IL251972B - Analyzing and utilizing landscapes - Google Patents
Analyzing and utilizing landscapesInfo
- Publication number
- IL251972B IL251972B IL251972A IL25197217A IL251972B IL 251972 B IL251972 B IL 251972B IL 251972 A IL251972 A IL 251972A IL 25197217 A IL25197217 A IL 25197217A IL 251972 B IL251972 B IL 251972B
- Authority
- IL
- Israel
- Prior art keywords
- landscapes
- analysis
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- H10P74/23—
-
- H10P74/203—
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462083891P | 2014-11-25 | 2014-11-25 | |
| US201562100384P | 2015-01-06 | 2015-01-06 | |
| PCT/US2015/062523 WO2016086056A1 (en) | 2014-11-25 | 2015-11-24 | Analyzing and utilizing landscapes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL251972A0 IL251972A0 (en) | 2017-06-29 |
| IL251972B true IL251972B (en) | 2022-03-01 |
Family
ID=56075006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL251972A IL251972B (en) | 2014-11-25 | 2017-04-27 | Analyzing and utilizing landscapes |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10831108B2 (enExample) |
| JP (3) | JP6770958B2 (enExample) |
| KR (1) | KR102269514B1 (enExample) |
| CN (2) | CN112698551B (enExample) |
| IL (1) | IL251972B (enExample) |
| SG (1) | SG11201703585RA (enExample) |
| TW (2) | TWI711096B (enExample) |
| WO (1) | WO2016086056A1 (enExample) |
Families Citing this family (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10883924B2 (en) | 2014-09-08 | 2021-01-05 | The Research Foundation Of State University Of New York | Metallic gratings and measurement methods thereof |
| IL297220B2 (en) | 2014-11-26 | 2024-06-01 | Asml Netherlands Bv | Metrological method, computer product and system |
| KR102334168B1 (ko) | 2015-05-19 | 2021-12-06 | 케이엘에이 코포레이션 | 오버레이 측정을 위한 지형 위상 제어 |
| US9995689B2 (en) * | 2015-05-22 | 2018-06-12 | Nanometrics Incorporated | Optical metrology using differential fitting |
| EP3311224B1 (en) | 2015-06-17 | 2022-11-16 | ASML Netherlands B.V. | Recipe selection based on inter-recipe consistency |
| WO2017099843A1 (en) | 2015-12-08 | 2017-06-15 | Kla-Tencor Corporation | Control of amplitude and phase of diffraction orders using polarizing targets and polarized illumination |
| KR102217209B1 (ko) | 2015-12-17 | 2021-02-19 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 장치의 조정 또는 측정 타겟의 특성에 기초한 측정 |
| WO2017147261A1 (en) | 2016-02-24 | 2017-08-31 | Kla-Tencor Corporation | Accuracy improvements in optical metrology |
| WO2017146785A1 (en) | 2016-02-25 | 2017-08-31 | Kla-Tencor Corporation | Analyzing root causes of process variation in scatterometry metrology |
| CN108700829B (zh) | 2016-02-26 | 2021-05-18 | Asml荷兰有限公司 | 测量结构的方法、检查设备、光刻系统、器件制造方法 |
| CN109073992B (zh) | 2016-04-22 | 2021-09-28 | Asml荷兰有限公司 | 堆叠差异的确定和使用堆叠差异的校正 |
| KR102205364B1 (ko) * | 2016-05-17 | 2021-01-20 | 에이에스엠엘 네델란즈 비.브이. | 관통-파장 유사성에 기초한 계측 견실성 향상 기술 |
| CN109478023B (zh) * | 2016-07-15 | 2021-09-10 | Asml荷兰有限公司 | 用于量测目标场的设计的方法和设备 |
| WO2018033342A1 (en) * | 2016-08-17 | 2018-02-22 | Asml Netherlands B.V. | Substrate measurement recipe design of, or for, a target including a latent image |
| EP3299890A1 (en) * | 2016-09-27 | 2018-03-28 | ASML Netherlands B.V. | Metrology recipe selection |
