JP4478574B2 - 製品設計および歩留りのフィードバックシステムに基づいた総括的な統合リソグラフィプロセス制御システム - Google Patents

製品設計および歩留りのフィードバックシステムに基づいた総括的な統合リソグラフィプロセス制御システム Download PDF

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Publication number
JP4478574B2
JP4478574B2 JP2004541539A JP2004541539A JP4478574B2 JP 4478574 B2 JP4478574 B2 JP 4478574B2 JP 2004541539 A JP2004541539 A JP 2004541539A JP 2004541539 A JP2004541539 A JP 2004541539A JP 4478574 B2 JP4478574 B2 JP 4478574B2
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manufacturing process
quality
parameters
manufacturing
acceptable
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JP2004541539A
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Japanese (ja)
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JP2006501673A (ja
JP2006501673A5 (enExample
Inventor
エイ． ファン コイ
シン バンウォー
ランガラジャン バラス
サブラマニアン ランクマー
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Feedback Control In General (AREA)
  • General Factory Administration (AREA)
JP2004541539A 2002-09-30 2003-09-12 製品設計および歩留りのフィードバックシステムに基づいた総括的な統合リソグラフィプロセス制御システム Expired - Lifetime JP4478574B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/261,569 US6915177B2 (en) 2002-09-30 2002-09-30 Comprehensive integrated lithographic process control system based on product design and yield feedback system
PCT/US2003/028682 WO2004031859A2 (en) 2002-09-30 2003-09-12 Comprehensive integrated lithographic process control system based on product design and yield feedback system

Publications (3)

Publication Number Publication Date
JP2006501673A JP2006501673A (ja) 2006-01-12
JP2006501673A5 JP2006501673A5 (enExample) 2009-01-15
JP4478574B2 true JP4478574B2 (ja) 2010-06-09

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JP2004541539A Expired - Lifetime JP4478574B2 (ja) 2002-09-30 2003-09-12 製品設計および歩留りのフィードバックシステムに基づいた総括的な統合リソグラフィプロセス制御システム

Country Status (9)

Country Link
US (1) US6915177B2 (enExample)
JP (1) JP4478574B2 (enExample)
KR (1) KR100994271B1 (enExample)
CN (1) CN1685492B (enExample)
AU (1) AU2003276881A1 (enExample)
DE (1) DE10393394B4 (enExample)
GB (1) GB2410834B (enExample)
TW (1) TWI332129B (enExample)
WO (1) WO2004031859A2 (enExample)

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KR101508641B1 (ko) * 2013-08-08 2015-04-08 국립대학법인 울산과학기술대학교 산학협력단 생산 공정에서 데이터마이닝을 이용하여 제품 상태를 예측하는 장치 및 방법
CN107850861B (zh) * 2015-07-16 2020-08-07 Asml荷兰有限公司 光刻设备和器件制造方法
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US10311186B2 (en) * 2016-04-12 2019-06-04 Globalfoundries Inc. Three-dimensional pattern risk scoring
CN106205528B (zh) * 2016-07-19 2019-04-16 深圳市华星光电技术有限公司 一种goa电路及液晶显示面板
EP3279737A1 (en) * 2016-08-05 2018-02-07 ASML Netherlands B.V. Diagnostic system for an industrial process
JP7229686B2 (ja) * 2017-10-06 2023-02-28 キヤノン株式会社 制御装置、リソグラフィ装置、測定装置、加工装置、平坦化装置及び物品製造方法
CN110246775B (zh) * 2018-03-09 2022-05-03 联华电子股份有限公司 控制机台操作的装置与方法
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CN111861050B (zh) * 2019-04-25 2024-02-20 富联精密电子(天津)有限公司 生产制程管控装置、方法及计算机可读存储介质
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Also Published As

Publication number Publication date
DE10393394T5 (de) 2005-08-11
AU2003276881A1 (en) 2004-04-23
TWI332129B (en) 2010-10-21
WO2004031859A3 (en) 2004-06-17
KR20050062576A (ko) 2005-06-23
AU2003276881A8 (en) 2004-04-23
CN1685492B (zh) 2012-12-26
GB2410834A (en) 2005-08-10
WO2004031859A2 (en) 2004-04-15
KR100994271B1 (ko) 2010-11-12
GB0505193D0 (en) 2005-04-20
JP2006501673A (ja) 2006-01-12
US6915177B2 (en) 2005-07-05
GB2410834B (en) 2006-04-19
CN1685492A (zh) 2005-10-19
TW200408919A (en) 2004-06-01
DE10393394B4 (de) 2016-10-13
US20040063009A1 (en) 2004-04-01

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