JP2017537317A5 - - Google Patents
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- JP2017537317A5 JP2017537317A5 JP2017528095A JP2017528095A JP2017537317A5 JP 2017537317 A5 JP2017537317 A5 JP 2017537317A5 JP 2017528095 A JP2017528095 A JP 2017528095A JP 2017528095 A JP2017528095 A JP 2017528095A JP 2017537317 A5 JP2017537317 A5 JP 2017537317A5
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- Japan
- Prior art keywords
- measurement
- landscape
- metric
- pupil
- target
- Prior art date
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- 238000005259 measurement Methods 0.000 claims description 76
- 239000011229 interlayer Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 6
- 230000010287 polarization Effects 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 109
- 210000001747 pupil Anatomy 0.000 claims 28
- 230000035945 sensitivity Effects 0.000 claims 7
- 238000005286 illumination Methods 0.000 claims 4
- 238000005070 sampling Methods 0.000 claims 3
- 230000001419 dependent effect Effects 0.000 claims 2
- 238000009795 derivation Methods 0.000 claims 2
- 230000000737 periodic effect Effects 0.000 claims 2
- 238000004088 simulation Methods 0.000 claims 2
- 230000003595 spectral effect Effects 0.000 claims 2
- 238000004422 calculation algorithm Methods 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 238000011109 contamination Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 claims 1
- 238000013213 extrapolation Methods 0.000 claims 1
- 238000011002 quantification Methods 0.000 claims 1
- 230000011218 segmentation Effects 0.000 claims 1
- 238000007619 statistical method Methods 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462083891P | 2014-11-25 | 2014-11-25 | |
| US62/083,891 | 2014-11-25 | ||
| US201562100384P | 2015-01-06 | 2015-01-06 | |
| US62/100,384 | 2015-01-06 | ||
| PCT/US2015/062523 WO2016086056A1 (en) | 2014-11-25 | 2015-11-24 | Analyzing and utilizing landscapes |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020162494A Division JP7023337B2 (ja) | 2014-11-25 | 2020-09-28 | 測定方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017537317A JP2017537317A (ja) | 2017-12-14 |
| JP2017537317A5 true JP2017537317A5 (enExample) | 2019-01-10 |
| JP6770958B2 JP6770958B2 (ja) | 2020-10-21 |
Family
ID=56075006
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017528095A Active JP6770958B2 (ja) | 2014-11-25 | 2015-11-24 | ランドスケープの解析および利用 |
| JP2020162494A Active JP7023337B2 (ja) | 2014-11-25 | 2020-09-28 | 測定方法 |
| JP2022018205A Pending JP2022065040A (ja) | 2014-11-25 | 2022-02-08 | 測定方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020162494A Active JP7023337B2 (ja) | 2014-11-25 | 2020-09-28 | 測定方法 |
| JP2022018205A Pending JP2022065040A (ja) | 2014-11-25 | 2022-02-08 | 測定方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10831108B2 (enExample) |
| JP (3) | JP6770958B2 (enExample) |
| KR (1) | KR102269514B1 (enExample) |
| CN (2) | CN107078074B (enExample) |
| IL (1) | IL251972B (enExample) |
| SG (1) | SG11201703585RA (enExample) |
| TW (2) | TWI719804B (enExample) |
| WO (1) | WO2016086056A1 (enExample) |
Families Citing this family (72)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3221897A1 (en) | 2014-09-08 | 2017-09-27 | The Research Foundation Of State University Of New York | Metallic gratings and measurement methods thereof |
| CN110553602B (zh) | 2014-11-26 | 2021-10-26 | Asml荷兰有限公司 | 度量方法、计算机产品和系统 |
| CN112859541A (zh) | 2015-05-19 | 2021-05-28 | 科磊股份有限公司 | 光学系统 |
| US9995689B2 (en) * | 2015-05-22 | 2018-06-12 | Nanometrics Incorporated | Optical metrology using differential fitting |
| CN107924137B (zh) * | 2015-06-17 | 2021-03-05 | Asml荷兰有限公司 | 基于配置方案间的一致性的配置方案选择 |
| WO2017099843A1 (en) | 2015-12-08 | 2017-06-15 | Kla-Tencor Corporation | Control of amplitude and phase of diffraction orders using polarizing targets and polarized illumination |
