KR20030065978A - Structure of a micro-cantilever type probe card - Google Patents

Abstract

PURPOSE: A structure of a probe card is provided, which controls position between probes and the whole flatness easily by installing a number of probes solidly, and enables an electrical wire arrangement easily. CONSTITUTION: A probe part(11) has an insulation substrate, and silicon probes which are formed on the insulation substrate and contact a pad of a device to be measured, and conductive wires which are connected to the probes electrically and are formed on the insulation substrate. Supporting structures(12) support each probe part, and a fixing structure(13) fixes the supporting structures. A printed circuit board(14) is combined with the fixing structure, and is connected with a measurement device transferring a measurement signal to the device to be measured electrically, and has conductive wires. And a wire connection unit connects the wires of the probes and the wires of the printed circuit board.

Description

STRUCTURE OF A MICRO-CANTILEVER TYPE PROBE CARD}

The present invention relates to a probe card (Probe Card) for inspecting the electrical characteristics of the small electronic device, and more particularly, when the probe formed by etching the silicon substrate is mounted on the main circuit board, improve the assembly characteristics and circuit The structure of the probe card to improve the ease of connection.

In general, when manufacturing an electrical circuit device such as a semiconductor integrated circuit device (Semiconductor Integrated Circuit Device), during or after the manufacturing process of the device, or before bonding the lead frame (lead frame) A check is made to see if a normal device has been formed whose measurements of the overall or partial electrical properties of the device match the design values. The inspection equipment used for the inspection of the device is a probe station, and one of the main components mounted on the probe device is a probe card.

The conventional probe card 1 is composed of two main parts, as shown in Figs. That is, one part of the probe card 1 is an elongated probe 1a like a needle, the other part structurally supports the probe 1a, and a probe device (not shown) and the probe 1a. The circuit board 1b in which the circuit which electrically connects is formed.

The probe card 1 of this structure is fixed to the lower surface of the insertion ring supported by the head plate 5 of the probe device 2 as shown in FIG. A working shelf 7 is installed below the probe card 1. The work shelf 7 is movable in three dimensions in the horizontal direction (X, Y-axis direction) and in the vertical direction (Z-axis direction). The semiconductor wafer 3 in which the element which is a measurement object was formed is arrange | positioned on the surface of the said working shelf 7. Here, the probe card 1 directly connects an electrical signal measuring device (not shown) in the probe device 2 and an electrical contact Pad 4 on a single or a plurality of elements formed on the semiconductor wafer 3. It is an electrical connection.

Briefly looking at the process of measuring the electrical characteristics of the semiconductor device using the probe device 2, first, the lower surface of the insertion ring supported by the head plate (5) of the probe device (2) In the state where the probe card 1 is mounted, the semiconductor wafer 3 on which the device as the measurement target is formed is fixed to the work shelf 7. Thereafter, the work shelf 7 is moved in the X-axis and Y-axis directions so that the positions of the probe 1a of the probe card 1 and the electrical contact 4 of the element to be measured of the semiconductor wafer 3 are adjusted. After matching up and down, the working shelf 7 is moved in the Z-axis direction so that the probe 1a and the contact 4 correspond to each other. Then, when the signal measuring device (not shown) of the probe device 2 outputs an electrical signal for measuring the electrical characteristics of the device, the electrical signal is passed through a pogo pin 6 to the probe card. It is transmitted to the circuit board 1b of (1). The electrical signal is transmitted to the tip of the probe 1a via an electrical wiring (not shown) of the circuit board 1b and is input to the device via the contact 4. Thereafter, the electrical response signal output from the device is transmitted to the probe device 2 in the reverse order of the signal transfer order.

This conventional method is called a horizontal type or a tungsten needle method. The above method is performed by fixing a tungsten probe 1a such as a fine needle having a sharply processed tip to a frame (not shown) and contacting the tip to the contact 4 of the semiconductor wafer 3. This is a method of measuring the electrical characteristics of the device formed in the).

Regarding the manufacture of a probe card using such a conventional probe, it is known in Korea Utility Model Registration No. 200,534 and the like. However, in recent years, with the high integration of semiconductor devices, the contacts of semiconductor devices have been reduced to very small sizes. Nowadays, several tens of contacts having a size of several tens of micrometers or less are arranged in a single micrometer at intervals of several micrometers.

