JP2019512869A5 - - Google Patents

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JP2019512869A5
JP2019512869A5 JP2018544846A JP2018544846A JP2019512869A5 JP 2019512869 A5 JP2019512869 A5 JP 2019512869A5 JP 2018544846 A JP2018544846 A JP 2018544846A JP 2018544846 A JP2018544846 A JP 2018544846A JP 2019512869 A5 JP2019512869 A5 JP 2019512869A5
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Japan
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measurement
tool
landscape
rca
parameter
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JP2018544846A
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Japanese (ja)
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JP2019512869A (ja
JP7011592B2 (ja
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Priority claimed from PCT/US2016/059954 external-priority patent/WO2017146786A1/en
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JP2018544846A 2016-02-25 2016-11-01 スキャトロメトリ計測におけるプロセス変動の根本原因の解析 Active JP7011592B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662299693P 2016-02-25 2016-02-25
US62/299,693 2016-02-25
PCT/US2016/059954 WO2017146786A1 (en) 2016-02-25 2016-11-01 Analyzing root causes of process variation in scatterometry metrology

Publications (3)

Publication Number Publication Date
JP2019512869A JP2019512869A (ja) 2019-05-16
JP2019512869A5 true JP2019512869A5 (enExample) 2019-12-12
JP7011592B2 JP7011592B2 (ja) 2022-01-26

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JP2018544846A Active JP7011592B2 (ja) 2016-02-25 2016-11-01 スキャトロメトリ計測におけるプロセス変動の根本原因の解析

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US (1) US10203200B2 (enExample)
EP (1) EP3420327A4 (enExample)
JP (1) JP7011592B2 (enExample)
KR (1) KR102430129B1 (enExample)
CN (1) CN108700463B (enExample)
IL (1) IL260855B (enExample)
TW (1) TWI713703B (enExample)
WO (2) WO2017146785A1 (enExample)

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JP6877541B2 (ja) 2016-11-14 2021-05-26 ケーエルエー コーポレイション 一体型メトロロジツールを有する機能性が強化されたリソグラフィシステム
EP3451061A1 (en) * 2017-09-04 2019-03-06 ASML Netherlands B.V. Method for monitoring a manufacturing process
WO2019182637A1 (en) 2018-03-19 2019-09-26 Kla-Tencor Corporation Overlay measurement using multiple wavelengths
US11519869B2 (en) * 2018-03-20 2022-12-06 Kla Tencor Corporation Methods and systems for real time measurement control
US10962951B2 (en) * 2018-06-20 2021-03-30 Kla-Tencor Corporation Process and metrology control, process indicators and root cause analysis tools based on landscape information
US11119417B2 (en) 2018-11-21 2021-09-14 Kla-Tencor Corporation Single cell grey scatterometry overlay targets and their measurement using varying illumination parameter(s)
SG11202104681RA (en) 2018-11-21 2021-06-29 Kla Tencor Corp Single cell grey scatterometry overlay targets and their measurement using varying illumination parameter(s)
US11249400B2 (en) 2018-12-14 2022-02-15 Kla Corporation Per-site residuals analysis for accurate metrology measurements
US11156846B2 (en) 2019-04-19 2021-10-26 Kla Corporation High-brightness illumination source for optical metrology
US11635682B2 (en) * 2019-06-26 2023-04-25 Kla Corporation Systems and methods for feedforward process control in the manufacture of semiconductor devices
KR20220107006A (ko) * 2019-11-28 2022-08-01 케이엘에이 코포레이션 계측 랜드스케이프에 기초한 계측 최적화를 위한 시스템 및 방법
US11454894B2 (en) 2020-09-14 2022-09-27 Kla Corporation Systems and methods for scatterometric single-wavelength measurement of misregistration and amelioration thereof
WO2022098354A1 (en) 2020-11-05 2022-05-12 Kla Corporation Systems and methods for measurement of misregistration and amelioration thereof
US11861824B1 (en) * 2022-02-03 2024-01-02 Kla Corporation Reference image grouping in overlay metrology
CN120063470B (zh) * 2025-04-29 2025-08-12 上海大学 一种非对称多谐振光纤传感器及其制备方法
CN120183583B (zh) * 2025-05-16 2025-09-02 常州润来科技有限公司 一种稀土微合金化铜管铸坯微孔洞性能测试方法及系统

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US6986280B2 (en) * 2002-01-22 2006-01-17 Fei Company Integrated measuring instrument
US8257546B2 (en) * 2003-04-11 2012-09-04 Applied Materials, Inc. Method and system for monitoring an etch process
US7463364B2 (en) * 2003-07-31 2008-12-09 Ler Technologies, Inc. Electro-optic sensor
TWI254190B (en) * 2003-09-22 2006-05-01 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
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JP2013502592A (ja) * 2009-08-24 2013-01-24 エーエスエムエル ネザーランズ ビー．ブイ． メトロロジ方法および装置、リソグラフィ装置、リソグラフィプロセシングセル、およびメトロロジターゲットを備える基板
TWI417942B (zh) * 2009-12-17 2013-12-01 Ind Tech Res Inst 二維陣列疊對圖樣組之設計方法、疊對誤差量測方法及其量測系統
US8666703B2 (en) * 2010-07-22 2014-03-04 Tokyo Electron Limited Method for automated determination of an optimally parameterized scatterometry model
NL2009294A (en) * 2011-08-30 2013-03-04 Asml Netherlands Bv Method and apparatus for determining an overlay error.
US10255385B2 (en) * 2012-03-28 2019-04-09 Kla-Tencor Corporation Model optimization approach based on spectral sensitivity
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WO2014062972A1 (en) * 2012-10-18 2014-04-24 Kla-Tencor Corporation Symmetric target design in scatterometry overlay metrology
WO2014074873A1 (en) 2012-11-09 2014-05-15 Kla-Tencor Corporation Reducing algorithmic inaccuracy in scatterometry overlay metrology
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