| JP6855565B2 (ja) * | 2016-09-27 | 2021-04-07 | エーエスエムエル ネザーランズ ビー．ブイ． | メトロロジレシピ選択 |
| US10897566B2 (en) | 2016-09-28 | 2021-01-19 | Kla-Tencor Corporation | Direct focusing with image binning in metrology tools |
| US10527952B2 (en) * | 2016-10-25 | 2020-01-07 | Kla-Tencor Corporation | Fault discrimination and calibration of scatterometry overlay targets |
| IL266447B2 (en) * | 2016-11-10 | 2023-11-01 | Asml Netherlands Bv | Design and repair using stack diff |
| JP6877541B2 (ja) | 2016-11-14 | 2021-05-26 | ケーエルエー コーポレイション | 一体型メトロロジツールを有する機能性が強化されたリソグラフィシステム |
| US10496781B2 (en) * | 2016-12-19 | 2019-12-03 | Kla Tencor Corporation | Metrology recipe generation using predicted metrology images |
| US10824079B2 (en) * | 2017-01-03 | 2020-11-03 | Kla-Tencor Corporation | Diffraction based overlay scatterometry |
| FR3062516B1 (fr) | 2017-01-30 | 2019-04-12 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de mesure du desalignement entre une premiere et une seconde zones de gravure |
| JP6864122B2 (ja) * | 2017-05-22 | 2021-04-21 | ケーエルエー コーポレイション | レシピ最適化及び計測のためのゾーナル分析 |
| WO2018228820A1 (en) | 2017-06-14 | 2018-12-20 | Asml Netherlands B.V. | Lithographic apparatus and method |
| US11112369B2 (en) * | 2017-06-19 | 2021-09-07 | Kla-Tencor Corporation | Hybrid overlay target design for imaging-based overlay and scatterometry-based overlay |
| CN110870052B (zh) | 2017-07-06 | 2021-09-10 | 科磊股份有限公司 | 在成像技术中估计振幅及相位不对称性以在叠加计量中达到高精准度 |
| US10401738B2 (en) | 2017-08-02 | 2019-09-03 | Kla-Tencor Corporation | Overlay metrology using multiple parameter configurations |
| JP6942555B2 (ja) * | 2017-08-03 | 2021-09-29 | 東京エレクトロン株式会社 | 基板処理方法、コンピュータ記憶媒体及び基板処理システム |
| US10627720B2 (en) | 2017-08-18 | 2020-04-21 | Globalfoundries Inc. | Overlay mark structures |
| CN111052328B (zh) * | 2017-08-30 | 2021-08-03 | 科磊股份有限公司 | 根据工艺变化的计量测量参数的快速调整 |
| US10699969B2 (en) | 2017-08-30 | 2020-06-30 | Kla-Tencor Corporation | Quick adjustment of metrology measurement parameters according to process variation |
| EP3462239A1 (en) * | 2017-09-27 | 2019-04-03 | ASML Netherlands B.V. | Metrology in lithographic processes |
| JP6979529B2 (ja) * | 2017-09-11 | 2021-12-15 | エーエスエムエル ネザーランズ ビー．ブイ． | リソグラフィプロセスにおける計測 |
| WO2019078901A1 (en) * | 2017-10-22 | 2019-04-25 | Kla-Tencor Corporation | USE OF OVERLAY DISTORTION ERROR ESTIMATES IN IMAGING OVERLAY METROLOGY |
| US11199506B2 (en) * | 2018-02-21 | 2021-12-14 | Applied Materials Israel Ltd. | Generating a training set usable for examination of a semiconductor specimen |
| CN111801622B (zh) * | 2018-03-19 | 2024-03-01 | 科磊股份有限公司 | 使用多个波长的叠加测量 |
| US12416580B2 (en) * | 2018-05-07 | 2025-09-16 | Unm Rainforest Innovations | Method and system for in-line optical scatterometry |
| WO2019239380A1 (en) * | 2018-06-14 | 2019-12-19 | Nova Measuring Instruments Ltd. | Metrology and process control for semiconductor manufacturing |
| US10962951B2 (en) | 2018-06-20 | 2021-03-30 | Kla-Tencor Corporation | Process and metrology control, process indicators and root cause analysis tools based on landscape information |
| NL2021852A (en) * | 2018-08-01 | 2018-11-09 | Asml Netherlands Bv | Metrology apparatus and method for determining a characteristic of one or more structures on a substrate |