As a result, the thickness of the tungsten probe in the conventional manner is relatively thick, such as several hundred μm, so that it is quite difficult to install as many probes on the circuit board of the probe card as necessary to measure a large number of devices simultaneously. It is also difficult to install the probe on the circuit board of the probe card so as to exactly contact the specific position of the minute contact of the device. Furthermore, since the length of the probe is long and the length of the probe is different, mutual interference between these electrical signals is likely to occur when the electrical signals are transmitted through the probes, and it is difficult to adjust the impedance. As a result, it is not possible to apply conventional methods to the measurement of fast-acting devices such as Rambus Dynamic Random Access Memory.

The method developed to alleviate these problems is the vertical method. In the vertical method, fine probes are arranged on a circuit board, so that a plurality of probes can be arranged at narrow intervals. In addition, because the length of the probe is short, the electrical characteristics of the finished probe card is very excellent.

An important point in the manufacture of vertical probes is that each of the probes must be brought into contact with the corresponding contact pad of the device formed on the semiconductor wafer being measured. In addition, each probe must press the contacts with a pressure above a certain value. To this end, the tip of the probe is uniformly arranged so that the flatness is excellent, and each probe should have a certain value or more elasticity. If the probe is elastic and can cause elastic deformation, if there is a slight error in the flatness of the probe tip or an error in the position of the contact point of the device, for example, the semiconductor wafer on which the device is formed is not completely flat. Even with minor distortions, the probe card can be used to make the required electrical measurements. Techniques for making these new types of probes are disclosed in US Pat. No. 4,961,052, US Pat. No. 5,172,050, and US Pat. No. 5,723,347 and the like. The inventors of the present invention have fabricated a fine vertical probe by etching a semiconductor wafer, and have a domestic patent registration number 319,130 for a probe card having the probe attached on an insulating substrate. In addition, in connection with the present invention, a national patent registration number 278,104 concerning the manufacture of a probe card is known.

However, in the related art, position and flatness control and electrical wiring connection between probes are not easy. In addition, since all the probes are mounted on the same substrate as a set, when some of the probes fail, the entire probes must be discarded and replaced with new probes. In addition, since a separate circuit board is used between the probe and the main circuit board, the bending property of the circuit board adversely affects the probe and increases the manufacturing cost of the probe card. In addition, when the placement area of the probe is so large that the size of the substrate exceeds the limit of the probe device, it is impossible to manufacture a probe card. Furthermore, if a defect occurs in some probes while the probe card is used to measure the characteristics of the device, it is difficult to reduce the cost of using the probe card since the entire substrate needs to be replaced.

Accordingly, it is an object of the present invention to provide a structure of a probe card for easily mounting a plurality of probes with high density and easily adjusting the position and overall flatness between probes and facilitating electrical wiring connection.

Another object of the present invention is to provide a structure of a probe card in which only some defective probes are discarded and the remaining probes continue to be used even if some of the probes have a defect.

Another object of the present invention is to use a steel structure instead of a circuit board disposed between the probe and the main circuit board to prevent the adverse effects of the probe due to the bending characteristics of the circuit board and to reduce the cost of the probe card To provide structure.

It is still another object of the present invention to provide a structure of a probe card in which the arrangement area of the probe is so large that the size of the substrate exceeds the limitation of the probe device even if the size of the substrate exceeds the limitation of the probe device.

It is still another object of the present invention to provide a structure of a probe card that reduces the use cost by replacing only a portion of a substrate without replacing the entire substrate even if a defect occurs in some probes during the measurement of device characteristics.

1 is a plan view of a probe card according to the prior art.

2 is a cross-sectional view of the probe card taken along the line A-A of FIG.

3 is an exemplary view showing measurement of a semiconductor wafer using a probe device equipped with a probe card according to the prior art.

Figure 4 is a plan view showing the structure of a probe card according to the present invention.

5 is a cross-sectional view showing the structure of a probe card cut along the line B-B of FIG.

6 is an exploded perspective view of the probe card of FIG. 4.

7 is an enlarged perspective view illustrating main parts of the probe unit of FIG. 4;

Figure 8 is an illustration showing the electrical wiring connection between the probe unit and the printed circuit board, applied to the structure of the probe card according to the present invention.

