CN100357745C - Integral probe card and assembling mode - Google Patents
Integral probe card and assembling mode Download PDFInfo
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- CN100357745C CN100357745C CNB200410005245XA CN200410005245A CN100357745C CN 100357745 C CN100357745 C CN 100357745C CN B200410005245X A CNB200410005245X A CN B200410005245XA CN 200410005245 A CN200410005245 A CN 200410005245A CN 100357745 C CN100357745 C CN 100357745C
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Abstract
The present invention relates to an integral probe card and an assembling mode. The integral probe card mainly comprises a plurality of probes, a circuit space converter, an elastic circuit communication connecting plate, a circuit plate and a horizontal adjustment mechanism, wherein multi-layer lines are distributed in the circuit space converter, and contact points communicated with the lines are respectively formed on two opposite end surfaces; the probes are connected to the contact points of one end surface of the circuit space converter; the elastic circuit communication connecting plate comprises a containing plate and a plurality of elastic pieces; a plurality of containing chambers with a predetermine quantity communicated with the top surface and the bottom surface are formed in the containing plate; the elastic pieces are respectively arranged in the containing chambers, and both ends of the elastic piece are bulged and exposed out of the top end and the bottom end of the containing chamber; one end of the elastic piece is conducted with a contact point on one end of the circuit space converter; a plurality of lines and electrically connected points which are electrically connected with the other end of each of the elastic pieces are distributed on the circuit plate; the probes, the circuit space converter, the elastic circuit communication connecting plate and the circuit plate are orderly arranged in the horizontal adjustment mechanism so as to adjust the levelness of the circuit space converter.
Description
Technical field
The present invention is relevant with probe, specifically is meant a kind of integrated probe card and assembling mode.
Background technology
Press, often to be used at present the multiple probe pattern in the semi-conductor industry, as United States Patent (USP) the 4027935th, the 4754256th, the 5090118th, the the 5475318th and No. 6072190 ... Deng, though the structure of above-mentioned various probe, operating principle and manufacture are neither to the greatest extent identical, yet but all has multinomial shortcoming, in for example traditional probe, the pattern of its probe can generally be divided into beam type (cantilever type, as epoxy ring probe card) and rectilinear (vertical type, as cobraprobe card) two classes, this two classes probe pattern, all be with its probe (tungsten pin, plumbous pin or copper pin) be fixed on the printed circuit board (PCB) (PCB) by root with artificial assembling mode, also progressively adjust the height of probe in artificial mode, this measure not only will cause the time-consuming consumption worker when making, also will make that the probe finished product precision after the assembling is not good, and the normal stability that influences because of the flatness of probe is not good when testing.Moreover,, cause disappearances such as the high-frequency test signal weakens, cross-talk increase because the exposed partly too much and naked coating of the probe of conventional probe card can produce stray capacitance and inductance.And the deformability of probe is too small, when the flatness of circuit under test is not good, promptly can't guarantee all engaged test points effectively of all probes.
In addition, at present with the near bottleneck of the probe density of artificial assembling conventional probe card, the minimum spacing of its cantalever type probe (min pitch) is about 50 μ m, the spacing of vertical probe is then about 100 μ m, pin number (pin counts not only, the cost of higher its manufacturing of quantity number of probes) is higher, moreover with existing probe density bottleneck, must satisfy the pin of following electronic component and survey demand.
Secondly, as US2002/0080588A1 number disclosed structure of U.S. Patent Publication, wherein conduct to elastic component on the circuit board in order to the signal that probe is measured, constituted by most sweep bodies, though certain clearance is still apart arranged between each line body, still can produce noise (cross talk) to each other, make the signal that transfers on the circuit board very easily produce error, the probe that this noise is high for precision just might cause the incorrect consequence of test result.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of integrated probe card and assembling mode, can all probe of integrated moulding, significantly reduce cost of manufacture.
Another object of the present invention is to provide a kind of integrated probe card and assembling mode, can adjust the levelness of probe.
A further object of the present invention is to provide a kind of integrated probe card and assembling mode, can avoid signal to produce noise between conduction.