| US11410111B1 (en) * | 2018-08-08 | 2022-08-09 | Wells Fargo Bank, N.A. | Generating predicted values based on data analysis using machine learning |
| US11118903B2 (en) * | 2018-10-17 | 2021-09-14 | Kla Corporation | Efficient illumination shaping for scatterometry overlay |
| JP7431824B2 (ja) * | 2018-11-21 | 2024-02-15 | ケーエルエー コーポレイション | スキャトロメトリオーバーレイ（ｓｃｏｌ）測定方法及びｓｃｏｌ測定システム |
| EP3870935A4 (en) | 2018-11-21 | 2022-08-31 | Kla-Tencor Corporation | GRAY SCATTEROMETRIC OVERLAY TARGETS FOR SINGLE CELLS AND THEIR MEASUREMENT USING DIFFERENT ILLUMINATION PARAMETERS |
| US11062928B2 (en) | 2019-10-07 | 2021-07-13 | Kla Corporation | Process optimization using design of experiments and response surface models |
| WO2020123014A1 (en) | 2018-12-14 | 2020-06-18 | Kla Corporation | Per-site residuals analysis for accurate metrology measurements |
| US11333982B2 (en) * | 2019-01-28 | 2022-05-17 | Kla Corporation | Scaling metric for quantifying metrology sensitivity to process variation |
| US10928739B2 (en) * | 2019-02-22 | 2021-02-23 | Kla-Tencor Corporation | Method of measuring misregistration of semiconductor devices |
| US20220244649A1 (en) * | 2019-07-04 | 2022-08-04 | Asml Netherlands B.V. | Sub-field control of a lithographic process and associated apparatus |
| KR102517587B1 (ko) * | 2019-07-10 | 2023-04-03 | 케이엘에이 코포레이션 | 데이터 기반 오정렬 파라미터 구성 및 측정 시스템 및 방법 |
| US11360397B2 (en) * | 2019-09-17 | 2022-06-14 | Kla Corporation | System and method for application of harmonic detectivity as a quality indicator for imaging-based overlay measurements |
| US20220350268A1 (en) * | 2019-10-14 | 2022-11-03 | Asml Holding N.V. | Metrology mark structure and method of determining metrology mark structure |
| WO2021087345A1 (en) | 2019-11-01 | 2021-05-06 | Unm Rainforest Innovations | In-line angular optical multi-point scatterometry for nanomanufacturing systems |
| WO2021107986A1 (en) * | 2019-11-28 | 2021-06-03 | Kla Corporation | Systems and methods for metrology optimization based on metrology landscapes |
| WO2022008135A1 (en) * | 2020-07-09 | 2022-01-13 | Asml Netherlands B.V. | Metrology method and apparatus and computer program |
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| US11454894B2 (en) | 2020-09-14 | 2022-09-27 | Kla Corporation | Systems and methods for scatterometric single-wavelength measurement of misregistration and amelioration thereof |
| US20220357674A1 (en) * | 2021-05-04 | 2022-11-10 | Kla Corporation | Oblique illumination for overlay metrology |
| US12406891B2 (en) | 2021-09-30 | 2025-09-02 | International Business Machines Corporation | Characterization of asymmetric material deposition for metrology |
| WO2023096704A1 (en) * | 2021-11-27 | 2023-06-01 | Kla Corporation | Improved targets for diffraction-based overlay error metrology |
| US12235624B2 (en) | 2021-12-21 | 2025-02-25 | Applied Materials, Inc. | Methods and mechanisms for adjusting process chamber parameters during substrate manufacturing |
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| US12148647B2 (en) | 2022-01-25 | 2024-11-19 | Applied Materials, Inc. | Integrated substrate measurement system |
| US12339645B2 (en) | 2022-01-25 | 2025-06-24 | Applied Materials, Inc. | Estimation of chamber component conditions using substrate measurements |