Figure 9 is another exemplary diagram showing the electrical wiring connection between the probe unit and the printed circuit board, applied to the structure of the probe card according to the present invention.

10 is an enlarged view showing the pogo pin and the pogo pin fixture of FIG.

Probe card structure according to the present invention for achieving the above object is

Probe portions having an insulating substrate, silicon probes formed on the insulating substrate and in contact with pads of the device to be measured, and conductive wires electrically connected to the probes and formed on the insulating substrate; Support structures for supporting the probe portions, respectively; A fixed structure for fixing the support structures together; A printed circuit board coupled to the fixed structure and electrically connected to a measurement device for transmitting a measurement signal to the measurement target element and having conductive wires; And wire connection means for electrically connecting the wires of the probes and the wires of the printed board.

Preferably, the support structure and the fixed structure is composed of any one of Invar, Kovar, quartz and ceramic.

Preferably, the wirings of the probe unit and the wirings of the printed board are electrically connected by a flexible circuit board. In addition, the wires of the probe unit and the wires of the flexible circuit board may be electrically connected by metal wires provided by a wire bonding method, or may be electrically connected by an anisotropic conductive film.

Preferably, a capacitor for attenuation of electrical noise may be mounted on the flexible circuit board.

Preferably, the contact pad of the flexible circuit board and the contact pad of the circuit board are electrically connected by pogo pins, or the contact pad and the contact pad of the circuit board are connected to the flexible circuit board by a metal wire having a diameter of 35 μm or less. It may be electrically connected by vertical conductors of silicon rubber material arranged at a longitudinal interval of 0.07 to 0.15 mm and a horizontal interval of 0.35 mm to 0.45 mm to conduct electricity up and down.

Preferably, the probes and wires of the probe unit may be formed of a nickel plating layer or a gold plating layer, and a groove may be formed in the tip portion of the probes before the plating layer is formed.

Preferably, screws may be mounted to the support structure to adjust the three-dimensional position between the support structure and the fixed structure.

Preferably, a screw may be mounted to the fixing structure to adjust the three-dimensional position between the supporting structure and the fixing structure.

Hereinafter, a structure of a probe card according to the present invention will be described in detail with reference to the accompanying drawings.

Figure 4 is a plan view showing a probe card applied to the structure of the probe card according to the present invention, Figure 5 is a cross-sectional view of the probe card cut along the line BB of Figure 4, Figure 6 is an exploded perspective view of the probe card of Figure 4 .

4, 5 and 6, in the probe card 10 of the present invention, the probe portion 11 is fixed by an adhesive (not shown) on the approximately straight support structures 12, and the support structures 12 is mounted to a fixed structure 13 of a rectangular frame shape having a substantially rectangular hollow portion. The fixing structure 13 is fixed to the central portion of the upper surface of the approximately circular circuit board 14. A reinforcing plate 18 is provided at the center of the lower surface of the circuit board 14. As shown in FIG. 8, the probe unit 11 and the circuit board 14 are electrically connected to each other by the pogo pin 19, the flexible printed circuit (FPC) 20, and the fine metal wire 25. Is connected.

Although only three probe parts 11 are illustrated in the drawing, in practice, a plurality of necessary support structures 12 may be mounted on the fixing structure 13. The probe unit 11 is manufactured by the method described in Korean Patent Registration No. 319,130. As shown in FIG. 7, the probe 11b having elasticity is fixed in two rows on the insulating substrate 11a. A high hardness material layer is bonded to the tip portion of the probe 11b, and the metal wiring 11c is formed on the insulating substrate 11a.

In order to reduce the electrical resistance of the probe 11b and the metal wiring 11c of the probe portion 11 and increase the mechanical strength, a nickel thin film having a thickness of 1 to 30 μm on the probe 11b and the metal wiring 11c is used. Electroless plated on the nickel thin film, and a gold layer electroless plated with a thickness of 0.1 to 2 탆 is formed on the nickel thin film. In addition, when the tip portion of the probe 11b is formed of a silicon material, in order to improve electrical conductivity of the tip portion of the probe 11b, a depth of 1 to 150 μm and a groove of 1 to 50 μm ( Groove) may be electrolytically or electrolessly plated in a formed state. The groove is formed to maintain electrical conductivity even when the metal layer formed at the tip of the probe 11b is worn while the probe card is in use.

