JP2006313943A - 半導体発光装置、その製造方法および電子撮像装置 - Google Patents

半導体発光装置、その製造方法および電子撮像装置 Download PDF

Info

Publication number
JP2006313943A
JP2006313943A JP2006226869A JP2006226869A JP2006313943A JP 2006313943 A JP2006313943 A JP 2006313943A JP 2006226869 A JP2006226869 A JP 2006226869A JP 2006226869 A JP2006226869 A JP 2006226869A JP 2006313943 A JP2006313943 A JP 2006313943A
Authority
JP
Japan
Prior art keywords
semiconductor light
light emitting
emitting device
lead frame
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006226869A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006313943A5 (https=
Inventor
Yasuji Takenaka
靖二 竹中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2006226869A priority Critical patent/JP2006313943A/ja
Publication of JP2006313943A publication Critical patent/JP2006313943A/ja
Publication of JP2006313943A5 publication Critical patent/JP2006313943A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Stroboscope Apparatuses (AREA)
JP2006226869A 2003-02-18 2006-08-23 半導体発光装置、その製造方法および電子撮像装置 Pending JP2006313943A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006226869A JP2006313943A (ja) 2003-02-18 2006-08-23 半導体発光装置、その製造方法および電子撮像装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003039609 2003-02-18
JP2006226869A JP2006313943A (ja) 2003-02-18 2006-08-23 半導体発光装置、その製造方法および電子撮像装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003419433A Division JP3910171B2 (ja) 2003-02-18 2003-12-17 半導体発光装置、その製造方法および電子撮像装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2006320490A Division JP4040664B2 (ja) 2003-02-18 2006-11-28 半導体発光装置および電子撮像装置
JP2007178756A Division JP4134251B2 (ja) 2003-02-18 2007-07-06 半導体発光装置およびカメラ付き携帯電話

Publications (2)

Publication Number Publication Date
JP2006313943A true JP2006313943A (ja) 2006-11-16
JP2006313943A5 JP2006313943A5 (https=) 2007-01-18

Family

ID=37535264

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2006226869A Pending JP2006313943A (ja) 2003-02-18 2006-08-23 半導体発光装置、その製造方法および電子撮像装置
JP2006320490A Expired - Fee Related JP4040664B2 (ja) 2003-02-18 2006-11-28 半導体発光装置および電子撮像装置
JP2007178756A Expired - Fee Related JP4134251B2 (ja) 2003-02-18 2007-07-06 半導体発光装置およびカメラ付き携帯電話

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2006320490A Expired - Fee Related JP4040664B2 (ja) 2003-02-18 2006-11-28 半導体発光装置および電子撮像装置
JP2007178756A Expired - Fee Related JP4134251B2 (ja) 2003-02-18 2007-07-06 半導体発光装置およびカメラ付き携帯電話

Country Status (1)

Country Link
JP (3) JP2006313943A (https=)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067443A (ja) * 2003-02-18 2007-03-15 Sharp Corp 半導体発光装置および電子撮像装置
WO2010026716A1 (ja) * 2008-09-03 2010-03-11 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
KR100973956B1 (ko) 2007-03-13 2010-08-05 샤프 가부시키가이샤 반도체 발광 장치, 반도체 발광 장치용 다연 리드프레임
JP2010226118A (ja) * 2006-12-28 2010-10-07 Yiguang Electronic Ind Co Ltd 発光ダイオード構造
JP2011505689A (ja) * 2007-12-03 2011-02-24 ソウル セミコンダクター カンパニー リミテッド スリム型ｌｅｄパッケージ
JP2011233821A (ja) * 2010-04-30 2011-11-17 Nichia Chem Ind Ltd 発光装置および発光装置の製造方法
JP2012199591A (ja) * 2012-06-21 2012-10-18 Rohm Co Ltd 半導体発光装置
JP2013102175A (ja) * 2012-12-25 2013-05-23 Nichia Chem Ind Ltd 光半導体装置
WO2014034205A1 (ja) * 2012-08-29 2014-03-06 オリンパスメディカルシステムズ株式会社 光源装置
US8999737B2 (en) 2013-08-27 2015-04-07 Glo Ab Method of making molded LED package
US9142745B2 (en) 2013-08-27 2015-09-22 Glo Ab Packaged LED device with castellations
US9257616B2 (en) 2013-08-27 2016-02-09 Glo Ab Molded LED package and method of making same
US10008650B2 (en) 2007-03-30 2018-06-26 Rohm Co., Ltd. Semiconductor light-emitting device