| WO2017102304A1 (en) * | 2015-12-17 | 2017-06-22 | Asml Netherlands B.V. | Adjustment of a metrology apparatus or a measurement thereby based on a characteristic of a target measured |
| KR102738803B1 (ko) | 2016-02-24 | 2024-12-04 | 케이엘에이 코포레이션 | 광학 계측의 정확도 개선 |
| WO2017146785A1 (en) | 2016-02-25 | 2017-08-31 | Kla-Tencor Corporation | Analyzing root causes of process variation in scatterometry metrology |
| KR102188711B1 (ko) | 2016-02-26 | 2020-12-09 | 에이에스엠엘 네델란즈 비.브이. | 구조체를 측정하는 방법, 검사 장치, 리소그래피 시스템 및 디바이스 제조 방법 |
| IL262114B2 (en) | 2016-04-22 | 2023-04-01 | Asml Netherlands Bv | Determining the stack difference and correcting with the help of the stack difference |
| WO2017198422A1 (en) * | 2016-05-17 | 2017-11-23 | Asml Netherlands B.V. | Metrology robustness based on through-wavelength similarity |
| IL297496B2 (en) | 2016-07-15 | 2025-03-01 | Asml Netherlands Bv | Method and device for designing a target field for metrology |
| US10578982B2 (en) | 2016-08-17 | 2020-03-03 | Asml Netherlands B.V. | Substrate measurement recipe design of, or for, a target including a latent image |
| KR102265164B1 (ko) * | 2016-09-27 | 2021-06-15 | 에이에스엠엘 네델란즈 비.브이. | 계측 레시피 선택 |
| EP3299890A1 (en) * | 2016-09-27 | 2018-03-28 | ASML Netherlands B.V. | Metrology recipe selection |
| WO2018063625A1 (en) | 2016-09-28 | 2018-04-05 | Kla-Tencor Corporation | Direct focusing with image binning in metrology tools |
| US10527952B2 (en) * | 2016-10-25 | 2020-01-07 | Kla-Tencor Corporation | Fault discrimination and calibration of scatterometry overlay targets |
| JP6880184B2 (ja) | 2016-11-10 | 2021-06-02 | エーエスエムエル ネザーランズ ビー．ブイ． | スタック差を使用した設計及び補正 |
| JP6877541B2 (ja) | 2016-11-14 | 2021-05-26 | ケーエルエー コーポレイション | 一体型メトロロジツールを有する機能性が強化されたリソグラフィシステム |
| US10496781B2 (en) * | 2016-12-19 | 2019-12-03 | Kla Tencor Corporation | Metrology recipe generation using predicted metrology images |
| US10824079B2 (en) * | 2017-01-03 | 2020-11-03 | Kla-Tencor Corporation | Diffraction based overlay scatterometry |
| FR3062516B1 (fr) | 2017-01-30 | 2019-04-12 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de mesure du desalignement entre une premiere et une seconde zones de gravure |
| WO2018217232A1 (en) * | 2017-05-22 | 2018-11-29 | Kla-Tencor Corporation | Zonal analysis for recipe optimization and measurement |
| US10996567B2 (en) | 2017-06-14 | 2021-05-04 | Asml Netherlands B.V. | Lithographic apparatus and method |
| US11112369B2 (en) * | 2017-06-19 | 2021-09-07 | Kla-Tencor Corporation | Hybrid overlay target design for imaging-based overlay and scatterometry-based overlay |
| WO2019010325A1 (en) * | 2017-07-06 | 2019-01-10 | Kla-Tencor Corporation | ESTIMATION OF AMPLITUDE AND PHASE ASYMMETRY IN IMAGING TECHNOLOGY TO OBTAIN HIGH PRECISION IN RECOVERY METROLOGY |
| US10401738B2 (en) | 2017-08-02 | 2019-09-03 | Kla-Tencor Corporation | Overlay metrology using multiple parameter configurations |
| JP6942555B2 (ja) * | 2017-08-03 | 2021-09-29 | 東京エレクトロン株式会社 | 基板処理方法、コンピュータ記憶媒体及び基板処理システム |
| US10627720B2 (en) | 2017-08-18 | 2020-04-21 | Globalfoundries Inc. | Overlay mark structures |
| CN111052328B (zh) * | 2017-08-30 | 2021-08-03 | 科磊股份有限公司 | 根据工艺变化的计量测量参数的快速调整 |
| US10699969B2 (en) | 2017-08-30 | 2020-06-30 | Kla-Tencor Corporation | Quick adjustment of metrology measurement parameters according to process variation |
| IL273145B2 (en) * | 2017-09-11 | 2024-03-01 | Asml Netherlands Bv | Metrology in lithographic processes |
| EP3462239A1 (en) * | 2017-09-27 | 2019-04-03 | ASML Netherlands B.V. | Metrology in lithographic processes |
| US10565697B2 (en) * | 2017-10-22 | 2020-02-18 | Kla-Tencor Corporation | Utilizing overlay misregistration error estimations in imaging overlay metrology |
