JP2006501673A5 - - Google Patents
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- Publication number
- JP2006501673A5 JP2006501673A5 JP2004541539A JP2004541539A JP2006501673A5 JP 2006501673 A5 JP2006501673 A5 JP 2006501673A5 JP 2004541539 A JP2004541539 A JP 2004541539A JP 2004541539 A JP2004541539 A JP 2004541539A JP 2006501673 A5 JP2006501673 A5 JP 2006501673A5
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing process
- quality
- generating
- critical
- acceptable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims 21
- 238000000034 method Methods 0.000 claims 17
- 239000011159 matrix material Substances 0.000 claims 8
- 238000005259 measurement Methods 0.000 claims 8
- 239000004065 semiconductor Substances 0.000 claims 5
- 238000012544 monitoring process Methods 0.000 claims 4
- 230000007547 defect Effects 0.000 claims 3
- 238000005530 etching Methods 0.000 claims 2
- 238000007689 inspection Methods 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
- 238000011065 in-situ storage Methods 0.000 claims 1
- 238000001465 metallisation Methods 0.000 claims 1
- 238000004886 process control Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/261,569 US6915177B2 (en) | 2002-09-30 | 2002-09-30 | Comprehensive integrated lithographic process control system based on product design and yield feedback system |
| PCT/US2003/028682 WO2004031859A2 (en) | 2002-09-30 | 2003-09-12 | Comprehensive integrated lithographic process control system based on product design and yield feedback system |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006501673A JP2006501673A (ja) | 2006-01-12 |
| JP2006501673A5 true JP2006501673A5 (enExample) | 2009-01-15 |
| JP4478574B2 JP4478574B2 (ja) | 2010-06-09 |
Family
ID=32030023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004541539A Expired - Lifetime JP4478574B2 (ja) | 2002-09-30 | 2003-09-12 | 製品設計および歩留りのフィードバックシステムに基づいた総括的な統合リソグラフィプロセス制御システム |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6915177B2 (enExample) |
| JP (1) | JP4478574B2 (enExample) |
| KR (1) | KR100994271B1 (enExample) |
| CN (1) | CN1685492B (enExample) |
| AU (1) | AU2003276881A1 (enExample) |
| DE (1) | DE10393394B4 (enExample) |
| GB (1) | GB2410834B (enExample) |
| TW (1) | TWI332129B (enExample) |
| WO (1) | WO2004031859A2 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10355573B4 (de) * | 2003-11-28 | 2007-12-20 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Erhöhen der Produktionsausbeute durch Steuern der Lithographie auf der Grundlage elektrischer Geschwindigkeitsdaten |
| US20050288773A1 (en) * | 2004-01-22 | 2005-12-29 | Glocker David A | Radiopaque coating for biomedical devices |
| US7379184B2 (en) * | 2004-10-18 | 2008-05-27 | Nanometrics Incorporated | Overlay measurement target |
| KR100588914B1 (ko) | 2004-12-22 | 2006-06-09 | 동부일렉트로닉스 주식회사 | 웨이퍼 상의 트랜지스터의 균일한 전기적 특성을 위한노광방법 |
| US7808643B2 (en) * | 2005-02-25 | 2010-10-05 | Nanometrics Incorporated | Determining overlay error using an in-chip overlay target |
| WO2006093722A2 (en) * | 2005-02-25 | 2006-09-08 | Accent Optical Technologies, Inc. | Methods and systems for determining overlay error based on target image symmetry |
| US20070240121A1 (en) * | 2006-01-31 | 2007-10-11 | Caterpillar Inc. | System for evaluating component value |
| US7352439B2 (en) * | 2006-08-02 | 2008-04-01 | Asml Netherlands B.V. | Lithography system, control system and device manufacturing method |