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4795293B2 (ja) 2007-03-30 2011-10-19 ローム株式会社 半導体発光装置
JP5127594B2 (ja) * 2008-06-26 2013-01-23 三菱電機株式会社 半導体パッケージ
KR100888236B1 (ko) 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
DE102009032253B4 (de) * 2009-07-08 2022-11-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil
JP5347877B2 (ja) * 2009-09-29 2013-11-20 豊田合成株式会社 発光装置
JP5471244B2 (ja) * 2009-09-29 2014-04-16 豊田合成株式会社 照明装置
JP5010716B2 (ja) 2010-01-29 2012-08-29 株式会社東芝 Ｌｅｄパッケージ
JP2011186322A (ja) * 2010-03-10 2011-09-22 Shibakawa Mfg Co Ltd 撮影用照明装置
JP2012028743A (ja) * 2010-06-22 2012-02-09 Panasonic Corp 半導体装置用パッケージおよびその製造方法ならびに半導体装置
JP2012069885A (ja) * 2010-09-27 2012-04-05 Sanken Electric Co Ltd 発光ダイオードの製造方法、発光ダイオード
JP5049382B2 (ja) * 2010-12-21 2012-10-17 パナソニック株式会社 発光装置及びそれを用いた照明装置
JP5505735B2 (ja) * 2011-09-22 2014-05-28 復盛精密工業股▲ふん▼有限公司 発光ダイオードの支持フレーム構造およびその製作方法（二）
KR102042150B1 (ko) * 2012-09-13 2019-11-07 엘지이노텍 주식회사 발광 소자 및 조명 시스템
JP7248244B2 (ja) * 2019-07-29 2023-03-29 株式会社ヴイ・エス・テクノロジ－ 環状光源を内蔵したレンズ鏡筒
JP7051921B2 (ja) * 2020-03-13 2022-04-11 ローム株式会社 半導体装置

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63200550A (ja) * 1987-02-17 1988-08-18 Matsushita Electronics Corp リ−ドフレ−ム
JPH01211956A (ja) * 1988-02-19 1989-08-25 Hitachi Ltd 面実装プラスチック・パッケージ型半導体集積回路装置及びその製造方法並びにその実装方法及び実装構造
JPH0525739U (ja) * 1991-09-11 1993-04-02 株式会社三井ハイテツク リードフレーム
JPH05144988A (ja) * 1991-11-20 1993-06-11 Fujitsu Miyagi Electron:Kk 半導体装置の製造方法並びに半導体製造装置及びリードフレーム
JPH05210148A (ja) * 1992-01-31 1993-08-20 Konica Corp レンズ付フィルムユニット
JPH05315517A (ja) * 1992-05-12 1993-11-26 Nec Corp 半導体装置
JPH1168237A (ja) * 1997-08-13 1999-03-09 Sony Corp 半導体発光装置および半導体装置
JPH11340518A (ja) * 1998-05-27 1999-12-10 Toshiba Corp 半導体発光装置
JP2001024228A (ja) * 1999-07-06 2001-01-26 Nichia Chem Ind Ltd 発光装置
JP2001036154A (ja) * 1999-02-18 2001-02-09 Nichia Chem Ind Ltd チップ部品型発光素子とその製造方法
JP2002094122A (ja) * 2000-07-13 2002-03-29 Matsushita Electric Works Ltd 光源装置及びその製造方法
US20020066905A1 (en) * 2000-06-20 2002-06-06 Bily Wang Wing-shaped surface mount package for light emitting diodes
JP2002314142A (ja) * 2001-04-09 2002-10-25 Toyoda Gosei Co Ltd 発光装置
JP2002374444A (ja) * 2001-06-12 2002-12-26 Nec Corp カメラ付き携帯端末
JP2004274027A (ja) * 2003-02-18 2004-09-30 Sharp Corp 半導体発光装置、その製造方法および電子撮像装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2994139B2 (ja) * 1992-05-21 1999-12-27 小糸工業株式会社 テレビカメラ用ｌｅｄ照明装置
JP3699783B2 (ja) * 1996-07-23 2005-09-28 株式会社シチズン電子 チップ型半導体及びその製造方法
JP3065258B2 (ja) * 1996-09-30 2000-07-17 日亜化学工業株式会社 発光装置及びそれを用いた表示装置
JP3707024B2 (ja) * 1997-04-17 2005-10-19 松下電器産業株式会社 電子部品
JP2000164933A (ja) * 1998-11-26 2000-06-16 Nippon Denyo 光源装置
JP4625997B2 (ja) * 1999-07-22 2011-02-02 日亜化学工業株式会社 発光ダイオード
JP2001267637A (ja) * 2000-03-15 2001-09-28 Nippon Aleph Corp 発光装置
JP3753629B2 (ja) * 2001-06-11 2006-03-08 シャープ株式会社 発光装置
JP2006313943A (ja) * 2003-02-18 2006-11-16 Sharp Corp 半導体発光装置、その製造方法および電子撮像装置