For achieving the above object, integrated probe card provided by the invention and assembling mode, it consists predominantly of:
The probe of some quantity;
One circuit space converter, be laid with multilayer line in it, and on two opposite end faces of this circuit space converter, form respectively that density differs and with the contact of this each line conduction, one end of these probes is engaged on the higher end face contact of density, makes electrically can being conducted to by circuit on the lower contact of density of these probes;
One flexible circuit is linked up web joint, includes a ccontaining plate and plurality of elastic part; This ccontaining intralamellar part is formed with some predetermined quantities and the logical room that passes through top, bottom surface, this each elastic component has electric conductivity and elasticity is upheld in predetermined compression, place respectively in each room of this ccontaining plate, and the two ends that make this each elastic component are slightly protruding is exposed to outside this room top and bottom ends, and contact and conducting with the lower contact of one end and this circuit space converter upper density;
One circuit board, on one end, be laid with some circuits and connect a little, each elastic component other end of linking up web joint with this flexible circuit connects,, and make this elastic component be subjected to this circuit space converter and compressing of this circuit board and produce the pre-power of an elasticity of compression by the electrical signal that probe was transmitted with test;
One horizontal adjusting mechanism, in regular turn probe, circuit space converter, flexible circuit communication web joint and this circuit board are fixedly arranged in wherein, so that the levelness of this circuit space converter is adjusted, and by the pre-power of the compression of this elastic component in addition compensating circuit space convertor and this flexible circuit link up position drop between web joint, to keep electrical conducting.
Wherein this each probe is a cantilevered.
Wherein the free end of this each probe is the quadrangular pyramid shape.
Wherein these probes are made by nickel cobalt (alloy).
Wherein this circuit space converter includes a multilayer ceramic substrate (MLC), be furnished with multilayer line in it, and form contact with this circuit space converter line conduction respectively in the precalculated position of this multilayer ceramic substrate top, bottom surface, and formed contactor density on this substrate top, the bottom surface, and lay by multilayer line, and make end face upper contact density higher, then lower the rearranging of bottom surface upper contact density, each probe of end face density higher contact and this is connected, and density lower contact and this flexible circuit in bottom surface linked up the web joint connection.
Wherein this circuit space converter also includes some probe bases, is formed on the end face line contacts of this multilayer ceramic substrate, links for probe.
Wherein this probe base forms in the mode of electroforming respectively with the LIGA technology.
Wherein this probe base is that nickel cobalt (alloy) (Ni-Co) is made.
Wherein this ccontaining plate is made by the insulation material.
Wherein this elastic component is a spring needle.
Wherein this elastic component is a spring.
This horizontal adjusting mechanism wherein includes the differential adjustment part that a flexible fastening plate, a backboard, are adjusted plate, a front shoe and some quantity; This backboard and this adjustment plate are spliced by some lock-connecting piece precision positionings, and this circuit board lock placed between this front shoe and this backboard, again this flexible circuit is linked up web joint, be placed in this formed holding area of front shoe central authorities, the periphery of this holding area also is formed with depression predetermined depth and gabarit and the rough identical locating slot of this circuit space converter, be positioned over wherein for this circuit space converter, again this flexible fastening plate lock is placed on the free end face of this front shoe, the central authorities of this flexible fastening plate form a saturating empty test zone, pass for this probe, the edge of this test zone also protrudes out formation one abutting part respectively, supports with this circuit space converter.
Wherein these differential adjustment parts are three groups of differential screws and ball combination, this each ball is placed in this front shoe, each differential screw is locked and this ball conflict by this adjustment plate by this again, two opposite ends of this ball are contacted at respectively between this circuit space converter and this differential screw, with by the screwing or loosen and impel ball that the circuit space converter is carried out the adjustment of surface level of each differential screw, adjust the levelness of probe with interlock.
Wherein this flexible fastening plate is a rubber-like plate.
Wherein this circuit space converter includes a multiple field circuit board, be furnished with multilayer line in it, and form contact with this circuit space converter line conduction respectively in the precalculated position of this multiple field circuit board top, bottom surface, and formed contactor density on this substrate top, the bottom surface, and by the laying of multilayer line, and make end face upper contact density higher, what the contactor density on the bottom surface was then lower rearranges, each probe of end face density higher contact and this is connected, and density lower contact and this flexible circuit in bottom surface linked up the web joint connection.