| GB0621408D0 (en) * | 2006-10-27 | 2006-12-06 | Ibm | A method, apparatus and software for determining a relative measure of build quality for a built system |
| US7359820B1 (en) | 2007-01-03 | 2008-04-15 | International Business Machines Corporation | In-cycle system test adaptation |
| US8142966B2 (en) * | 2008-05-21 | 2012-03-27 | Kla-Tenor Corporation | Substrate matrix to decouple tool and process effects |
| US8321263B2 (en) * | 2009-04-17 | 2012-11-27 | Hartford Fire Insurance Company | Processing and display of service provider performance data |
| JP5399191B2 (ja) * | 2009-09-30 | 2014-01-29 | 大日本スクリーン製造株式会社 | 基板処理装置、基板処理装置のための検査装置、ならびに検査用コンピュータプログラムおよびそれを記録した記録媒体 |
| IL210832A (en) * | 2010-02-19 | 2016-11-30 | Asml Netherlands Bv | Lithographic facility and method of manufacturing facility |
| CN102800563B (zh) * | 2011-05-26 | 2014-11-05 | 中芯国际集成电路制造(上海)有限公司 | 晶片投片方法与晶片投片装置 |
| US9227295B2 (en) | 2011-05-27 | 2016-01-05 | Corning Incorporated | Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer |
| KR101530848B1 (ko) * | 2012-09-20 | 2015-06-24 | 국립대학법인 울산과학기술대학교 산학협력단 | 데이터마이닝을 이용하여 생산 공정에서 품질을 관리하는 장치 및 방법 |
| KR101508641B1 (ko) * | 2013-08-08 | 2015-04-08 | 국립대학법인 울산과학기술대학교 산학협력단 | 생산 공정에서 데이터마이닝을 이용하여 제품 상태를 예측하는 장치 및 방법 |
| CN107850861B (zh) * | 2015-07-16 | 2020-08-07 | Asml荷兰有限公司 | 光刻设备和器件制造方法 |
| US10289109B2 (en) * | 2015-10-01 | 2019-05-14 | Globalfoundries Inc. | Methods of error detection in fabrication processes |
| US10241502B2 (en) | 2015-10-01 | 2019-03-26 | Globalfoundries Inc. | Methods of error detection in fabrication processes |
| US10311186B2 (en) * | 2016-04-12 | 2019-06-04 | Globalfoundries Inc. | Three-dimensional pattern risk scoring |
| CN106205528B (zh) * | 2016-07-19 | 2019-04-16 | 深圳市华星光电技术有限公司 | 一种goa电路及液晶显示面板 |
| EP3279737A1 (en) * | 2016-08-05 | 2018-02-07 | ASML Netherlands B.V. | Diagnostic system for an industrial process |
| JP7229686B2 (ja) * | 2017-10-06 | 2023-02-28 | キヤノン株式会社 | 制御装置、リソグラフィ装置、測定装置、加工装置、平坦化装置及び物品製造方法 |
| CN110246775B (zh) * | 2018-03-09 | 2022-05-03 | 联华电子股份有限公司 | 控制机台操作的装置与方法 |
| CN110071059B (zh) * | 2019-03-29 | 2020-12-22 | 福建省福联集成电路有限公司 | 一种监控蚀刻的工艺方法及系统 |
| CN111861050B (zh) * | 2019-04-25 | 2024-02-20 | 富联精密电子(天津)有限公司 | 生产制程管控装置、方法及计算机可读存储介质 |
| DE102020215716A1 (de) | 2020-12-11 | 2022-06-15 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Halbleiterbauelements und Fertigungslinie |
| US20240231242A9 (en) * | 2021-03-02 | 2024-07-11 | Asml Netherlands B.V. | Operating a metrology system, lithographic apparatus, and methods thereof |
| US11955358B2 (en) * | 2021-09-24 | 2024-04-09 | Applied Materials, Inc. | Model-based failure mitigation for semiconductor processing systems |
| CN114326620B (zh) * | 2021-12-25 | 2022-09-27 | 北京国控天成科技有限公司 | 一种全流程自动控制方法、装置及电子设备 |
| US12321159B2 (en) * | 2022-02-04 | 2025-06-03 | University Of South Florida | Systems, methods, and media for monitoring the production process of a product |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2679500B2 (ja) | 1990-12-17 | 1997-11-19 | モトローラ・インコーポレイテッド | 総合的なシステム歩留りを計算するための方法 |
| US5351202A (en) * | 1992-02-27 | 1994-09-27 | International Business Machines Corporation | Evaluation and ranking of manufacturing line non-numeric information |
| US5642296A (en) * | 1993-07-29 | 1997-06-24 | Texas Instruments Incorporated | Method of diagnosing malfunctions in semiconductor manufacturing equipment |
| US5546312A (en) * | 1993-09-20 | 1996-08-13 | Texas Instruments Incorporated | Use of spatial models for simultaneous control of various non-uniformity metrics |