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63200550A (ja) * 1987-02-17 1988-08-18 Matsushita Electronics Corp リ−ドフレ−ム
JPH01211956A (ja) * 1988-02-19 1989-08-25 Hitachi Ltd 面実装プラスチック・パッケージ型半導体集積回路装置及びその製造方法並びにその実装方法及び実装構造
JPH0525739U (ja) * 1991-09-11 1993-04-02 株式会社三井ハイテツク リードフレーム
JPH05144988A (ja) * 1991-11-20 1993-06-11 Fujitsu Miyagi Electron:Kk 半導体装置の製造方法並びに半導体製造装置及びリードフレーム
JPH05210148A (ja) * 1992-01-31 1993-08-20 Konica Corp レンズ付フィルムユニット
JPH05315517A (ja) * 1992-05-12 1993-11-26 Nec Corp 半導体装置
JPH1168237A (ja) * 1997-08-13 1999-03-09 Sony Corp 半導体発光装置および半導体装置
JPH11340518A (ja) * 1998-05-27 1999-12-10 Toshiba Corp 半導体発光装置
JP2001036154A (ja) * 1999-02-18 2001-02-09 Nichia Chem Ind Ltd チップ部品型発光素子とその製造方法
JP2001024228A (ja) * 1999-07-06 2001-01-26 Nichia Chem Ind Ltd 発光装置
US20020066905A1 (en) * 2000-06-20 2002-06-06 Bily Wang Wing-shaped surface mount package for light emitting diodes
JP2002094122A (ja) * 2000-07-13 2002-03-29 Matsushita Electric Works Ltd 光源装置及びその製造方法
JP2002314142A (ja) * 2001-04-09 2002-10-25 Toyoda Gosei Co Ltd 発光装置
JP2002374444A (ja) * 2001-06-12 2002-12-26 Nec Corp カメラ付き携帯端末
JP2004274027A (ja) * 2003-02-18 2004-09-30 Sharp Corp 半導体発光装置、その製造方法および電子撮像装置

