SG11201408564SA - Semiconductor wafer evaluation method and semiconductor wafer manufacturing method - Google Patents

Semiconductor wafer evaluation method and semiconductor wafer manufacturing method

Info

Publication number
SG11201408564SA
SG11201408564SA SG11201408564SA SG11201408564SA SG11201408564SA SG 11201408564S A SG11201408564S A SG 11201408564SA SG 11201408564S A SG11201408564S A SG 11201408564SA SG 11201408564S A SG11201408564S A SG 11201408564SA SG 11201408564S A SG11201408564S A SG 11201408564SA
Authority
SG
Singapore
Prior art keywords
semiconductor wafer
evaluation method
manufacturing
wafer manufacturing
wafer evaluation
Prior art date
Application number
SG11201408564SA
Inventor
Yuichi Shimizu
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201408564SA publication Critical patent/SG11201408564SA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002Preparing wafers
    • H01L21/02005Preparing bulk and homogeneous wafers
    • H01L21/02008Multistep processes
    • H01L21/0201Specific process step
    • H01L21/02024Mirror polishing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/14Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG11201408564SA 2012-07-09 2013-06-11 Semiconductor wafer evaluation method and semiconductor wafer manufacturing method SG11201408564SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012153933A JP5862492B2 (en) 2012-07-09 2012-07-09 Semiconductor wafer evaluation method and manufacturing method
PCT/JP2013/003638 WO2014010166A1 (en) 2012-07-09 2013-06-11 Evaluation method and production method for semiconductor wafers

Publications (1)

Publication Number Publication Date
SG11201408564SA true SG11201408564SA (en) 2015-02-27

Family

ID=49915651

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408564SA SG11201408564SA (en) 2012-07-09 2013-06-11 Semiconductor wafer evaluation method and semiconductor wafer manufacturing method

Country Status (8)

Country Link
US (1) US10043719B2 (en)
JP (1) JP5862492B2 (en)
KR (1) KR101985195B1 (en)
CN (1) CN104428882B (en)
DE (1) DE112013003142T5 (en)
SG (1) SG11201408564SA (en)
TW (1) TWI556339B (en)
WO (1) WO2014010166A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6323515B2 (en) * 2016-08-31 2018-05-16 株式会社Sumco Semiconductor wafer wrapping method and semiconductor wafer
JP6443520B1 (en) * 2017-10-02 2018-12-26 株式会社Sumco Semiconductor wafer evaluation method and semiconductor wafer manufacturing method using the method
JP6841202B2 (en) * 2017-10-11 2021-03-10 株式会社Sumco Semiconductor wafer evaluation method and semiconductor wafer manufacturing method
JP2019113329A (en) * 2017-12-21 2019-07-11 株式会社ニューフレアテクノロジー Displacement measurement device and electron beam inspection device
CN108807595B (en) * 2018-06-13 2020-02-14 苏州澳京光伏科技有限公司 Manufacturing method of substrate for low-warpage polycrystalline silicon solar cell
US10796969B2 (en) * 2018-09-07 2020-10-06 Kla-Tencor Corporation System and method for fabricating semiconductor wafer features having controlled dimensions
DE102018221922A1 (en) * 2018-12-17 2020-06-18 Siltronic Ag Method for producing semiconductor wafers using a wire saw, wire saw and semiconductor wafer made of single-crystal silicon
CN111336914B (en) * 2020-03-25 2021-12-10 长江存储科技有限责任公司 Wafer warping degree measuring device and method
CN111710600A (en) * 2020-05-20 2020-09-25 河源市天和第三代半导体产业技术研究院 Method for reducing thinning and warping of silicon wafer
CN112071765B (en) * 2020-08-18 2024-07-30 中环领先(徐州)半导体材料有限公司 Method for determining wafer processing parameters and wafer processing method
JP2024044553A (en) * 2022-09-21 2024-04-02 株式会社Sumco Modeling method for wafer shape, and manufacturing method of wafer

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124490A (en) 2000-08-03 2002-04-26 Sumitomo Metal Ind Ltd Method of manufacturing semiconductor wafer
JP2005500605A (en) * 2001-08-21 2005-01-06 ウェーブフロント・サイエンシーズ・インコーポレイテッド High-pass filtering method for datasets
JP3838341B2 (en) * 2001-09-14 2006-10-25 信越半導体株式会社 Wafer shape evaluation method, wafer and wafer sorting method
JP2003229392A (en) * 2001-11-28 2003-08-15 Shin Etsu Handotai Co Ltd Method for manufacturing silicon wafer, silicon wafer and soi wafer
US6613591B1 (en) * 2002-03-07 2003-09-02 Memc Electronic Materials, Inc. Method of estimating post-polishing waviness characteristics of a semiconductor wafer
JP4464033B2 (en) 2002-06-13 2010-05-19 信越半導体株式会社 Semiconductor wafer shape evaluation method and shape evaluation apparatus
WO2006018961A1 (en) 2004-08-17 2006-02-23 Shin-Etsu Handotai Co., Ltd. Method of measuring semiconductor wafer, method of supervising production process therefor and process for producing semiconductor wafer
US7810383B2 (en) 2005-04-08 2010-10-12 Shin-Etsu Handotai Co., Ltd. Method for evaluating semiconductor wafer, apparatus for evaluating semiconductor wafer, and method for manufacturing semiconductor wafer
JP4606231B2 (en) * 2005-04-08 2011-01-05 信越半導体株式会社 Semiconductor wafer evaluation method and evaluation apparatus, and semiconductor wafer manufacturing method
US7930058B2 (en) * 2006-01-30 2011-04-19 Memc Electronic Materials, Inc. Nanotopography control and optimization using feedback from warp data
JP5074845B2 (en) * 2007-07-23 2012-11-14 Sumco Techxiv株式会社 Semiconductor wafer grinding method and semiconductor wafer processing method
KR20100063409A (en) * 2008-12-03 2010-06-11 주식회사 실트론 Method for manufacturing wafer improved in nanotopography
CN102506773B (en) * 2011-09-28 2016-03-09 上海华虹宏力半导体制造有限公司 Detect the method for wafer surface roughness
US20130139800A1 (en) * 2011-12-02 2013-06-06 Memc Electronic Materials, Spa Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw

Also Published As

Publication number Publication date
US20150214123A1 (en) 2015-07-30
CN104428882B (en) 2017-01-11
DE112013003142T5 (en) 2015-03-12
WO2014010166A1 (en) 2014-01-16
TW201413848A (en) 2014-04-01
KR20150033640A (en) 2015-04-01
TWI556339B (en) 2016-11-01
JP5862492B2 (en) 2016-02-16
KR101985195B1 (en) 2019-06-04
JP2014017381A (en) 2014-01-30
US10043719B2 (en) 2018-08-07
CN104428882A (en) 2015-03-18

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