JP2015527740A5 - - Google Patents

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JP2015527740A5
JP2015527740A5 JP2015525602A JP2015525602A JP2015527740A5 JP 2015527740 A5 JP2015527740 A5 JP 2015527740A5 JP 2015525602 A JP2015525602 A JP 2015525602A JP 2015525602 A JP2015525602 A JP 2015525602A JP 2015527740 A5 JP2015527740 A5 JP 2015527740A5
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dies
error
exposure
printed
focus
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JP2015525602A
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JP6282650B2 (ja
JP2015527740A (ja
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Priority claimed from US13/783,291 external-priority patent/US8948495B2/en
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JP2015525602A 2012-08-01 2013-08-01 ウェーハの検査、及び／又はウェーハ上に形成されるデバイスの一つ若しくは複数の特性の予測 Active JP6282650B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261678576P 2012-08-01 2012-08-01
US61/678,576 2012-08-01
US13/783,291 2013-03-02
US13/783,291 US8948495B2 (en) 2012-08-01 2013-03-02 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
PCT/US2013/053252 WO2014022682A1 (en) 2012-08-01 2013-08-01 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018009314A Division JP2018097376A (ja) 2012-08-01 2018-01-24 ウェーハの検査、及び／又はウェーハ上に形成されるデバイスの一つ若しくは複数の特性の予測

Publications (3)

Publication Number Publication Date
JP2015527740A JP2015527740A (ja) 2015-09-17
JP2015527740A5 true JP2015527740A5 (enExample) 2016-09-15
JP6282650B2 JP6282650B2 (ja) 2018-02-21

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JP2015525602A Active JP6282650B2 (ja) 2012-08-01 2013-08-01 ウェーハの検査、及び／又はウェーハ上に形成されるデバイスの一つ若しくは複数の特性の予測
JP2018009314A Pending JP2018097376A (ja) 2012-08-01 2018-01-24 ウェーハの検査、及び／又はウェーハ上に形成されるデバイスの一つ若しくは複数の特性の予測
JP2019224429A Pending JP2020057008A (ja) 2012-08-01 2019-12-12 デバイスの特性の予測方法及びシステム
JP2021132300A Pending JP2021182162A (ja) 2012-08-01 2021-08-16 デバイスの特性の予測方法及びシステム

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JP2018009314A Pending JP2018097376A (ja) 2012-08-01 2018-01-24 ウェーハの検査、及び／又はウェーハ上に形成されるデバイスの一つ若しくは複数の特性の予測
JP2019224429A Pending JP2020057008A (ja) 2012-08-01 2019-12-12 デバイスの特性の予測方法及びシステム
JP2021132300A Pending JP2021182162A (ja) 2012-08-01 2021-08-16 デバイスの特性の予測方法及びシステム

Country Status (8)

Country Link
US (1) US8948495B2 (enExample)
EP (1) EP2880427A1 (enExample)
JP (4) JP6282650B2 (enExample)
KR (2) KR102169564B1 (enExample)
CN (1) CN104620097B (enExample)
IL (2) IL236957B (enExample)
TW (1) TWI591326B (enExample)
WO (1) WO2014022682A1 (enExample)

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