The support structure 12 is formed in a substantially straight shape by processing a material having the necessary elasticity and hardness, for example, quartz, Invar or Kovar, or ceramic, which is a kind of steel. . When selecting the material of the support structure 12, the difference in coefficient of thermal expansion between the support structure 12 and the insulating substrate 11a should be taken into account. When the difference in coefficient of thermal expansion is large, deformation of the probe unit 11 is highly likely to occur when the manufactured probe card 10 is used at a high temperature or a low temperature, and in severe cases, the probe unit 11 ) May be broken. On the other hand, the shape of the support structure 12 is preferably determined in consideration of the size of the probe portion 11, the distance between the circuit board 14 and the tip of the probe (11b). In addition, it is preferable to maintain a machining error of the support structure 12 in order to fasten with the probe unit 11.

The fixing structure 13 is for fixing the support structure 12, and a plate of a material having a necessary elasticity and hardness, for example, quartz, invar, coba or ceramic material, as shown in FIG. It has a structure like a rectangular frame having a hollow part. Although the fixed structure 13 is formed as a structure for installing three support structures 12 in the drawing, in fact, the design of the fixed structure 13 allows the desired number of support structures 12 to be installed. The fixed structure 13 can be formed. Therefore, in the related art, many restrictions are imposed on the size of the entire probe card 10 due to the size of the substrate 1b for fixing the probe 1a of the probe unit 11 of FIG. 1. Decreases.

On the other hand, when mounting the support structure 12 to the fixed structure 13, a screw that can adjust, determine, and fix the three-dimensional position of the support structure 12 in the X, Y, Z-axis direction And a spring is mounted to the fixing structure 13. This is to adjust the position of the support structure 12 to arrange the probes on the probe unit 11 at the same height at a predetermined position within the tolerance range. Opposite left and right surfaces of the fixing structure 13 include screws 15 for adjusting the left and right positions of the supporting structure 12 with respect to the upper surface of the fixing structure 13. Two on each one. Each of the support structures 12 includes an adjustment of the distance from the fixed structure 13 to adjust the relative flatness between the tips of the probes 11b on the support structure 12. One or more screws 16 for adjusting the upper and lower positions are installed, and the coupling screws 17 are coupled to the support structure 12 to the fixing structure 13 after adjustment of the flatness. One or more are installed. In addition, for example, ten screws 22 for fixing the fixing structure 13 to the circuit board 14 are provided.

In addition, the reinforcing plate 18 is installed below the circuit board 14 to prevent bending of the circuit board 14 and stable fixing of the fixing structure 13, and the steel or the fixing structure 13 and It is made of the same material. As shown in FIG. 6, the reinforcing plate 18 may be formed in the same size as the fixing structure 13, and may be adjusted as necessary in a thickness range of 1 mm to 3 cm. In FIG. 6, for convenience of description, the electrical wiring of the circuit board 14 is not shown for better understanding of the description.

In addition, the flexible circuit board 20 is mounted in the remaining area of the support structure 12 except for the installation area of the probe part 11. If necessary, the flexible circuit board 20 may be installed under the probe unit 11. At this time, one end of the electrical wiring on the flexible circuit board 20 extends from the upper surface of the support structure 12 to the end of the metal wiring of the probe unit 11 for wire rod bonding. The other end of the metal wiring of the flexible circuit board 20 is positioned under the support structure 12 to form a pogo pin contact pad 24.

The electrical wiring of the flexible circuit board 20 and the metal wiring 11c of the probe unit 11 are electrically connected to the metal wire 25 made of aluminum or gold (Au) by a wire bonding method. At this time, the pogo pin contact pads 26 corresponding to the pogo pin contact pads 24 of the flexible circuit board 20 are formed on the upper surface of the circuit board 14. Here, the flexible circuit board 20 and the circuit board 14 are arranged such that the pogo pin contact pads 24 of the flexible circuit board 20 and the pogo pin contact pads 26 of the circuit board 14 are vertically aligned. ) Is preferable.

