SG10201501973PA - Probing device and manufacturing method thereof - Google Patents

Probing device and manufacturing method thereof

Info

Publication number
SG10201501973PA
SG10201501973PA SG10201501973PA SG10201501973PA SG10201501973PA SG 10201501973P A SG10201501973P A SG 10201501973PA SG 10201501973P A SG10201501973P A SG 10201501973PA SG 10201501973P A SG10201501973P A SG 10201501973PA SG 10201501973P A SG10201501973P A SG 10201501973PA
Authority
SG
Singapore
Prior art keywords
manufacturing
probing device
probing
Prior art date
Application number
SG10201501973PA
Inventor
Chien-Chou Wu
Ming-Chi Chen
Chung-Che Li
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mpi Corp filed Critical Mpi Corp
Publication of SG10201501973PA publication Critical patent/SG10201501973PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/20—Instruments transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
SG10201501973PA 2011-09-16 2012-09-11 Probing device and manufacturing method thereof SG10201501973PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100133504A TWI428608B (en) 2011-09-16 2011-09-16 Probing device and manufacturing method thereof

Publications (1)

Publication Number Publication Date
SG10201501973PA true SG10201501973PA (en) 2015-05-28

Family

ID=47880098

Family Applications (3)

Application Number Title Priority Date Filing Date
SG2012067500A SG188748A1 (en) 2011-09-16 2012-09-11 Probing device and manufacturing method thereof
SG10201600842SA SG10201600842SA (en) 2011-09-16 2012-09-11 Manufacturing method of probing device
SG10201501973PA SG10201501973PA (en) 2011-09-16 2012-09-11 Probing device and manufacturing method thereof

Family Applications Before (2)

Application Number Title Priority Date Filing Date
SG2012067500A SG188748A1 (en) 2011-09-16 2012-09-11 Probing device and manufacturing method thereof
SG10201600842SA SG10201600842SA (en) 2011-09-16 2012-09-11 Manufacturing method of probing device

Country Status (4)

Country Link
US (2) US9234917B2 (en)
CN (1) CN102998491B (en)
SG (3) SG188748A1 (en)
TW (1) TWI428608B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014027020A (en) * 2012-07-24 2014-02-06 Toshiba Corp Circuit board, electronic apparatus, and manufacturing method of circuit board
TWI454710B (en) * 2012-09-19 2014-10-01 Mpi Corp Probe card and its manufacturing method
TWI480561B (en) * 2013-05-15 2015-04-11 Star Techn Inc Test assembly
US9581639B2 (en) * 2013-12-28 2017-02-28 Intel Corporation Organic space transformer attachment and assembly
US10088503B2 (en) * 2014-02-27 2018-10-02 Taiwan Semiconductor Manufacturing Co., Ltd. Probe card
TWI521212B (en) * 2014-03-10 2016-02-11 A method and a method of assembling a vertical probe device, and a vertical probe device
TWI565951B (en) * 2015-08-24 2017-01-11 旺矽科技股份有限公司 Probe head
TWI570416B (en) * 2015-12-01 2017-02-11 The probe base of the vertical probe device
CN110136770B (en) * 2019-05-31 2020-09-22 济南德欧雅安全技术有限公司 Test fixture and test method for testing memory component in application program
KR20210119814A (en) * 2020-03-25 2021-10-06 (주)포인트엔지니어링 Probe head and probe card having the same
WO2023227538A1 (en) * 2022-05-25 2023-11-30 Technoprobe S.P.A. Probe card with improved temperature control
TW202403319A (en) * 2022-05-25 2024-01-16 義大利商探針科技公司 Probe card for a testing apparatus of electronic devices and corresponding space transformer

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
JPH06220686A (en) * 1993-01-22 1994-08-09 Tokai Rubber Ind Ltd Pattern plated and molded articles and their production
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
CN2658938Y (en) * 2003-06-26 2004-11-24 旺矽科技股份有限公司 Integrated circuit testing card
CN100357745C (en) * 2004-02-17 2007-12-26 财团法人工业技术研究院 Integral probe card and assembling mode
US7217139B2 (en) * 2004-08-11 2007-05-15 Antares Advanced Test Technologies, Inc. Interconnect assembly for a probe card
US7459795B2 (en) * 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
JP4823667B2 (en) * 2005-12-05 2011-11-24 日本発條株式会社 Probe card
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
KR100683444B1 (en) 2005-12-29 2007-02-22 주식회사 파이컴 Substrate of probe card and method for regenerating thereof
KR100609652B1 (en) * 2006-02-16 2006-08-08 주식회사 파이컴 Space transformer, manufacturing method of the space transformer and probe card having the space transformer
US7759776B2 (en) * 2006-03-28 2010-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Space transformer having multi-layer pad structures
JP5426161B2 (en) * 2006-06-08 2014-02-26 日本発條株式会社 Probe card
JP5101060B2 (en) * 2006-07-31 2012-12-19 日本発條株式会社 Probe card parallelism adjustment mechanism
US7368928B2 (en) * 2006-08-29 2008-05-06 Mjc Probe Incorporation Vertical type high frequency probe card
US7642793B2 (en) * 2006-11-22 2010-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Ultra-fine pitch probe card structure
US7696766B2 (en) * 2007-01-31 2010-04-13 Taiwan Semiconductor Manufacturing Company, Ltd. Ultra-fine pitch probe card structure
US7724009B2 (en) * 2007-02-09 2010-05-25 Mpi Corporation Method of making high-frequency probe, probe card using the high-frequency probe
KR100851392B1 (en) 2007-03-16 2008-08-11 (주)엠투엔 Probe card having planarization means
TW200900703A (en) * 2007-06-15 2009-01-01 Nictech Co Ltd Probe, probe assembly and probe card having the same
US7733102B2 (en) * 2007-07-10 2010-06-08 Taiwan Semiconductor Manufacturing Company, Ltd. Ultra-fine area array pitch probe card
TWI327876B (en) * 2007-08-23 2010-07-21 Unimicron Technology Corp Circuit board having electrical connecting structure and fabrication method thereof
KR100791945B1 (en) * 2007-08-23 2008-01-04 (주)기가레인 Probe card
KR20090075347A (en) 2008-01-04 2009-07-08 삼성전자주식회사 Bonding pad structure and method of manufacturing the bonding pad structure, and semiconductor package having the bonding pad structure
CN101644724B (en) * 2008-08-04 2012-08-08 旺矽科技股份有限公司 Probe testing device
KR100996927B1 (en) 2008-10-28 2010-11-26 윌테크놀러지(주) Space transformer and probe card having the same
JP5503898B2 (en) 2009-05-14 2014-05-28 日本電子材料株式会社 Probe unit
KR101120987B1 (en) 2009-07-08 2012-03-06 주식회사 에이엠에스티 Probe Card
US8269514B2 (en) * 2009-08-25 2012-09-18 Formfactor, Inc. Method and apparatus for multilayer support substrate
US20130069680A1 (en) * 2011-09-16 2013-03-21 Cascade Microtech, Inc. Risers including a plurality of high aspect ratio electrical conduits and systems and methods of manufacture and use therof

Also Published As

Publication number Publication date
CN102998491A (en) 2013-03-27
CN102998491B (en) 2015-04-15
US20130069686A1 (en) 2013-03-21
TW201314214A (en) 2013-04-01
TWI428608B (en) 2014-03-01
US9234917B2 (en) 2016-01-12
SG188748A1 (en) 2013-04-30
US20150185254A1 (en) 2015-07-02
SG10201600842SA (en) 2016-03-30

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