The assembling mode of integrated probe card provided by the invention, it mainly is:
The probe of some moulding is connected in an inside is laid with on the end face contact of circuit space converter of multilayer line, and the contact on the end face electrically conducts this probe and this circuit and conducts on the contact of other end thus;
Get a flexible circuit that is constituted by insulation ccontaining plate and a plurality of elastic part and link up web joint, and this ccontaining intralamellar part is formed with some predetermined quantities and the logical room that passes through top, bottom surface, this each elastic component has the elasticity of electric conductivity and predetermined compression extension, and each elastic component placed in this each room, and make outside the slightly protruding top bottom that is exposed to this room in the two ends of this each elastic component;
Get a circuit board, and on an end face wherein, be printed with circuit, and on this circuit space converter circuit, be formed with most and corresponding the connecting a little of this elastic component bottom position in order to signal that test probe imports into;
Get a horizontal adjusting mechanism, this horizontal adjusting mechanism includes the differential adjustment part of a flexible fastening plate, a backboard, adjustment plate, a front shoe and some quantity; The central authorities of this flexible fastening plate are formed with the saturating empty test zone of a top and bottom ends, and protrude out respectively in the edge of this test zone and to form a discrete abutting part, these front shoe central authorities be formed with a saturating empty holding area and one with this holding area perforation and the bigger locating slot of area, these differential adjustment parts are the combination of three groups of differential screws and ball;
At first, by some lock-connecting pieces the backboard of this horizontal adjusting mechanism is made the stacked interlocking of a precision positioning with the adjustment plate, and utilize some lock-connecting pieces lock to place between this front shoe and this backboard this circuit board, and connecting on this circuit board a little is exposed in this holding area, again this ccontaining plate is placed in the holding area of this front shoe, and connect a corresponding contact on the bottom that makes this each elastic component and this circuit board, again this circuit space converter is positioned in this locating slot, make this each probe outwardly, and the line contacts of other end, then support and press with the top of this each elastic component, make these each elastic component two ends be subjected to this circuit space converter and compressing of this circuit board and produce the predetermined pre-power of compression, again this flexible fastening plate is placed on the free end face of this front shoe by some lock-connecting piece locks, this each probe can be stretched out by this test zone, and be supported by the periphery of this circuit space converter by this abutting part, enable abutment action by this locating slot and this flexible fastening plate, and the position of limiting to this circuit space converter, again this each ball is placed in this front shoe with the angle position of five equilibrium respectively, and by this each differential screw is locked by this adjustment plate and is passed this backboard, circuit board and penetrating in this front shoe with this ball is conflicted, and makes two opposite ends of this ball contact at this circuit space converter and this differential screw respectively.
Wherein the end face contactor density that is connected with this probe on this circuit space converter is higher than the contactor density on the other end.
Description of drawings
For more deep understanding and approval being arranged, enumerate following preferred embodiment, and conjunction with figs. is illustrated in the back to purpose of the present invention and feature:
Fig. 1 to Fig. 5 is the probe moulding schematic flow sheet of a preferred embodiment of the present invention.
Fig. 6 to Fig. 8 is the schematic flow sheet that the probe of a preferred embodiment of the present invention engages with probe base.
Fig. 9 is the assembling synoptic diagram of a preferred embodiment of the present invention.
Figure 10 is another enforcement aspect partial schematic diagram of a preferred embodiment of the present invention.
Figure 11 is the three-dimensional exploded view of a preferred embodiment of the present invention.
Embodiment
See also Fig. 1 to Figure 11, be a kind of integrated probe card of a preferred embodiment provided by the present invention (100), the probe (10), a circuit space converter (20), the flexible circuit that consist predominantly of most predetermined quantities are linked up web joint (30), a circuit board (40) and a horizontal adjusting mechanism (50), wherein:
These probes (10) are made by following steps:
Step 1, preparation base material: as shown in Figure 1, get a sheet of wafer substrate (11) (annotating: be its side section shown in the figure), and finish the pre-treatment (the used base material (11) of present embodiment is a Silicon Wafer) of necessity such as cleaning, oven dry.