In addition, the pogo pin fixture 27 is installed at the center of the upper surface of the circuit board 14, and the probe portion 11, the support structure 12, the fixing structure 13 and the flexible circuit board 20 thereon. This united structure is mounted. The probe 11b and the circuit board 14 are electrically connected to each other through the metal wire 25, the flexible circuit board 20, and the pogo pin 19. Here, as shown in FIG. 10, the pogo pin fixture 27 includes the pogo pin contact pads on the flexible circuit board 20 and the pogo pin contact pads of the circuit board 14. The position is set so as to connect the, the position is fixed by drilling a hole in the corresponding position of the pogo pin fixing body 27 and installing the pogo pin 19 in the hole.

Meanwhile, as illustrated in FIG. 9, the probe unit 11 and the circuit board 14 may be electrically connected by the pogo pin 19 and the flexible circuit board 20. That is, the probe part 11 is fixed on the support structure 12, and one end of the electrical wire of the flexible circuit board 20 is disposed on the end of the metal wire of the probe part 11. . In this case, an anisotropic conductive film (ACF) 21 is disposed between the flexible circuit board 20 and the probe unit 11, and the metal wiring of the flexible circuit board 20 is the anisotropic conductive film. Contact with (21). Thus, electrical wiring connection is made between the flexible circuit board 20 and the metal wiring of the probe portion 11. The other end of the metal wiring of the flexible circuit board 20 is positioned under the support structure 12 to form a pogo pin contact pad 24. Pogo pin contact pads 26 corresponding to pogo pin contact pads 24 of the flexible circuit board 14 are also formed on the circuit board 14. In this case, the flexible circuit board 20 and the circuit board 14 are arranged such that the pogo pin contact pads 24 of the flexible circuit board 20 and the pogo pin contact pads 26 of the circuit board 14 are vertically aligned. ) Is preferable. The pogo pins 19 are positioned to connect the pogo pin contact pads of the flexible circuit board 20 and the contact pads of the circuit board 14, and the hole is formed in the pogo pin fixture 27. The position is fixed by drilling and installing pogo pins in the holes.

The pogo pin fixture 27 is installed at the center of the upper surface of the circuit board 14, and the probe part 11, the support structure 12, the fixing structure 13, and the flexible circuit board 20 are integrated thereon. Structure is mounted. Therefore, the probe 11b and the circuit board 14 are electrically connected through the anisotropic conductive film 21, the flexible circuit board 20, and the pogo pin 19. Here, as shown in FIG. 10, the pogo pin fixture 27 includes the pogo pin contact pads on the flexible circuit board 20 and the pogo pin contact pads of the circuit board 14. The position is set so as to connect the, the position is fixed by drilling a hole in the corresponding position of the pogo pin fixing body 27 and installing the pogo pin 19 in the hole.

On the other hand, capacitors are often installed between the characteristic signal line and the ground line to reduce electrical noise. At this time, when the capacitor is mounted by designing the wiring on the flexible circuit board 20, the attenuation effect of the electrical noise is increased because the distance to the probe is short.

On the other hand, the contact pads of the flexible circuit board 20 and the contact pads of the circuit board 14 are arranged with metal wires having a diameter of less than 35 μm at longitudinal intervals of 0.07 to 0.15 mm and transverse intervals of 0.35 mm to 0.45 mm. It can be electrically connected by the vertical conductor of the silicone rubber material to conduct electricity up and down.

A method of manufacturing a probe card having such a structure will be described. First, the probe unit 11 is manufactured as many as desired by the method described, for example, in Korean Patent Registration No. 319,130. That is, in the probe part 11, as illustrated in FIG. 7, the probes 11b having elasticity are arranged on the insulating substrate 11a at predetermined intervals in two rows, and the tip part of the probe 11b is disposed. A high hardness material layer is bonded to the metal layer, and a metal wiring 11c is formed on the insulating substrate 11a. Here, although only two probes 11b are shown in each column for convenience of description, thousands of probes may actually exist as needed.

Then, electrolytic plating and electroless plating are performed to reduce electrical resistance and increase mechanical strength of the probe 11b and the metal wiring 11c of the probe unit 11. In more detail, a nickel thin film is deposited on the probe 11b and the metal wiring 11c by using a nickel electroless plating method to a thickness of 1 to 30 μm, and then a gold thin film is formed by using a gold electroless plating method. Deposited at a thickness of ˜2 μm.