| US11199506B2 (en) * | 2018-02-21 | 2021-12-14 | Applied Materials Israel Ltd. | Generating a training set usable for examination of a semiconductor specimen |
| WO2019182637A1 (en) | 2018-03-19 | 2019-09-26 | Kla-Tencor Corporation | Overlay measurement using multiple wavelengths |
| US12416580B2 (en) * | 2018-05-07 | 2025-09-16 | Unm Rainforest Innovations | Method and system for in-line optical scatterometry |
| KR102586405B1 (ko) * | 2018-06-14 | 2023-10-10 | 노바 엘티디. | 반도체 제조용 측정 및 공정 제어 |
| US10962951B2 (en) | 2018-06-20 | 2021-03-30 | Kla-Tencor Corporation | Process and metrology control, process indicators and root cause analysis tools based on landscape information |
| NL2021852A (en) | 2018-08-01 | 2018-11-09 | Asml Netherlands Bv | Metrology apparatus and method for determining a characteristic of one or more structures on a substrate |
| US11410111B1 (en) * | 2018-08-08 | 2022-08-09 | Wells Fargo Bank, N.A. | Generating predicted values based on data analysis using machine learning |
| US11118903B2 (en) * | 2018-10-17 | 2021-09-14 | Kla Corporation | Efficient illumination shaping for scatterometry overlay |
| SG11202104681RA (en) | 2018-11-21 | 2021-06-29 | Kla Tencor Corp | Single cell grey scatterometry overlay targets and their measurement using varying illumination parameter(s) |
| US11119417B2 (en) * | 2018-11-21 | 2021-09-14 | Kla-Tencor Corporation | Single cell grey scatterometry overlay targets and their measurement using varying illumination parameter(s) |
| US11062928B2 (en) | 2019-10-07 | 2021-07-13 | Kla Corporation | Process optimization using design of experiments and response surface models |
| US11249400B2 (en) | 2018-12-14 | 2022-02-15 | Kla Corporation | Per-site residuals analysis for accurate metrology measurements |
| US11333982B2 (en) * | 2019-01-28 | 2022-05-17 | Kla Corporation | Scaling metric for quantifying metrology sensitivity to process variation |
| WO2020176117A1 (en) | 2019-02-22 | 2020-09-03 | Kla-Tencor Corporation | Method of measuring misregistration of semiconductor devices |
| CN114174927B (zh) * | 2019-07-04 | 2025-05-13 | Asml荷兰有限公司 | 光刻工艺及关联设备的子场控制 |
| KR102517587B1 (ko) * | 2019-07-10 | 2023-04-03 | 케이엘에이 코포레이션 | 데이터 기반 오정렬 파라미터 구성 및 측정 시스템 및 방법 |
| US11360397B2 (en) * | 2019-09-17 | 2022-06-14 | Kla Corporation | System and method for application of harmonic detectivity as a quality indicator for imaging-based overlay measurements |
| CN114556223A (zh) * | 2019-10-14 | 2022-05-27 | Asml控股股份有限公司 | 量测标记结构和确定量测标记结构的方法 |
| US12399120B2 (en) | 2019-11-01 | 2025-08-26 | Unm Rainforest Innovations | In-line angular optical multi-point scatterometry for nanomanufacturing systems |
| KR20220107006A (ko) * | 2019-11-28 | 2022-08-01 | 케이엘에이 코포레이션 | 계측 랜드스케이프에 기초한 계측 최적화를 위한 시스템 및 방법 |
| US12283503B2 (en) * | 2020-07-22 | 2025-04-22 | Applied Materials, Inc. | Substrate measurement subsystem |
| USD977504S1 (en) | 2020-07-22 | 2023-02-07 | Applied Materials, Inc. | Portion of a display panel with a graphical user interface |
| US11688616B2 (en) | 2020-07-22 | 2023-06-27 | Applied Materials, Inc. | Integrated substrate measurement system to improve manufacturing process performance |
| US11454894B2 (en) * | 2020-09-14 | 2022-09-27 | Kla Corporation | Systems and methods for scatterometric single-wavelength measurement of misregistration and amelioration thereof |
| US20220357674A1 (en) * | 2021-05-04 | 2022-11-10 | Kla Corporation | Oblique illumination for overlay metrology |
| US12406891B2 (en) | 2021-09-30 | 2025-09-02 | International Business Machines Corporation | Characterization of asymmetric material deposition for metrology |
| WO2023096704A1 (en) * | 2021-11-27 | 2023-06-01 | Kla Corporation | Improved targets for diffraction-based overlay error metrology |