Step 2, on base material the etching notch: as shown in Figure 2, utilization micro-photographing process (LithographyProcess; LIGA) explication goes out geometric configuration and the position of probe tip (Probe tip), again with reactive ion etching (Reactive Ion Etching; RIE) carry out anisotropy etching (anisotropicetching) to the predetermined degree of depth, and the long trough cantilever space (12) that can finish high depth-to-width ratio (HighAspect Ratio) by the characteristic of its processing procedure, heavily cover reactive ion etching (RIE) with the end in each cantilever space (12) again and carry out anisotropy and be etched to the predetermined degree of depth (etch depth surpasses the bottom in cantilever space (12)), to form syringe needle space (13); As shown in Figure 3, (base material according to present embodiment is to select Silicon Wafer will to be dipped into the silicon etching solution by the base material after the RIE etching according to selected base material material again, its silicon etching solution can be potassium hydroxide (KOH)) in, make the etching space (14) that forms a routine pyramid (quadrangular pyramid) by the bottom of syringe needle space (13), and by KOH prescription height and accurately grasp the etch depth of syringe needle space (13), and the position, bottom that makes all etching spaces (14) is in the same degree of depth; In addition, the etching operation of this step also can form pyramidal etching space with aforementioned silicon solution earlier, again with RIE moulding cantilever space and syringe needle space; Aforementioned incorgruous etching and RIE are common technology, and its principle and the program of carefully closing are held and not given unnecessary details in addition.
Step 3, at notch bottom moulding electroforming initial layers (15) (Seed layer): as shown in Figure 4, with known sputter (sputtering) technology in these syringe needle spaces (13), etching space (14) and cantilever space (12) bottom moulding one electroforming initial layers (15), the used material of present embodiment is a conductive material, as copper, nickel or titanium ... Deng; Certainly, except sputtering way, can also evaporation (evaporation) or deposition (deposition) wait this electroforming initial layers (15) of other mode moulding.
Step 4, electroforming in notch (electro-forming) moulding syringe needle and cantilever: as shown in Figure 5, with little electroforming (micro electro-forming) technology commonly used in syringe needle space (13), etching space (14) and cantilever space (12) respectively moulding fill up the syringe needle (16) and the cantilever (17) of notch; The metal of institute's electroforming is nickel cobalt (alloy) (Ni-Co) in the present embodiment, and it has advantages such as the good and mechanical property of electric conductivity is good.
This circuit space converter (20) includes a multilayer ceramic substrate (21) (MLC), be furnished with multilayer line in it, and the precalculated position in the top of this multilayer ceramic substrate (21), on the bottom surface forms the contact with this circuit space converter line conduction respectively, and formed contactor density on this substrate (21) top, the bottom surface, and by the laying of multilayer line, and make the contactor density on the end face higher, what the contactor density on the bottom surface was then lower rearranges.
It is as follows that these adopt pin (10) and the circuit space conversion step that (20) engage of clamoring:
Step 1, set up the probe base (22) that links for probe (10) in the end face of this multilayer ceramic substrate (21): as shown in Figure 6, sentence the LIGA technology in the end face line contacts of this multilayer ceramic substrate (11) and form one in the mode of electroforming respectively and have the made probe base (22) of high rigidity metal of electric conductivity, go up in these probe bases (22) again that to lay one deck in the mode of electroplating be that the knitting layer (23) of material is as engaging usefulness with probe (10) by leypewter by nickel cobalt (alloy) (Ni-Co) or other.
Step 2, engages probe (10) and circuit space converter (20): as shown in Figure 7,, probe cantilever (17) free end end face is fixedlyed connected with the knitting layer (23) on this probe base (22) with connection process with the probe that had before prepared.
Step 3, exposed probe: as shown in Figure 8, utilize known electric paste etching (Plasma etching) technology, feed silicon etch process gas, under low-pressure state, impose voltage and make it to become electricity slurry attitude (plasma), carry out silicon etching (with base material (11), electroforming initial layers (15) etching off), and fully metal cantalever type probe (10) is exposed out.
