SG11201408564SA - Semiconductor wafer evaluation method and semiconductor wafer manufacturing method - Google Patents
Semiconductor wafer evaluation method and semiconductor wafer manufacturing methodInfo
- Publication number
- SG11201408564SA SG11201408564SA SG11201408564SA SG11201408564SA SG11201408564SA SG 11201408564S A SG11201408564S A SG 11201408564SA SG 11201408564S A SG11201408564S A SG 11201408564SA SG 11201408564S A SG11201408564S A SG 11201408564SA SG 11201408564S A SG11201408564S A SG 11201408564SA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor wafer
- evaluation method
- manufacturing
- wafer manufacturing
- wafer evaluation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/129—Preparing bulk and homogeneous wafers by polishing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012153933A JP5862492B2 (en) | 2012-07-09 | 2012-07-09 | Semiconductor wafer evaluation method and manufacturing method |
| PCT/JP2013/003638 WO2014010166A1 (en) | 2012-07-09 | 2013-06-11 | Evaluation method and production method for semiconductor wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201408564SA true SG11201408564SA (en) | 2015-02-27 |
Family
ID=49915651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201408564SA SG11201408564SA (en) | 2012-07-09 | 2013-06-11 | Semiconductor wafer evaluation method and semiconductor wafer manufacturing method |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10043719B2 (en) |
| JP (1) | JP5862492B2 (en) |
| KR (1) | KR101985195B1 (en) |
| CN (1) | CN104428882B (en) |
| DE (1) | DE112013003142T5 (en) |
| SG (1) | SG11201408564SA (en) |
| TW (1) | TWI556339B (en) |
| WO (1) | WO2014010166A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6323515B2 (en) * | 2016-08-31 | 2018-05-16 | 株式会社Sumco | Semiconductor wafer wrapping method and semiconductor wafer |
| JP6443520B1 (en) * | 2017-10-02 | 2018-12-26 | 株式会社Sumco | Semiconductor wafer evaluation method and semiconductor wafer manufacturing method using the method |
| JP6841202B2 (en) * | 2017-10-11 | 2021-03-10 | 株式会社Sumco | Semiconductor wafer evaluation method and semiconductor wafer manufacturing method |
| JP2019113329A (en) * | 2017-12-21 | 2019-07-11 | 株式会社ニューフレアテクノロジー | Displacement measurement device and electron beam inspection device |
| EP3801464A4 (en) * | 2018-05-31 | 2022-03-16 | Sorrento Therapeutics, Inc. | METHODS OF DRUG DELIVERY TARGETING THE LYMPHATIC SYSTEM |
| CN108807595B (en) * | 2018-06-13 | 2020-02-14 | 苏州澳京光伏科技有限公司 | Manufacturing method of substrate for low-warpage polycrystalline silicon solar cell |
| US10796969B2 (en) * | 2018-09-07 | 2020-10-06 | Kla-Tencor Corporation | System and method for fabricating semiconductor wafer features having controlled dimensions |
| DE102018221922A1 (en) * | 2018-12-17 | 2020-06-18 | Siltronic Ag | Method for producing semiconductor wafers using a wire saw, wire saw and semiconductor wafer made of single-crystal silicon |
| JP7172951B2 (en) * | 2019-10-31 | 2022-11-16 | 信越半導体株式会社 | Semiconductor wafer evaluation method, semiconductor wafer sorting method, and device manufacturing method |
| CN111336914B (en) * | 2020-03-25 | 2021-12-10 | 长江存储科技有限责任公司 | Wafer warping degree measuring device and method |
| CN111710600A (en) * | 2020-05-20 | 2020-09-25 | 河源市天和第三代半导体产业技术研究院 | A method for reducing thinning and warping of silicon wafers |
| CN112071765B (en) * | 2020-08-18 | 2024-07-30 | 中环领先(徐州)半导体材料有限公司 | Method for determining wafer processing parameters and wafer processing method |
| JP7746951B2 (en) * | 2022-09-21 | 2025-10-01 | 株式会社Sumco | Wafer shape modeling method and wafer manufacturing method |