At this time, when the tip portion of the probe 11b is formed of a silicon material, in order to improve the electrical conductivity of the tip portion of the probe 11b, 1 to 150 μm at the tip portion of the probe 11b during manufacture of the probe 11b. The electroless plating may be performed after digging a groove having a depth of 1-50 μm. The purpose of digging these grooves is to maintain electrical conductivity even when the metal layer formed on the tip of the probe 11b wears during use.

The support structure 12 is manufactured separately from the manufacture of the probe unit 11. That is, a substantially straight support structure 12 is manufactured by processing a material having a necessary elasticity and hardness, for example, a plate made of quartz, steel, Invar or Cobar, or ceramic. Here, when selecting the material of the support structure 12, the difference in thermal expansion coefficient between the support structure 12 and the insulating substrate 11a of the probe portion 11 should be taken into account. When the difference in the coefficient of thermal expansion is large, deformation of the probe unit 11 is highly likely to occur when the temperature of the probe card to be manufactured is changed to a high temperature or a low temperature, and in severe cases, the probe unit 11 Breakage of may occur. On the other hand, the shape of the support structure 12 is preferably determined in consideration of the size of the probe portion 11, the distance between the circuit board 114 and the tip of the probe 11b, the probe portion 11 It is desirable to maintain a machining error for fastening with).

Here, each of the support structures 12, the upper and lower adjustment screw 16 to adjust the distance between the fixed structure 13 to adjust the relative flatness between the tips of the probe (11b) on the support structure (12) ) Is installed at least one or less than 10, and one or more coupling screws 17 are installed to fix the support structure 12 to the fixing structure 13 after the adjustment of the flatness.

Then, the probe portion 11 is adhered to and attached to the support structure 12 by an adhesive (not shown) such as an epoxy resin, and the epoxy resin is cured at 60 degrees Celsius or more and less than 400 degrees Celsius. It is preferable to select in consideration of the use temperature of the probe card.

Subsequently, the support structure 12 is fixed to the fixing structure 13. The fixing structure 13 is for fixing the support structure 12, the material having the necessary elasticity and hardness, for example, a plate of quartz, invar, coba or ceramic material as shown in Figure 6 Process. Although the fixing structure 13 is formed to install three of the supporting structures 12 in the drawing, in fact, the fixing to install the desired number of supporting structures 12 through the design of the fixing structure 13 The structure 13 can be manufactured. Therefore, the restriction on the size of the entire probe card 10 due to the size of the substrate 11a holding the probe 11b of the probe unit 11 can be reduced.

On the other hand, when mounting the support structure 12 to the fixed structure 13, a screw that can adjust, determine, and fix the three-dimensional position of the support structure 12 in the X, Y, Z-axis direction And a spring is mounted to the fixing structure 13. This is to adjust the position of the support structure 12 to arrange the probes on the probe unit 11 at the same height at a predetermined position within the tolerance range. Opposite left and right surfaces of the fixing structure 13 include screws 15 for adjusting the left and right positions of the supporting structure 12 with respect to the upper surface of the fixing structure 13. Two on each one. Each of the support structures 12 includes an adjustment of the distance from the fixed structure 13 to adjust the relative flatness between the tips of the probes 11b on the support structure 12. One or more screws 16 for adjusting the upper and lower positions are installed, and the coupling screws 17 are coupled to the support structure 12 to the fixing structure 13 after adjustment of the flatness. One or more are installed. In addition, for example, ten screws 22 for fixing the fixing structure 13 to the circuit board 14 are provided.

Then, the support structure 12 is controlled by using a microscope and an observation camera while adjusting the three-dimensional position of the support structure 12 by the screws 15 and 16. Check that you have moved to the desired location. Once it is confirmed that the support structure 12 has moved to the desired position, the fixing structure 13 is fastened to the circuit board 14.

When the fixing structure 13 is fixed to the circuit board 14, the surface formed by the tip of the probe of the probe part 11 should have parallelism within the allowable range with respect to the circuit board 14. The fixing structure 13 is provided with three or more screws 23 that can adjust the parallelism is less than 10, three are installed in the figure. In the case where the flatness cannot be adjusted only by screws, it is also possible to mount one or more springs between the fixed board and the circuit board. In addition, in order to prevent the bending of the circuit board 14 and to stably fix the fixing structure 13, a reinforcing plate 18 made of a material such as steel or the fixing structure 13 may be installed under the circuit board 14. have. As shown in FIG. 6, the reinforcing plate 18 may be formed in the same size as the fixing structure 13, and may be adjusted as necessary in a thickness range of 1 mm to 3 cm. Meanwhile, in FIG. 6, for convenience of explanation, the electric wiring of the circuit board 14 is not shown for the sake of understanding of the description. However, it is obvious that the electric wiring is formed on the circuit board 14.