This flexible circuit is linked up web joint (30) (Spring Connecter Plate), includes a ccontaining plate (31) and plurality of elastic part (32); Wherein this ccontaining plate (31) is made by the insulation material, and be an insulated substrate, its inside is formed with some predetermined quantities and the logical room (33) that passes through top, bottom surface, this each elastic component (32) is for having electric conductivity and the flexible member of predetermined compression extension, in present embodiment, be known spring needle Pogo pin (as shown in Figure 9), certainly can also the prepared spring needle (32 ') (as shown in figure 10) of LIGA technology; Each elastic component (32) is placed in each room (33) of this ccontaining plate (31), and make outside the slightly protruding top bottom that is exposed to this room (33) in the two ends of this each elastic component (32).
This circuit board (40) is according to the printed circuit board (PCB) of the designed manufacturing of probe signal, and is laid with predetermined circuit and connects a little on one end, and be formed with some tops in the precalculated position, the saturating empty perforation in bottom surface.
This horizontal adjusting mechanism (50), as Fig. 9 and shown in Figure 11, can be in order to adjust the levelness of probe (10), it consists predominantly of the differential adjustment part (55) of a flexible fastening plate (51), a backboard (52), adjustment plate (53), a front shoe (54) and some quantity;
This flexible fastening plate (51), generally be one to have the plate of elastic strain ability slightly, and these flexible fastening plate (5 1) central authorities form the saturating empty test zone (56) of a top and bottom ends, and protrude out formation one discrete abutting part (57) respectively in the edge of this test zone (56); This front shoe (54) central authorities be formed with one with the identical holding area (58) of this flexible circuit web joint (30) gabarit shape size, and on an end face of this front shoe (52), form a periphery depression predetermined depth and a gabarit locating slot (59) identical along this holding area (58) with this circuit space converter (20); The central authorities of this backboard (52) and this adjustment plate (53) are sky; These differential adjustment parts (55) are the combination of three groups of differential screws (551) and ball (552).
In addition, aforementioned multiple field ceramic substrate also can be a multiple field circuit board, and the same circuit of in the multiple field circuit board, laying multilayer, and in the top, on the bottom surface formation with line conduction the different contact of density, also can be used as the member of conducting probe and flexible circuit communication web joint equally.
Above-mentioned each member that is the integrated probe of the present invention (100) is introduced, and now is as follows with assembling mode of the present invention and The characteristics thereof again:
At first, splice with the precision positioning of adjustment plate (53) by the backboard (52) of some lock-connecting pieces (61) this horizontal adjusting mechanism (50), and utilize some lock-connecting pieces (62) locks to place between this front shoe (54) and this backboard (52) this circuit board (40), again this flexible circuit is linked up web joint (30), be placed in the holding area (58) of this front shoe, and end of this each elastic component (32) and printed wire on this circuit board (40) are connected contact, thereafter again this circuit space converter (20) is positioned in the locating slot (59) of this front shoe (54), make the end face that is connected with this each probe (10) outwardly, and the circuit on the other end meets the place, then with the other end butt of this each elastic component (32), these each elastic component (32) two ends are compressed and produce the predetermined pre-power of compression, again this flexible fastening plate (51) is placed on the free end face of this front shoe (54) by some lock-connecting pieces (63) lock, and make this each abutting part (57) be supported by the periphery of this circuit space converter (20), enable abutment action by this locating slot (59) and this abutting part (57), and the position of limiting to this circuit space converter (20), and these probes (10) are outside institute is piercing in the test zone (56) of this flexible fastening plate (51) certainly, the ball (552) of each differential adjustment part (55) is placed in this front shoe (54) with this again, each differential screw (551) is locked by this adjustment plate (53) and is passed this backboard (52) by this again, circuit board (40) and penetrating in this front shoe (54), conflict with this ball (552), two opposite ends of this ball (552) are contacted at respectively between this circuit space converter (20) and this differential screw (551).
In this, when testing, probe (10) enables the object signal with the desire test, transfer in the circuit of this multilayer ceramic substrate (20) by this probe (10), and with the higher signal contact of script density, lay via the multilayer line of multilayer ceramic substrate (20), dodar is to the lower signal contact of density, and by the elastic component (32) in this flexible circuit communication web joint (30) signal is put Fu and transport on this circuit board, to reach the purpose of test.