| CN119567443B (en) * | 2024-06-28 | 2026-02-27 | 上海新昇半导体科技有限公司 | Characterization and evaluation methods for wafer warpage morphology and crystal rod line section morphology |
| CN118431103B (en) * | 2024-07-05 | 2024-10-22 | 西安奕斯伟材料科技股份有限公司 | Wafer and method, device, equipment and medium for predicting surface nano morphology of wafer |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002124490A (en) | 2000-08-03 | 2002-04-26 | Sumitomo Metal Ind Ltd | Method of manufacturing semiconductor wafer |
| JP2005500605A (en) * | 2001-08-21 | 2005-01-06 | ウェーブフロント・サイエンシーズ・インコーポレイテッド | High-pass filtering method for datasets |
| JP3838341B2 (en) * | 2001-09-14 | 2006-10-25 | 信越半導体株式会社 | Wafer shape evaluation method, wafer and wafer sorting method |
| JP2003229392A (en) * | 2001-11-28 | 2003-08-15 | Shin Etsu Handotai Co Ltd | Method for manufacturing silicon wafer, silicon wafer, and SOI wafer |
| US6613591B1 (en) * | 2002-03-07 | 2003-09-02 | Memc Electronic Materials, Inc. | Method of estimating post-polishing waviness characteristics of a semiconductor wafer |
| JP4464033B2 (en) | 2002-06-13 | 2010-05-19 | 信越半導体株式会社 | Semiconductor wafer shape evaluation method and shape evaluation apparatus |
| JP4420023B2 (en) * | 2004-08-17 | 2010-02-24 | 信越半導体株式会社 | Semiconductor wafer measurement method, manufacturing process management method, and semiconductor wafer manufacturing method |
| JP4606231B2 (en) * | 2005-04-08 | 2011-01-05 | 信越半導体株式会社 | Semiconductor wafer evaluation method and evaluation apparatus, and semiconductor wafer manufacturing method |
| US7810383B2 (en) * | 2005-04-08 | 2010-10-12 | Shin-Etsu Handotai Co., Ltd. | Method for evaluating semiconductor wafer, apparatus for evaluating semiconductor wafer, and method for manufacturing semiconductor wafer |
| US7930058B2 (en) * | 2006-01-30 | 2011-04-19 | Memc Electronic Materials, Inc. | Nanotopography control and optimization using feedback from warp data |
| JP5074845B2 (en) * | 2007-07-23 | 2012-11-14 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Semiconductor wafer grinding method and semiconductor wafer processing method |
| KR20100063409A (en) * | 2008-12-03 | 2010-06-11 | 주식회사 실트론 | Method for manufacturing wafer improved in nanotopography |
| CN102506773B (en) * | 2011-09-28 | 2016-03-09 | 上海华虹宏力半导体制造有限公司 | Detect the method for wafer surface roughness |
| US20130139800A1 (en) * | 2011-12-02 | 2013-06-06 | Memc Electronic Materials, Spa | Methods For Controlling Surface Profiles Of Wafers Sliced In A Wire Saw |
-
2012
- 2012-07-09 JP JP2012153933A patent/JP5862492B2/en active Active
-
2013
- 2013-06-11 US US14/410,514 patent/US10043719B2/en active Active
- 2013-06-11 CN CN201380036616.8A patent/CN104428882B/en active Active
- 2013-06-11 WO PCT/JP2013/003638 patent/WO2014010166A1/en not_active Ceased
- 2013-06-11 DE DE112013003142.6T patent/DE112013003142T5/en active Pending
- 2013-06-11 SG SG11201408564SA patent/SG11201408564SA/en unknown
- 2013-06-11 KR KR1020157000415A patent/KR101985195B1/en active Active
- 2013-06-21 TW TW102122205A patent/TWI556339B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| US10043719B2 (en) | 2018-08-07 |
| JP2014017381A (en) | 2014-01-30 |
| CN104428882B (en) | 2017-01-11 |
| TWI556339B (en) | 2016-11-01 |
| WO2014010166A1 (en) | 2014-01-16 |
| US20150214123A1 (en) | 2015-07-30 |
| KR20150033640A (en) | 2015-04-01 |
| TW201413848A (en) | 2014-04-01 |
| KR101985195B1 (en) | 2019-06-04 |
| CN104428882A (en) | 2015-03-18 |
| DE112013003142T5 (en) | 2015-03-12 |
| JP5862492B2 (en) | 2016-02-16 |
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