Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
  • H01L22/10—Measuring as part of the manufacturing process
  • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02002—Preparing wafers
  • H01L21/02005—Preparing bulk and homogeneous wafers
  • H01L21/02008—Multistep processes
  • H01L21/0201—Specific process step
  • H01L21/02024—Mirror polishing
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
  • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
  • H01L22/10—Measuring as part of the manufacturing process
  • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Testing Or Measuring Of Semiconductors Or The Like (AREA)
• Mechanical Treatment Of Semiconductor (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=49915651

Family Applications (1)

Country Status (8)

Families Citing this family (11)

Family Cites Families (14)

• 2012
  • 2012-07-09 JP JP2012153933A patent/JP5862492B2/en active Active
• 2013
  • 2013-06-11 WO PCT/JP2013/003638 patent/WO2014010166A1/en active Application Filing
  • 2013-06-11 SG SG11201408564SA patent/SG11201408564SA/en unknown
  • 2013-06-11 DE DE112013003142.6T patent/DE112013003142T5/en active Pending
  • 2013-06-11 KR KR1020157000415A patent/KR101985195B1/en active IP Right Grant
  • 2013-06-11 US US14/410,514 patent/US10043719B2/en active Active
  • 2013-06-11 CN CN201380036616.8A patent/CN104428882B/en active Active
  • 2013-06-21 TW TW102122205A patent/TWI556339B/en active

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