Thus, when the levelness of probe (10) does not reach the required standards, just can finely tune by the adjustment of this differential adjustment part (55), promptly utilize each differential screw (551) screw or so pine impels ball (552) multilayer ceramic substrate (20) to be carried out adjustment (because 3 principles that become one side of surface level, can carry out the surface level adjustment to multilayer ceramic substrate (20) by three groups of differential adjustment parts (55)), to reach the requirement of probe levelness; In addition, because it is as the electrical communication member between conducting multilayer ceramic substrate (20) and this circuit board (40) with elastic component (32) with elastic strain ability that this flexible circuit is linked up web joint (30), therefore when the action the levelness of probe (10) adjusted by differential adjustment part (55), variation in altitude in the time of can adjusting level by way of compensation by the elasticity of this elastic component (32) makes multilayer ceramic substrate (20) and this circuit board (40) still can keep the state of conducting.
In addition, the present invention is after forming some independent separately rooms on the ccontaining plate that utilizes insulation, just can in order to the elastic component of conduction signal after being placed in wherein, the unlikely situation that produces noise to each other that has takes place, and just can increase the testing precision of probe certainly relatively.
So integrated probe of the present invention, not only have with all probes of integrated mode moulding, to satisfy the demand that following electronic component pin is surveyed, to break through the restriction that stitch pin number is directly proportional with cost of manufacture, and the cost that reduction is made, more can adjust the levelness of probe probe, to solve the not good disappearance of known configurations levelness.
Claims (17)
1. an integrated probe card is characterized in that, consists predominantly of:
The probe of some quantity;
One circuit space converter, be laid with multilayer line in it, and on two opposite end faces of this circuit space converter, form respectively that density differs and with the contact of this each line conduction, one end of this probe is engaged on the higher end face contact of density, makes electrically can being conducted to by circuit on the lower contact of density of this probe;
One flexible circuit is linked up web joint, includes a ccontaining plate and plurality of elastic part; This ccontaining intralamellar part is formed with some predetermined quantities and the logical room that passes through top, bottom surface, this each elastic component has electric conductivity and elasticity is upheld in predetermined compression, place respectively in each room of this ccontaining plate, and the two ends that make this each elastic component are slightly protruding is exposed to outside this room top and bottom ends, and contact and conducting with the lower contact of one end and this circuit space converter upper density;
One circuit board, on one end, be laid with some circuits and connect a little, each elastic component other end of linking up web joint with this flexible circuit connects,, and make this elastic component be subjected to this circuit space converter and compressing of this circuit board and produce the pre-power of an elasticity of compression by the electrical signal that probe was transmitted with test;
One horizontal adjusting mechanism, in regular turn probe, circuit space converter, flexible circuit communication web joint and this circuit board are fixedly arranged in wherein, so that the levelness of this circuit space converter is adjusted, and by the pre-power of the compression of this elastic component in addition compensating circuit space convertor and this flexible circuit link up position drop between web joint, to keep electrical conducting.
2. according to the described integrated probe card of claim 1, it is characterized in that wherein this each probe is a cantilevered.
3. according to the described integrated probe card of claim 1, it is characterized in that wherein the free end of this each probe is the quadrangular pyramid shape.
4. according to the described integrated probe card of claim 1, it is characterized in that wherein this probe is made by nickel cobalt (alloy).
5. according to the described integrated probe card of claim 1, it is characterized in that, wherein this circuit space converter includes a multilayer ceramic substrate, be furnished with multilayer line in it, and in this multilayer ceramic substrate top, the precalculated position of bottom surface forms the contact with this circuit space converter line conduction respectively, and this substrate top, formed contactor density on the bottom surface, and lay by multilayer line, and make end face upper contact density higher, then lower the rearranging of bottom surface upper contact density, each probe of end face density higher contact and this is connected, and density lower contact and this flexible circuit in bottom surface linked up the web joint connection.
6. according to the described integrated probe card of claim 5, it is characterized in that wherein this circuit space converter also includes some probe bases, be formed on the end face line contacts of this multilayer ceramic substrate, link for probe.
7. according to the described integrated probe card of claim 6, it is characterized in that wherein this probe base forms in the mode of electroforming respectively with the micro-photographing process technology.
8. according to the described integrated probe card of claim 6, it is characterized in that wherein this probe base is that nickel cobalt (alloy) is made.