| US5481475A (en) | 1993-12-10 | 1996-01-02 | International Business Machines Corporation | Method of semiconductor device representation for fast and inexpensive simulations of semiconductor device manufacturing processes |
| JP3099932B2 (ja) | 1993-12-14 | 2000-10-16 | 株式会社東芝 | インテリジェントテストラインシステム |
| US5822218A (en) * | 1996-08-27 | 1998-10-13 | Clemson University | Systems, methods and computer program products for prediction of defect-related failures in integrated circuits |
| JP3369494B2 (ja) * | 1998-12-24 | 2003-01-20 | 台湾茂▲せき▼電子股▲ふん▼有限公司 | ウェハーテストの不良パターン自動識別装置と方法 |
| US6301516B1 (en) * | 1999-03-25 | 2001-10-09 | General Electric Company | Method for identifying critical to quality dependencies |
| KR100597595B1 (ko) * | 1999-07-14 | 2006-07-06 | 주식회사 하이닉스반도체 | 반도체 제조를 위한 사진공정에서의 샘플 웨이퍼 처리 방법 |
| US6582618B1 (en) | 1999-09-08 | 2003-06-24 | Advanced Micro Devices, Inc. | Method of determining etch endpoint using principal components analysis of optical emission spectra |
| US6248602B1 (en) * | 1999-11-01 | 2001-06-19 | Amd, Inc. | Method and apparatus for automated rework within run-to-run control semiconductor manufacturing |
| US6622059B1 (en) | 2000-04-13 | 2003-09-16 | Advanced Micro Devices, Inc. | Automated process monitoring and analysis system for semiconductor processing |
| US6470231B1 (en) * | 2000-04-21 | 2002-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for auto dispatching wafer |
| US6535775B1 (en) * | 2000-09-01 | 2003-03-18 | General Electric Company | Processor system and method for integrating computerized quality design tools |
| DE10048809A1 (de) * | 2000-09-29 | 2002-04-18 | Itemic Ag | Verfahren zur Bestimmung des größten Lagefehlers von Strukturelementen eines Wafers |
| IL139368A (en) | 2000-10-30 | 2006-12-10 | Nova Measuring Instr Ltd | Process control for microlithography |
| US6627464B2 (en) * | 2001-02-07 | 2003-09-30 | Eni Technology, Inc. | Adaptive plasma characterization system |
| DE10106505A1 (de) * | 2001-02-13 | 2002-08-29 | Bosch Gmbh Robert | Verfahren und Vorrichtung zur Zustandserfassung von technischen Systemen wie Energiespeicher |
| WO2002077589A2 (en) | 2001-03-23 | 2002-10-03 | Tokyo Electron Limited | Method and apparatus for endpoint detection using partial least squares |
| JP2002297217A (ja) * | 2001-03-29 | 2002-10-11 | Japan Institute Of Plant Maintenance | 製造業務における品質管理方法、品質管理支援システム及び傾向管理プログラム |
| DE60133452T2 (de) | 2001-04-27 | 2009-10-01 | Motorola, Inc., Schaumburg | Verfahren zur Justierung von Verarbeitungsparametern plattenförmiger Gegenstände in einer Verarbeitungsvorrichtung |
| US6810291B2 (en) * | 2001-09-14 | 2004-10-26 | Ibex Process Technology, Inc. | Scalable, hierarchical control for complex processes |
-
2002
- 2002-09-30 US US10/261,569 patent/US6915177B2/en not_active Expired - Lifetime
-
2003
- 2003-09-12 KR KR1020057005554A patent/KR100994271B1/ko not_active Expired - Lifetime
- 2003-09-12 CN CN038228262A patent/CN1685492B/zh not_active Expired - Lifetime
- 2003-09-12 AU AU2003276881A patent/AU2003276881A1/en not_active Abandoned
- 2003-09-12 DE DE10393394.8T patent/DE10393394B4/de not_active Expired - Lifetime
- 2003-09-12 JP JP2004541539A patent/JP4478574B2/ja not_active Expired - Lifetime
- 2003-09-12 GB GB0505193A patent/GB2410834B/en not_active Expired - Lifetime
- 2003-09-12 WO PCT/US2003/028682 patent/WO2004031859A2/en not_active Ceased
- 2003-09-22 TW TW092126058A patent/TWI332129B/zh not_active IP Right Cessation
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