| CN115327857A (zh) * | 2022-05-30 | 2022-11-11 | 上海华力集成电路制造有限公司 | 一种量测方法、激光套刻装置、计算机存储介质及模组 |
| IL293633B2 (en) * | 2022-06-06 | 2024-06-01 | Nova Ltd | A system and method for building a library and using it in measurements on designed buildings |
| US12092966B2 (en) * | 2022-11-23 | 2024-09-17 | Kla Corporation | Device feature specific edge placement error (EPE) |
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| EP4538794A1 (en) * | 2023-10-13 | 2025-04-16 | ASML Netherlands B.V. | Metrology method and associated metrology device |
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| US9851300B1 (en) * | 2014-04-04 | 2017-12-26 | Kla-Tencor Corporation | Decreasing inaccuracy due to non-periodic effects on scatterometric signals |
| WO2016037003A1 (en) * | 2014-09-03 | 2016-03-10 | Kla-Tencor Corporation | Optimizing the utilization of metrology tools |
| WO2016123552A1 (en) * | 2015-01-30 | 2016-08-04 | Kla-Tencor Corporation | Device metrology targets and methods |
| US9903711B2 (en) * | 2015-04-06 | 2018-02-27 | KLA—Tencor Corporation | Feed forward of metrology data in a metrology system |
| WO2017099843A1 (en) * | 2015-12-08 | 2017-06-15 | Kla-Tencor Corporation | Control of amplitude and phase of diffraction orders using polarizing targets and polarized illumination |
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2015
- 2015-11-24 KR KR1020177017380A patent/KR102269514B1/ko active Active
- 2015-11-24 SG SG11201703585RA patent/SG11201703585RA/en unknown
- 2015-11-24 WO PCT/US2015/062523 patent/WO2016086056A1/en not_active Ceased
- 2015-11-24 CN CN202011580664.1A patent/CN112698551B/zh active Active
- 2015-11-24 CN CN201580060081.7A patent/CN107078074B/zh active Active
- 2015-11-24 JP JP2017528095A patent/JP6770958B2/ja active Active
- 2015-11-25 TW TW104139220A patent/TWI711096B/zh active
- 2015-11-25 TW TW109101242A patent/TWI719804B/zh active
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2016
- 2016-06-30 US US15/198,902 patent/US10831108B2/en active Active
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2017
- 2017-04-27 IL IL251972A patent/IL251972B/en unknown
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2020
- 2020-09-28 JP JP2020162494A patent/JP7023337B2/ja active Active
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2022
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Also Published As
| Publication number | Publication date |
|---|---|
| US20160313658A1 (en) | 2016-10-27 |
| WO2016086056A1 (en) | 2016-06-02 |
| KR20170088403A (ko) | 2017-08-01 |
| TW202018836A (zh) | 2020-05-16 |
| JP7023337B2 (ja) | 2022-02-21 |
| JP2020201293A (ja) | 2020-12-17 |
| CN112698551A (zh) | 2021-04-23 |
| JP2017537317A (ja) | 2017-12-14 |
| CN107078074B (zh) | 2021-05-25 |
| US10831108B2 (en) | 2020-11-10 |
| CN112698551B (zh) | 2024-04-23 |
| IL251972A0 (en) | 2017-06-29 |
| CN107078074A (zh) | 2017-08-18 |
| JP6770958B2 (ja) | 2020-10-21 |
| TW201633419A (zh) | 2016-09-16 |
| TWI719804B (zh) | 2021-02-21 |
| JP2022065040A (ja) | 2022-04-26 |
| SG11201703585RA (en) | 2017-06-29 |
| KR102269514B1 (ko) | 2021-06-25 |
| TWI711096B (zh) | 2020-11-21 |
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