IL236957B - Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer - Google Patents

Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer

Info

Publication number
IL236957B
IL236957B IL236957A IL23695715A IL236957B IL 236957 B IL236957 B IL 236957B IL 236957 A IL236957 A IL 236957A IL 23695715 A IL23695715 A IL 23695715A IL 236957 B IL236957 B IL 236957B
Authority
IL
Israel
Prior art keywords
wafer
inspecting
predicting
Prior art date
Application number
IL236957A
Other languages
English (en)
Hebrew (he)
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of IL236957B publication Critical patent/IL236957B/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
IL236957A 2012-08-01 2015-01-28 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer IL236957B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261678576P 2012-08-01 2012-08-01
US13/783,291 US8948495B2 (en) 2012-08-01 2013-03-02 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
PCT/US2013/053252 WO2014022682A1 (en) 2012-08-01 2013-08-01 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer

Publications (1)

Publication Number Publication Date
IL236957B true IL236957B (en) 2018-07-31

Family

ID=50025524

Family Applications (2)

Application Number Title Priority Date Filing Date
IL236957A IL236957B (en) 2012-08-01 2015-01-28 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
IL255772A IL255772B (en) 2012-08-01 2017-11-20 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer

Family Applications After (1)

Application Number Title Priority Date Filing Date
IL255772A IL255772B (en) 2012-08-01 2017-11-20 Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer

Country Status (8)

Country Link
US (1) US8948495B2 (enExample)
EP (1) EP2880427A1 (enExample)
JP (4) JP6282650B2 (enExample)
KR (2) KR102169564B1 (enExample)
CN (1) CN104620097B (enExample)
IL (2) IL236957B (enExample)
TW (1) TWI591326B (enExample)
WO (1) WO2014022682A1 (enExample)

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US10740888B2 (en) 2016-04-22 2020-08-11 Kla-Tencor Corporation Computer assisted weak pattern detection and quantification system
KR20190005955A (ko) * 2016-05-12 2019-01-16 에이에스엠엘 네델란즈 비.브이. 측정치 획득 방법, 프로세스 단계 수행 장치, 계측 장치, 디바이스 제조 방법
US10902576B2 (en) * 2016-08-12 2021-01-26 Texas Instruments Incorporated System and method for electronic die inking after automatic visual defect inspection
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US10761128B2 (en) * 2017-03-23 2020-09-01 Kla-Tencor Corporation Methods and systems for inline parts average testing and latent reliability defect detection
US10262408B2 (en) * 2017-04-12 2019-04-16 Kla-Tencor Corporation System, method and computer program product for systematic and stochastic characterization of pattern defects identified from a semiconductor wafer
JP6778666B2 (ja) 2017-08-24 2020-11-04 株式会社日立製作所 探索装置及び探索方法
EP3451061A1 (en) * 2017-09-04 2019-03-06 ASML Netherlands B.V. Method for monitoring a manufacturing process
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US10867877B2 (en) * 2018-03-20 2020-12-15 Kla Corporation Targeted recall of semiconductor devices based on manufacturing data
CN111426701B (zh) * 2019-06-25 2024-01-30 合肥晶合集成电路股份有限公司 一种晶圆缺陷检测方法及其装置
US11494895B2 (en) * 2020-02-14 2022-11-08 KLA Corp. Detecting defects in array regions on specimens
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Also Published As

Publication number Publication date
IL255772B (en) 2020-09-30
KR102129826B1 (ko) 2020-07-06
EP2880427A1 (en) 2015-06-10
JP2018097376A (ja) 2018-06-21
KR102169564B1 (ko) 2020-10-26
CN104620097A (zh) 2015-05-13
IL255772A (en) 2018-01-31
TW201415008A (zh) 2014-04-16
TWI591326B (zh) 2017-07-11
JP2021182162A (ja) 2021-11-25
JP6282650B2 (ja) 2018-02-21
US20140037187A1 (en) 2014-02-06
US8948495B2 (en) 2015-02-03
KR20150036789A (ko) 2015-04-07
CN104620097B (zh) 2017-08-29
WO2014022682A1 (en) 2014-02-06
KR20200045577A (ko) 2020-05-04
JP2015527740A (ja) 2015-09-17
JP2020057008A (ja) 2020-04-09

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