9. according to the described integrated probe card of claim 1, it is characterized in that wherein this ccontaining plate is made by the insulation material.
10. according to the described integrated probe card of claim 1, it is characterized in that wherein this elastic component is a spring needle.
11., it is characterized in that wherein this elastic component is a spring according to the described integrated probe card of claim 1.
12., it is characterized in that this horizontal adjusting mechanism wherein includes the differential adjustment part that a flexible fastening plate, a backboard, are adjusted plate, a front shoe and some quantity according to the described integrated probe card of claim 1; This backboard and this adjustment plate are spliced by some lock-connecting piece precision positionings, and this circuit board lock placed between this front shoe and this backboard, again this flexible circuit is linked up web joint, be placed in this formed holding area of front shoe central authorities, the periphery of this holding area also is formed with depression predetermined depth and gabarit and the rough identical locating slot of this circuit space converter, be positioned over wherein for this circuit space converter, again this flexible fastening plate lock is placed on the free end face of this front shoe, the central authorities of this flexible fastening plate form a saturating empty test zone, pass for this probe, the edge of this test zone also protrudes out formation one abutting part respectively, supports with this circuit space converter.
13. according to the described integrated probe card of claim 12, it is characterized in that, wherein this differential adjustment part is three groups of differential screws and ball combination, this each ball is placed in this front shoe, each differential screw is locked and this ball conflict by this adjustment plate by this again, two opposite ends of this ball are contacted at respectively between this circuit space converter and this differential screw, with by the screwing or loosen and impel ball that the circuit space converter is carried out the adjustment of surface level of each differential screw, adjust the levelness of probe with interlock.
14., it is characterized in that wherein this flexible fastening plate is a rubber-like plate according to the described integrated probe card of claim 12.
15. according to the described integrated probe card of claim 1, it is characterized in that, wherein this circuit space converter includes a multiple field circuit board, be furnished with multilayer line in it, and in this multiple field circuit board top, the precalculated position of bottom surface forms the contact with this circuit space converter line conduction respectively, and this substrate top, formed contactor density on the bottom surface, and by the laying of multilayer line, and make end face upper contact density higher, what the contactor density on the bottom surface was then lower rearranges, each probe of end face density higher contact and this is connected, and density lower contact and this flexible circuit in bottom surface linked up the web joint connection.
16. the assembling mode of an integrated probe card, it mainly is:
The probe of some moulding is connected in an inside is laid with on the end face contact of circuit space converter of multilayer line, and the contact on the end face electrically conducts this probe and this circuit and conducts on the contact of other end thus;
Get a flexible circuit that is constituted by insulation ccontaining plate and a plurality of elastic part and link up web joint, and this ccontaining intralamellar part is formed with some predetermined quantities and the logical room that passes through top, bottom surface, this each elastic component has the elasticity of electric conductivity and predetermined compression extension, and each elastic component placed in this each room, and make outside the slightly protruding top bottom that is exposed to this room in the two ends of this each elastic component;
Get a circuit board, and on an end face wherein, be printed with circuit, and on this circuit space converter circuit, be formed with most and corresponding the connecting a little of this elastic component bottom position in order to signal that test probe imports into;
Get a horizontal adjusting mechanism, this horizontal adjusting mechanism includes the differential adjustment part of a flexible fastening plate, a backboard, adjustment plate, a front shoe and some quantity; The central authorities of this flexible fastening plate are formed with the saturating empty test zone of a top and bottom ends, and protrude out respectively in the edge of this test zone and to form a discrete abutting part, these front shoe central authorities be formed with a saturating empty holding area and one with this holding area perforation and the bigger locating slot of area, this differential adjustment part is the combination of three groups of differential screws and ball;
At first, by some lock-connecting pieces the backboard of this horizontal adjusting mechanism is made the stacked interlocking of a precision positioning with the adjustment plate, and utilize some lock-connecting pieces lock to place between this front shoe and this backboard this circuit board, and connecting on this circuit board a little is exposed in this holding area, again this ccontaining plate is placed in the holding area of this front shoe, and connect a corresponding contact on the bottom that makes this each elastic component and this circuit board, again this circuit space converter is positioned in this locating slot, make this each probe outwardly, and the line contacts of other end, then support and press with the top of this each elastic component, make these each elastic component two ends be subjected to this circuit space converter and compressing of this circuit board and produce the predetermined pre-power of compression, again this flexible fastening plate is placed on the free end face of this front shoe by some lock-connecting piece locks, this each probe can be stretched out by this test zone, and be supported by the periphery of this circuit space converter by this abutting part, enable abutment action by this locating slot and this flexible fastening plate, and the position of limiting to this circuit space converter, again this each ball is placed in this front shoe with the angle position of five equilibrium respectively, and by this each differential screw is locked by this adjustment plate and is passed this backboard, circuit board and penetrating in this front shoe with this ball is conflicted, and makes two opposite ends of this ball contact at this circuit space converter and this differential screw respectively.