| US12235624B2 (en) | 2021-12-21 | 2025-02-25 | Applied Materials, Inc. | Methods and mechanisms for adjusting process chamber parameters during substrate manufacturing |
| US12148647B2 (en) | 2022-01-25 | 2024-11-19 | Applied Materials, Inc. | Integrated substrate measurement system |
| US12339645B2 (en) | 2022-01-25 | 2025-06-24 | Applied Materials, Inc. | Estimation of chamber component conditions using substrate measurements |
| US12216455B2 (en) | 2022-01-25 | 2025-02-04 | Applied Materials, Inc. | Chamber component condition estimation using substrate measurements |
| CN115327857A (zh) * | 2022-05-30 | 2022-11-11 | 上海华力集成电路制造有限公司 | 一种量测方法、激光套刻装置、计算机存储介质及模组 |
| IL293633B2 (en) * | 2022-06-06 | 2024-06-01 | Nova Ltd | A system and method for building a library and using it in measurements on designed buildings |
| US12092966B2 (en) * | 2022-11-23 | 2024-09-17 | Kla Corporation | Device feature specific edge placement error (EPE) |
| US20240337953A1 (en) * | 2023-04-04 | 2024-10-10 | Kla Corporation | System and method for tracking real-time position for scanning overlay metrology |
| US20240402615A1 (en) * | 2023-06-02 | 2024-12-05 | Kla Corporation | Single grab pupil landscape via broadband illumination |
| EP4538794A1 (en) * | 2023-10-13 | 2025-04-16 | ASML Netherlands B.V. | Metrology method and associated metrology device |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7317531B2 (en) | 2002-12-05 | 2008-01-08 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| US7330279B2 (en) | 2002-07-25 | 2008-02-12 | Timbre Technologies, Inc. | Model and parameter selection for optical metrology |
| US7352453B2 (en) | 2003-01-17 | 2008-04-01 | Kla-Tencor Technologies Corporation | Method for process optimization and control by comparison between 2 or more measured scatterometry signals |
| KR101682838B1 (ko) | 2005-11-18 | 2016-12-12 | 케이엘에이-텐코 코포레이션 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| US7528941B2 (en) | 2006-06-01 | 2009-05-05 | Kla-Tencor Technolgies Corporation | Order selected overlay metrology |
| US7573584B2 (en) * | 2006-09-25 | 2009-08-11 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
| US7656518B2 (en) * | 2007-03-30 | 2010-02-02 | Asml Netherlands B.V. | Method of measuring asymmetry in a scatterometer, a method of measuring an overlay error in a substrate and a metrology apparatus |
| NL2006700A (en) * | 2010-06-04 | 2011-12-06 | Asml Netherlands Bv | Method and apparatus for measuring a structure on a substrate, computer program products for implementing such methods & apparatus. |
| KR101793538B1 (ko) * | 2010-07-19 | 2017-11-03 | 에이에스엠엘 네델란즈 비.브이. | 오버레이 오차를 결정하는 장치 및 방법 |
| US8666703B2 (en) * | 2010-07-22 | 2014-03-04 | Tokyo Electron Limited | Method for automated determination of an optimally parameterized scatterometry model |
| WO2012062858A1 (en) * | 2010-11-12 | 2012-05-18 | Asml Netherlands B.V. | Metrology method and apparatus, lithographic system and device manufacturing method |
| EP2694983B1 (en) * | 2011-04-06 | 2020-06-03 | KLA-Tencor Corporation | Method and system for providing a quality metric for improved process control |
| US9310296B2 (en) * | 2011-06-20 | 2016-04-12 | Kla-Tencor Corporation | Optimizing an optical parametric model for structural analysis using optical critical dimension (OCD) metrology |
| US8681413B2 (en) | 2011-06-27 | 2014-03-25 | Kla-Tencor Corporation | Illumination control |
| NL2009294A (en) * | 2011-08-30 | 2013-03-04 | Asml Netherlands Bv | Method and apparatus for determining an overlay error. |
| US20130110477A1 (en) * | 2011-10-31 | 2013-05-02 | Stilian Pandev | Process variation-based model optimization for metrology |
| US10255385B2 (en) * | 2012-03-28 | 2019-04-09 | Kla-Tencor Corporation | Model optimization approach based on spectral sensitivity |