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007067443A (ja) * 2003-02-18 2007-03-15 Sharp Corp 半導体発光装置および電子撮像装置
JP2010226118A (ja) * 2006-12-28 2010-10-07 Yiguang Electronic Ind Co Ltd 発光ダイオード構造
US8415681B2 (en) 2007-03-13 2013-04-09 Sharp Kabushiki Kaisha Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device
KR100973956B1 (ko) 2007-03-13 2010-08-05 샤프 가부시키가이샤 반도체 발광 장치, 반도체 발광 장치용 다연 리드프레임
US9224930B2 (en) 2007-03-13 2015-12-29 Sharp Kabushiki Kaisha Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device
US9666776B2 (en) 2007-03-13 2017-05-30 Sharp Kabushiki Kaisha Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device
US11088307B2 (en) 2007-03-30 2021-08-10 Rohm Co., Ltd. Semiconductor light-emitting device
US10312425B2 (en) 2007-03-30 2019-06-04 Rohm Co., Ltd. Semiconductor light-emitting device
US12191435B2 (en) 2007-03-30 2025-01-07 Rohm Co., Ltd. Semiconductor light-emitting device
US10008650B2 (en) 2007-03-30 2018-06-26 Rohm Co., Ltd. Semiconductor light-emitting device
US11784295B2 (en) 2007-03-30 2023-10-10 Rohm Co., Ltd. Semiconductor light-emitting device
US9899573B2 (en) 2007-12-03 2018-02-20 Seoul Semiconductor Co., Ltd. Slim LED package
US8659050B2 (en) 2007-12-03 2014-02-25 Seoul Semiconductor Co., Ltd. Slim LED package
JP2011505689A (ja) * 2007-12-03 2011-02-24 ソウル セミコンダクター カンパニー リミテッド スリム型ｌｅｄパッケージ
US8963196B2 (en) 2007-12-03 2015-02-24 Seoul Semiconductor Co., Ltd. Slim LED package
US9530942B2 (en) 2007-12-03 2016-12-27 Seoul Semiconductor Co., Ltd. Slim LED package
US9412913B2 (en) 2007-12-03 2016-08-09 Seoul Semiconductor Co., Ltd. Slim LED package
US9287476B2 (en) 2008-09-03 2016-03-15 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
TWI635629B (zh) * 2008-09-03 2018-09-11 Nichia Corporation 發光裝置及其製造方法
KR101614975B1 (ko) 2008-09-03 2016-04-22 니치아 카가쿠 고교 가부시키가이샤 발광 장치, 수지 패키지, 수지 성형체 및 이들의 제조 방법
US12211959B2 (en) 2008-09-03 2025-01-28 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US9490411B2 (en) 2008-09-03 2016-11-08 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
WO2010026716A1 (ja) * 2008-09-03 2010-03-11 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
US9537071B2 (en) 2008-09-03 2017-01-03 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
JP2010062272A (ja) * 2008-09-03 2010-03-18 Nichia Corp 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
KR101763086B1 (ko) * 2008-09-03 2017-07-28 니치아 카가쿠 고교 가부시키가이샤 발광 장치, 수지 패키지, 수지 성형체 및 이들의 제조 방법
US8530250B2 (en) 2008-09-03 2013-09-10 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US11094854B2 (en) 2008-09-03 2021-08-17 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10700241B2 (en) 2008-09-03 2020-06-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10115870B2 (en) 2008-09-03 2018-10-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10573788B2 (en) 2008-09-03 2020-02-25 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
US10573789B2 (en) 2008-09-03 2020-02-25 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
JP2011233821A (ja) * 2010-04-30 2011-11-17 Nichia Chem Ind Ltd 発光装置および発光装置の製造方法
JP2012199591A (ja) * 2012-06-21 2012-10-18 Rohm Co Ltd 半導体発光装置
WO2014034205A1 (ja) * 2012-08-29 2014-03-06 オリンパスメディカルシステムズ株式会社 光源装置
JP2013102175A (ja) * 2012-12-25 2013-05-23 Nichia Chem Ind Ltd 光半導体装置
US9257616B2 (en) 2013-08-27 2016-02-09 Glo Ab Molded LED package and method of making same
US8999737B2 (en) 2013-08-27 2015-04-07 Glo Ab Method of making molded LED package
US9142745B2 (en) 2013-08-27 2015-09-22 Glo Ab Packaged LED device with castellations

Also Published As

Publication number Publication date
JP2007318161A (ja) 2007-12-06
JP4040664B2 (ja) 2008-01-30
JP4134251B2 (ja) 2008-08-20
JP2007067443A (ja) 2007-03-15

Similar Documents

Publication Publication Date Title
JP3910171B2 (ja) 半導体発光装置、その製造方法および電子撮像装置
JP4134251B2 (ja) 半導体発光装置およびカメラ付き携帯電話
JP4009097B2 (ja) 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム
JP4571139B2 (ja) 発光装置および発光装置の製造方法
US7183588B2 (en) Light emission device
JP5038623B2 (ja) 光半導体装置およびその製造方法
KR101096423B1 (ko) 발광장치
US8357950B2 (en) Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device
US8450764B2 (en) Semiconductor light-emitting apparatus and method of fabricating the same
US7659531B2 (en) Optical coupler package
EP1439587A1 (en) Mounting of an LED assembly with self-alignment
US9461207B2 (en) Light emitting device, and package array for light emitting device
US20140063822A1 (en) Wiring board, light-emitting device, and method of manufacturing the wiring board
JP2010199253A (ja) 光半導体装置及びその製造方法
JP4242194B2 (ja) 半導体発光装置およびその製造方法
EP2485286A2 (en) Light emitting device
JP4389263B2 (ja) 半導体発光装置の製法
JP2007150045A (ja) 半導体装置
KR102465723B1 (ko) 반도체 발광소자
KR20200121488A (ko) 반도체 발광소자
JP2004158830A (ja) 発光ダイオード
JP2002208737A (ja) 表面実装型半導体発光装置
JP2005079371A (ja) 発光ダイオード
JP2005129641A (ja) 半導体発光装置
JP2003338601A (ja) 半導体装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060823

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061128

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070123

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070222

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070522

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070620

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20070726

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20070817