Subsequently, the electrical wiring connection between the probe unit 11 and the circuit board 14 is described, for example, in the wire bonding method described in Korean Patent Registration No. 319,130, the installation of the pogo pin 19 or the flexible circuit board 20 Among the methods such as the use, a single or a plurality of methods are selected and implemented in consideration of the shape and wiring distance of the circuit board 14. In addition, a capacitor (not shown) may be mounted on the flexible circuit board 20 in order to reduce electrical noise.

Referring to this in more detail, an example using a wire bonding method, a pogo pin and a flexible circuit board as an electrical wiring connection between the probe unit 11 and the circuit board 14 will be described with reference to FIG. 8. The part 11 is fixed on the support structure 12 and the flexible circuit board 20 is mounted on the support structure 12 in the remaining area except for the installation area of the probe part 11. If necessary, the flexible circuit board 20 may be provided under the probe unit 11. At this time, one end of the electrical wiring on the flexible circuit board 20 extends from the upper portion of the support structure 12 to near the end of the metal wiring of the probe unit 11 for wire bonding, and the flexible circuit The other end of the metal wiring on the substrate 20 is positioned under the support structure 12 to form a pogo pin contact pad 24.

Then, before the support structure 12 is installed on the fixed structure 13, the metal wires of the probe part 11 and the electric wires of the flexible circuit board 20 are made of aluminum or gold using a wire rod bonding method. It is electrically connected by the metal wire 25 of Au). Pogo pin contact pads 26 corresponding to pogo pin contact pads of the flexible circuit board 14C are also formed on the circuit board 14. The flexible circuit board 20 and the circuit board 14 may be aligned so that the pogo pin contact pads 24 of the flexible circuit board 20 and the contact pads 26 of the circuit board 14 are vertically aligned. It is desirable to design.

Then, the pogo pin fixture 27 is installed on the circuit board 14, and the probe portion 11, the support structure 12, the fixing structure 13, and the flexible circuit board 20 are merged thereon. By mounting the structure, the probe 11b and the circuit board 14 are electrically connected through the metal wire 25, the flexible circuit board 20, and the pogo pin 19.

Here, the pogo pin fixture 27 is a pogo pin contact pad of the flexible circuit board 20 for fixing the pogo pin 19 and the contact pad of the circuit board 14, as shown in FIG. The position is set to be connected, and the position is fixed by drilling a hole in the corresponding position of the pogo pin fixing body 27 and installing the pogo pin 19 in the hole.

In addition, referring to FIG. 9, another example using a pogo pin and a flexible circuit board as an electrical wiring connection between the probe unit 11 and the circuit board 14 will be described. It is fixed on the structure 12, one end of the electrical wiring of the flexible circuit board 20 is installed on the end of the metal wiring of the probe portion (11). In this case, the anisotropic conductive film 21 is disposed between the flexible circuit board 20 and the probe unit 11, and the metal wiring of the flexible circuit board 20 is in contact with the anisotropic conductive film 21. The flexible circuit board 20 is heated and pressurized to a temperature of 50 ° C to 300 ° C. Thus, electrical wiring connection is made between the flexible circuit board 20 and the metal wiring of the probe portion 11.

Here, the other end of the metal wiring of the flexible circuit board 20 is located under the support structure 12 to form a pogo pin contact pad 24. Pogo pin contact pads 26 corresponding to pogo pin contact pads 24 on the flexible circuit board 14 are also formed on the circuit board 14. In this case, the flexible circuit board 20 and the circuit board 14 are arranged such that the pogo pin contact pads 24 of the flexible circuit board 20 and the pogo pin contact pads 26 of the circuit board 14 are vertically aligned. ) Is preferable. Position the pogo pin 19 so that the pogo pin contact pad of the flexible circuit board 20 and the contact pad of the circuit board 14 can be connected, and a hole is formed in the pogo pin fixture 27. The position is fixed by drilling and installing pogo pins in the holes.

