陽電池及び太陽電池の製造方法
US8203071B2 (en) 2007-01-18 2012-06-19 Applied Materials, Inc. Multi-junction solar cells and methods and apparatuses for forming the same
TWI350006B (en) * 2007-10-05 2011-10-01 Ind Tech Res Inst Plasma enhanced thin film deposition method
JP2011503848A (ja) 2007-11-02 2011-01-27 アプライド マテリアルズ インコーポレイテッド 堆積プロセス間のプラズマ処置
JP5005588B2 (ja) 2008-03-14 2012-08-22 東洋自動機株式会社 袋移送及び傾き修正装置
RU2367600C1 (ru) * 2008-04-16 2009-09-20 Борис Георгиевич Грибов Способ получения кремния высокой чистоты
DE102008063737A1 (de) * 2008-12-18 2010-06-24 Forschungszentrum Jülich GmbH Verfahren zur Abscheidung von mikrokristallinem Silizium auf einem Substrat
TW201120942A (en) * 2009-12-08 2011-06-16 Ind Tech Res Inst Method for depositing microcrystalline silicon and monitor device of a plasma enhanced deposition
CN102108494B (zh) * 2009-12-23 2013-01-16 财团法人工业技术研究院 微晶硅薄膜的沉积方法及等离子体辅助沉积的监控装置
CN102031503B (zh) * 2010-09-29 2012-12-05 理想能源设备(上海)有限公司 硅薄膜的沉积方法
US8642376B2 (en) * 2011-05-16 2014-02-04 Applied Materials, Inc. Methods for depositing a material atop a substrate
DE102014007767B4 (de) * 2014-05-21 2025-08-28 Christian Bauch Verfahren zur Herstellung halogenierter Oligosilane aus Silicium und Tetrachlorsilan
DE102014007766B4 (de) * 2014-05-21 2025-10-16 Christian Bauch Verfahren zur plasmachemischen Herstellung halogenierter Oligosilane aus Tetrachlorsilan
CN114242833A (zh) * 2021-11-18 2022-03-25 国家电投集团科学技术研究院有限公司 异质结太阳电池的硅片处理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5334423A (en) * 1993-01-28 1994-08-02 United Solar Systems Corp. Microwave energized process for the preparation of high quality semiconductor material
JPH09232235A (ja) * 1995-02-24 1997-09-05 Mitsui Toatsu Chem Inc 光電変換素子
JPH1081973A (ja) 1996-03-18 1998-03-31 Hyundai Electron Ind Co Ltd 誘導結合形プラズマcvd装置
US5824940A (en) 1997-01-27 1998-10-20 Alfred University Ceramic bullet-proof fabric
JPH11233801A (ja) * 1998-02-17 1999-08-27 Canon Inc 微結晶シリコン膜の形成方法、および光起電力素子
JP4335389B2 (ja) * 1999-11-24 2009-09-30 株式会社カネカ シリコン系薄膜光電変換装置の製造方法
JP3857024B2 (ja) * 2000-07-17 2006-12-13 株式会社神戸製鋼所 微結晶シリコン薄膜の形成方法
JP2003007629A (ja) * 2001-04-03 2003-01-10 Canon Inc シリコン系膜の形成方法、シリコン系膜および半導体素子
JP4397391B2 (ja) * 2006-10-30 2010-01-13 信越フィルム株式会社 ガスバリア性プラスチックおよびプラスチックフィルムの製造方法

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