17. the assembling mode according to the described integrated probe card of claim 16 is characterized in that, wherein the end face contactor density that is connected with this probe on this circuit space converter is higher than the contactor density on the other end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410005245XA CN100357745C (en) | 2004-02-17 | 2004-02-17 | Integral probe card and assembling mode |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB200410005245XA CN100357745C (en) | 2004-02-17 | 2004-02-17 | Integral probe card and assembling mode |
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| CN1657949A CN1657949A (en) | 2005-08-24 |
| CN100357745C true CN100357745C (en) | 2007-12-26 |
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| CNB200410005245XA Expired - Fee Related CN100357745C (en) | 2004-02-17 | 2004-02-17 | Integral probe card and assembling mode |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106124805A (en) * | 2016-07-26 | 2016-11-16 | 苏州衡微仪器科技有限公司 | A kind of Scan Architecture of PSTM |
| TWI788723B (en) * | 2020-11-02 | 2023-01-01 | 泰可廣科技股份有限公司 | test connector |
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| US7759776B2 (en) * | 2006-03-28 | 2010-07-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Space transformer having multi-layer pad structures |
| CN101441625B (en) * | 2007-11-23 | 2010-11-03 | 上海华虹Nec电子有限公司 | Method for counting use amount of probe card by using probe card tester |
| CN102135550A (en) * | 2010-01-21 | 2011-07-27 | 思达科技股份有限公司 | Probe card |
| TWI428608B (en) * | 2011-09-16 | 2014-03-01 | Mpi Corp | Probing device and manufacturing method thereof |
| CN103245807B (en) * | 2012-02-06 | 2015-11-25 | 景美科技股份有限公司 | Probe unit structure and preparation method thereof |
| TW201437642A (en) * | 2013-03-26 | 2014-10-01 | Mpi Corp | Manufacturing method of space converter for probe card |
| TWI596344B (en) | 2016-04-27 | 2017-08-21 | Replaceable probe module probe card and its assembly method and probe module replacement side law | |
| CN113376412B (en) * | 2020-03-10 | 2023-10-10 | 台湾中华精测科技股份有限公司 | Vertical probe head and branch type probe thereof |
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| CN2491846Y (en) * | 2001-06-12 | 2002-05-15 | 吴志成 | Test probe |
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| TW510972B (en) * | 2001-05-16 | 2002-11-21 | Ind Tech Res Inst | Manufacturing method and product of microstructure probe card |
| CN1129797C (en) * | 1996-02-13 | 2003-12-03 | 日本电子材料株式会社 | Probe, manufacture of same, and vertically operative type probe card assembly employing same |
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| US20020080588A1 (en) * | 1993-11-16 | 2002-06-27 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
| CN1129797C (en) * | 1996-02-13 | 2003-12-03 | 日本电子材料株式会社 | Probe, manufacture of same, and vertically operative type probe card assembly employing same |
| CN1336549A (en) * | 2000-05-31 | 2002-02-20 | 株式会社鼎新 | Probe contacting system having plane adjusting mechanism |
| TW510972B (en) * | 2001-05-16 | 2002-11-21 | Ind Tech Res Inst | Manufacturing method and product of microstructure probe card |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106124805A (en) * | 2016-07-26 | 2016-11-16 | 苏州衡微仪器科技有限公司 | A kind of Scan Architecture of PSTM |
| TWI788723B (en) * | 2020-11-02 | 2023-01-01 | 泰可廣科技股份有限公司 | test connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1657949A (en) | 2005-08-24 |
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