Then, the pogo pin fixture 27 is installed on the circuit board 14, and the probe portion 11, the support structure 12, the fixing structure 13, and the flexible circuit board 20 are integrated thereon. By mounting the structure, the probe 11b and the circuit board 14 are electrically connected through the anisotropic conductive film 21, the flexible circuit board 20, and the pogo pin 19.

Here, as shown in FIG. 10, the pogo pin fixture 27 connects the pogo pin contact pads of the flexible circuit board 20 fixing the pogo pins 19 to the contact pads of the circuit board 14. The position is set to be made, and the position is fixed by drilling a hole in the corresponding position of the pogo pin fixing body 27 and installing the pogo pin 19 in the hole.

On the other hand, capacitors are often installed between the characteristic signal line and the ground line to reduce electrical noise. At this time, when the capacitor is mounted by designing the wiring on the flexible circuit board 20, the attenuation effect of the electrical noise is increased because the distance to the probe is short.

As described above, according to the present invention, since the metal layer is plated in the groove of the probe and the probe tip, the life of the silicon probe card is extended, and the position and flatness control and the electrical wiring between the probes in the manufacture of the vertical probe card This facilitates the connection and reduces the manufacturing cost of the probe card by discarding only some of the defective probes that occur during the manufacturing process and continuing to use the remaining normal probes.

In addition, the improvement of the bending characteristics can be improved, and the limitation of the size of the probe card that can be manufactured can be relaxed. Moreover, the length of the entire wiring is short, and the distance between the probe and the capacitor is short when the capacitor is installed, thereby improving the electrical signal characteristics. In addition, if a defect occurs in some probes while using the probe card, only part of the probe can be replaced without changing the entire substrate, thereby reducing the cost during manufacturing and use.

On the other hand, the present invention is not limited to the contents described in the drawings and the upper description, it is obvious to those skilled in the art that various forms of modifications are possible without departing from the spirit of the invention. .

Claims (13)

Probe portions having an insulating substrate, silicon probes formed on the insulating substrate and in contact with pads of the device to be measured, and conductive wires electrically connected to the probes and formed on the insulating substrate; Support structures for supporting the probe portions, respectively; A fixed structure for fixing the support structures together; A printed circuit board coupled to the fixed structure and electrically connected to a measurement device for transmitting a measurement signal to the measurement target element and having conductive wires; And And wiring connection means for electrically connecting the wirings of the probes and the wirings of the printed board. The probe card structure of claim 1, wherein the support structure and the fixing structure are made of one of Invar, Kovar, quartz, and ceramic. The structure of a probe card of claim 1, wherein the wirings of the probe unit and the wirings of the printed board are electrically connected by a flexible circuit board. 4. The structure of a probe card according to claim 3, wherein the wirings of the probe unit and the wirings of the flexible circuit board are electrically connected by metal wires installed by a wire bonding method. The structure of a probe card according to claim 3, wherein the wirings of the probe unit and the wirings of the flexible circuit board are electrically connected by an anisotropic conductive film. 4. The structure of a probe card of claim 3, wherein a capacitor for attenuating electrical noise is mounted on the flexible circuit board. 4. The structure of claim 3, wherein a contact pad and a contact pad of the circuit board are electrically connected to the flexible circuit board by pogo pins. According to claim 3, wherein the contact pad of the flexible circuit board and the contact pad of the circuit board is a metal wire within a diameter of 35μm arranged in the longitudinal interval of 0.07 ~ 0.15mm and the horizontal interval of 0.35mm ~ 0.45mm The structure of the probe card, characterized in that electrically connected by the upper and lower conductors of silicon rubber material to conduct electricity. 4. The structure of a probe card of claim 3, wherein a plating layer is formed on the probes and the wirings of the probe unit. The structure of a probe card according to claim 9, wherein the plating layer is formed of any one of a nickel plating layer and a gold plating layer. The structure of a probe card according to claim 10, wherein a groove is formed in a tip portion of the probes before the plating layer is formed. 2. The structure of a probe card of claim 1 wherein screws are mounted to said support structure to adjust a three dimensional position between said support structure and said fixed structure. The probe card structure of claim 1, wherein a screw is mounted to the fixing structure to adjust a three-dimensional position between the supporting structure and the fixing structure.