JP2006310689A - ダブルアクセス型可撓性回路基板の製造方法 - Google Patents

ダブルアクセス型可撓性回路基板の製造方法 Download PDF

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Publication number
JP2006310689A
JP2006310689A JP2005134140A JP2005134140A JP2006310689A JP 2006310689 A JP2006310689 A JP 2006310689A JP 2005134140 A JP2005134140 A JP 2005134140A JP 2005134140 A JP2005134140 A JP 2005134140A JP 2006310689 A JP2006310689 A JP 2006310689A
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JP
Japan
Prior art keywords
circuit board
flexible circuit
photosensitive polyimide
wiring pattern
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005134140A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006310689A5 (zh
Inventor
Nobuyuki Sensui
水 伸 幸 泉
Hideaki Tanaka
中 秀 明 田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP2005134140A priority Critical patent/JP2006310689A/ja
Priority to TW095115470A priority patent/TWI384915B/zh
Priority to KR1020060039241A priority patent/KR20060114647A/ko
Priority to CN2006100819121A priority patent/CN1870859B/zh
Publication of JP2006310689A publication Critical patent/JP2006310689A/ja
Publication of JP2006310689A5 publication Critical patent/JP2006310689A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2005134140A 2005-05-02 2005-05-02 ダブルアクセス型可撓性回路基板の製造方法 Pending JP2006310689A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005134140A JP2006310689A (ja) 2005-05-02 2005-05-02 ダブルアクセス型可撓性回路基板の製造方法
TW095115470A TWI384915B (zh) 2005-05-02 2006-05-01 雙接達型撓性電路板的製造方法
KR1020060039241A KR20060114647A (ko) 2005-05-02 2006-05-01 더블 액세스형 가요성 회로기판의 제조방법
CN2006100819121A CN1870859B (zh) 2005-05-02 2006-05-08 两面露出型可挠性电路板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005134140A JP2006310689A (ja) 2005-05-02 2005-05-02 ダブルアクセス型可撓性回路基板の製造方法

Publications (2)

Publication Number Publication Date
JP2006310689A true JP2006310689A (ja) 2006-11-09
JP2006310689A5 JP2006310689A5 (zh) 2007-11-22

Family

ID=37444381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005134140A Pending JP2006310689A (ja) 2005-05-02 2005-05-02 ダブルアクセス型可撓性回路基板の製造方法

Country Status (4)

Country Link
JP (1) JP2006310689A (zh)
KR (1) KR20060114647A (zh)
CN (1) CN1870859B (zh)
TW (1) TWI384915B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008288422A (ja) * 2007-05-18 2008-11-27 Kinsus Interconnect Technology Corp フレキシブルプリント配線板及びその製造方法
JP2016514543A (ja) * 2013-03-26 2016-05-23 グーグル インコーポレイテッド 装着可能なデバイスに電子回路を封入するシステムおよび方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI577251B (zh) * 2015-12-01 2017-04-01 同泰電子科技股份有限公司 軟硬複合線路板及其製作方法
KR102260412B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법
KR102260413B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법
KR102260416B1 (ko) 2019-10-02 2021-06-02 한화솔루션 주식회사 더블 어세스 방식의 fpcb 제조방법

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222894A (ja) * 1988-05-17 1990-01-25 Internatl Business Mach Corp <Ibm> 基板上にポリイミド・パターンを形成する方法
JPH04206677A (ja) * 1990-11-30 1992-07-28 Hitachi Chem Co Ltd ダブルアクセスフレキシブル印刷配線板の製造方法
JPH07307564A (ja) * 1994-05-10 1995-11-21 Hitachi Chem Co Ltd 配線板の製造法
JPH0918114A (ja) * 1995-04-28 1997-01-17 Sony Chem Corp フレキシブル回路基板の製造方法
JPH09102658A (ja) * 1995-10-03 1997-04-15 Nippon Mektron Ltd 可撓性回路基板及びその製造法
JPH10224013A (ja) * 1997-02-12 1998-08-21 Nippon Mektron Ltd 回路基板の製造法
JPH10270505A (ja) * 1997-03-24 1998-10-09 Nippon Mektron Ltd 半導体装置用可撓性回路基板の製造法
JPH1117331A (ja) * 1997-06-26 1999-01-22 Nippon Mektron Ltd 可撓性回路基板の製造法
JP2000156555A (ja) * 1998-11-20 2000-06-06 Sony Chem Corp フレキシブル配線板の製造方法
JP2001313451A (ja) * 2000-04-28 2001-11-09 Nitto Denko Corp フレキシブル配線板の製造方法
JP2002043699A (ja) * 2000-07-27 2002-02-08 Sony Chem Corp フレキシブル配線板及びフレキシブル配線板製造方法
JP2002156758A (ja) * 2000-11-16 2002-05-31 Ube Ind Ltd 感光性ポリイミドを用いた高密度フレキシブル基板の製法
JP2002246732A (ja) * 2001-02-16 2002-08-30 Nitto Denko Corp 配線回路基板の製造方法
JP2003017815A (ja) * 2001-06-29 2003-01-17 Optrex Corp フレキシブル配線基板およびその製造方法

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222894A (ja) * 1988-05-17 1990-01-25 Internatl Business Mach Corp <Ibm> 基板上にポリイミド・パターンを形成する方法
JPH04206677A (ja) * 1990-11-30 1992-07-28 Hitachi Chem Co Ltd ダブルアクセスフレキシブル印刷配線板の製造方法
JPH07307564A (ja) * 1994-05-10 1995-11-21 Hitachi Chem Co Ltd 配線板の製造法
JPH0918114A (ja) * 1995-04-28 1997-01-17 Sony Chem Corp フレキシブル回路基板の製造方法
JPH09102658A (ja) * 1995-10-03 1997-04-15 Nippon Mektron Ltd 可撓性回路基板及びその製造法
JPH10224013A (ja) * 1997-02-12 1998-08-21 Nippon Mektron Ltd 回路基板の製造法
JPH10270505A (ja) * 1997-03-24 1998-10-09 Nippon Mektron Ltd 半導体装置用可撓性回路基板の製造法
JPH1117331A (ja) * 1997-06-26 1999-01-22 Nippon Mektron Ltd 可撓性回路基板の製造法
JP2000156555A (ja) * 1998-11-20 2000-06-06 Sony Chem Corp フレキシブル配線板の製造方法
JP2001313451A (ja) * 2000-04-28 2001-11-09 Nitto Denko Corp フレキシブル配線板の製造方法
JP2002043699A (ja) * 2000-07-27 2002-02-08 Sony Chem Corp フレキシブル配線板及びフレキシブル配線板製造方法
JP2002156758A (ja) * 2000-11-16 2002-05-31 Ube Ind Ltd 感光性ポリイミドを用いた高密度フレキシブル基板の製法
JP2002246732A (ja) * 2001-02-16 2002-08-30 Nitto Denko Corp 配線回路基板の製造方法
JP2003017815A (ja) * 2001-06-29 2003-01-17 Optrex Corp フレキシブル配線基板およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008288422A (ja) * 2007-05-18 2008-11-27 Kinsus Interconnect Technology Corp フレキシブルプリント配線板及びその製造方法
JP2016514543A (ja) * 2013-03-26 2016-05-23 グーグル インコーポレイテッド 装着可能なデバイスに電子回路を封入するシステムおよび方法

Also Published As

Publication number Publication date
TW200640314A (en) 2006-11-16
KR20060114647A (ko) 2006-11-07
TWI384915B (zh) 2013-02-01
CN1870859A (zh) 2006-11-29
CN1870859B (zh) 2012-06-27

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