| US9329033B2 (en) * | 2012-09-05 | 2016-05-03 | Kla-Tencor Corporation | Method for estimating and correcting misregistration target inaccuracy |
| WO2014062972A1 (en) * | 2012-10-18 | 2014-04-24 | Kla-Tencor Corporation | Symmetric target design in scatterometry overlay metrology |
| JP5992110B2 (ja) * | 2012-11-05 | 2016-09-14 | エーエスエムエル ネザーランズ ビー．ブイ． | ミクロ構造の非対称性を測定する方法および装置、位置測定方法、位置測定装置、リソグラフィ装置およびデバイス製造方法 |
| US10242290B2 (en) * | 2012-11-09 | 2019-03-26 | Kla-Tencor Corporation | Method, system, and user interface for metrology target characterization |
| NL2011816A (en) * | 2012-11-30 | 2014-06-04 | Asml Netherlands Bv | Method of determining dose and focus, inspection apparatus, patterning device, substrate and device manufacturing method. |
| US9341769B2 (en) | 2012-12-17 | 2016-05-17 | Kla-Tencor Corporation | Spectral control system |
| US9512985B2 (en) | 2013-02-22 | 2016-12-06 | Kla-Tencor Corporation | Systems for providing illumination in optical metrology |
| US9910953B2 (en) * | 2013-03-04 | 2018-03-06 | Kla-Tencor Corporation | Metrology target identification, design and verification |
| WO2014138522A1 (en) * | 2013-03-08 | 2014-09-12 | Kla-Tencor Corporation | Pupil plane calibration for scatterometry overlay measurement |
| US9909982B2 (en) * | 2013-03-08 | 2018-03-06 | Kla-Tencor Corporation | Pupil plane calibration for scatterometry overlay measurement |
| KR102124204B1 (ko) * | 2013-08-07 | 2020-06-18 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 방법 및 장치, 리소그래피 시스템 및 디바이스 제조 방법 |
| WO2015031337A1 (en) * | 2013-08-27 | 2015-03-05 | Kla-Tencor Corporation | Removing process-variation-related inaccuracies from scatterometry measurements |
| US9518916B1 (en) * | 2013-10-18 | 2016-12-13 | Kla-Tencor Corporation | Compressive sensing for metrology |
| WO2015089231A1 (en) * | 2013-12-11 | 2015-06-18 | Kla-Tencor Corporation | Target and process sensitivity analysis to requirements |
| US10365230B1 (en) * | 2014-03-19 | 2019-07-30 | Kla-Tencor Corporation | Scatterometry overlay based on reflection peak locations |
| US9851300B1 (en) * | 2014-04-04 | 2017-12-26 | Kla-Tencor Corporation | Decreasing inaccuracy due to non-periodic effects on scatterometric signals |
| WO2016037003A1 (en) * | 2014-09-03 | 2016-03-10 | Kla-Tencor Corporation | Optimizing the utilization of metrology tools |
| WO2016123552A1 (en) * | 2015-01-30 | 2016-08-04 | Kla-Tencor Corporation | Device metrology targets and methods |
| US9903711B2 (en) * | 2015-04-06 | 2018-02-27 | KLA—Tencor Corporation | Feed forward of metrology data in a metrology system |
| WO2017099843A1 (en) * | 2015-12-08 | 2017-06-15 | Kla-Tencor Corporation | Control of amplitude and phase of diffraction orders using polarizing targets and polarized illumination |
-
2015
- 2015-11-24 CN CN201580060081.7A patent/CN107078074B/zh active Active
- 2015-11-24 KR KR1020177017380A patent/KR102269514B1/ko active Active
- 2015-11-24 SG SG11201703585RA patent/SG11201703585RA/en unknown
- 2015-11-24 CN CN202011580664.1A patent/CN112698551B/zh active Active
- 2015-11-24 WO PCT/US2015/062523 patent/WO2016086056A1/en not_active Ceased
- 2015-11-24 JP JP2017528095A patent/JP6770958B2/ja active Active
- 2015-11-25 TW TW109101242A patent/TWI719804B/zh active
- 2015-11-25 TW TW104139220A patent/TWI711096B/zh active
-
2016
- 2016-06-30 US US15/198,902 patent/US10831108B2/en active Active
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2017
- 2017-04-27 IL IL251972A patent/IL251972B/en unknown
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2020
- 2020-09-28 JP JP2020162494A patent/JP7023337B2/ja active Active
-
2022
- 2022-02-08 JP JP2022018205A patent/JP2022065040A/ja active Pending
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