JP2006178437A5 - - Google Patents
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- Publication number
- JP2006178437A5 JP2006178437A5 JP2005338299A JP2005338299A JP2006178437A5 JP 2006178437 A5 JP2006178437 A5 JP 2006178437A5 JP 2005338299 A JP2005338299 A JP 2005338299A JP 2005338299 A JP2005338299 A JP 2005338299A JP 2006178437 A5 JP2006178437 A5 JP 2006178437A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin composition
- compound
- carbon atoms
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 150000001875 compounds Chemical class 0.000 claims description 30
- -1 methylol group Chemical group 0.000 claims description 29
- 229920000642 polymer Polymers 0.000 claims description 25
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 23
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000011342 resin composition Substances 0.000 claims description 11
- 125000004849 alkoxymethyl group Chemical group 0.000 claims description 8
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 125000000962 organic group Chemical group 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 2
- 125000003368 amide group Chemical group 0.000 claims description 2
- 125000004185 ester group Chemical group 0.000 claims description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 125000000468 ketone group Chemical group 0.000 claims description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 125000001174 sulfone group Chemical group 0.000 claims description 2
- 125000000101 thioether group Chemical group 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims 3
- 239000012954 diazonium Substances 0.000 claims 2
- 150000001989 diazonium salts Chemical class 0.000 claims 2
- 150000004714 phosphonium salts Chemical class 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 229910018286 SbF 6 Inorganic materials 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 150000001450 anions Chemical group 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 37
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 34
- 239000002966 varnish Substances 0.000 description 28
- 239000000203 mixture Substances 0.000 description 21
- 238000011156 evaluation Methods 0.000 description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 239000004642 Polyimide Substances 0.000 description 13
- 229920001721 polyimide Polymers 0.000 description 13
- 239000002243 precursor Substances 0.000 description 13
- 239000000126 substance Substances 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 5
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- GPXCORHXFPYJEH-UHFFFAOYSA-N 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)O[Si](C)(C)CCCN GPXCORHXFPYJEH-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- LKMJVFRMDSNFRT-UHFFFAOYSA-N 2-(methoxymethyl)oxirane Chemical compound COCC1CO1 LKMJVFRMDSNFRT-UHFFFAOYSA-N 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- JXYITCJMBRETQX-UHFFFAOYSA-N 4-ethynylaniline Chemical compound NC1=CC=C(C#C)C=C1 JXYITCJMBRETQX-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- CQZCVYWWRJDZBO-UHFFFAOYSA-N diphenyliodanium;nitrate Chemical compound [O-][N+]([O-])=O.C=1C=CC=CC=1[I+]C1=CC=CC=C1 CQZCVYWWRJDZBO-UHFFFAOYSA-N 0.000 description 2
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- BWKAYBPLDRWMCJ-UHFFFAOYSA-N 1,1-diethoxy-n,n-dimethylmethanamine Chemical compound CCOC(N(C)C)OCC BWKAYBPLDRWMCJ-UHFFFAOYSA-N 0.000 description 1
- BXVXPASMKWYBFD-UHFFFAOYSA-N 2-[[2-hydroxy-3-(hydroxymethyl)-5-methylphenyl]methyl]-6-(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CC=2C(=C(CO)C=C(C)C=2)O)=C1 BXVXPASMKWYBFD-UHFFFAOYSA-N 0.000 description 1
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 1
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- YMTRNELCZAZKRB-UHFFFAOYSA-N 3-trimethoxysilylaniline Chemical compound CO[Si](OC)(OC)C1=CC=CC(N)=C1 YMTRNELCZAZKRB-UHFFFAOYSA-N 0.000 description 1
- CNODSORTHKVDEM-UHFFFAOYSA-N 4-trimethoxysilylaniline Chemical compound CO[Si](OC)(OC)C1=CC=C(N)C=C1 CNODSORTHKVDEM-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 1
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 1
- 125000003860 C1-C20 alkoxy group Chemical group 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- ZSXGLVDWWRXATF-UHFFFAOYSA-N N,N-dimethylformamide dimethyl acetal Chemical compound COC(OC)N(C)C ZSXGLVDWWRXATF-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005338299A JP4677887B2 (ja) | 2004-11-24 | 2005-11-24 | 感光性樹脂組成物 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004338702 | 2004-11-24 | ||
| JP2005338299A JP4677887B2 (ja) | 2004-11-24 | 2005-11-24 | 感光性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006178437A JP2006178437A (ja) | 2006-07-06 |
| JP2006178437A5 true JP2006178437A5 (https=) | 2008-12-18 |
| JP4677887B2 JP4677887B2 (ja) | 2011-04-27 |
Family
ID=36732563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005338299A Expired - Fee Related JP4677887B2 (ja) | 2004-11-24 | 2005-11-24 | 感光性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4677887B2 (https=) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008020573A1 (en) * | 2006-08-15 | 2008-02-21 | Asahi Kasei Emd Corporation | Positive photosensitive resin composition |
| JP4924013B2 (ja) * | 2006-12-25 | 2012-04-25 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
| WO2008099709A1 (ja) * | 2007-02-13 | 2008-08-21 | Toray Industries, Inc. | ポジ型感光性樹脂組成物 |
| CN101611350B (zh) * | 2007-02-13 | 2012-08-08 | 东丽株式会社 | 正型感光性树脂组合物 |
| US7615324B2 (en) | 2007-03-14 | 2009-11-10 | Fujifilm Corporation | Photosensitive composition, and cured relief pattern production method and semiconductor device using the same |
| JP5061703B2 (ja) * | 2007-04-25 | 2012-10-31 | 東レ株式会社 | 感光性樹脂組成物 |
| JP5115045B2 (ja) * | 2007-06-14 | 2013-01-09 | 東レ株式会社 | ポリイミドワニス |
| JP5196148B2 (ja) * | 2008-06-11 | 2013-05-15 | 住友電気工業株式会社 | 感光性樹脂組成物およびそれを用いたポリイミド樹脂膜、フレキシブルプリント配線板 |
| JP5562585B2 (ja) * | 2009-07-06 | 2014-07-30 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| KR101333704B1 (ko) | 2009-12-29 | 2013-11-27 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| KR101400192B1 (ko) * | 2010-12-31 | 2014-05-27 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자 |
| KR101229312B1 (ko) | 2011-01-03 | 2013-02-04 | 금호석유화학 주식회사 | 술포늄 화합물, 광산발생제 및 이의 제조방법 |
| JP5991063B2 (ja) * | 2012-07-31 | 2016-09-14 | 東洋インキＳｃホールディングス株式会社 | 樹脂組成物、ならびにそれを用いた塗膜 |
| JP5879088B2 (ja) * | 2011-10-14 | 2016-03-08 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、及び、硬化レリーフパターンの製造方法 |
| KR101423177B1 (ko) | 2011-12-30 | 2014-07-29 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물 |
| JP6065507B2 (ja) * | 2012-10-03 | 2017-01-25 | Jsr株式会社 | 感放射線性重合体組成物、絶縁膜および有機ｅｌ素子 |
| SG11201707976RA (en) * | 2015-04-01 | 2017-10-30 | Toray Industries | Photosensitive colored resin composition |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4587346A (en) * | 1985-01-22 | 1986-05-06 | Ciba-Geigy Corporation | Liquid 2-(2-hydroxy-3-higher branched alkyl-5-methyl-phenyl)-2H-benzotriazole mixtures, stabilized compositions and processes for preparing liquid mixtures |
| JPH0772799B2 (ja) * | 1986-08-13 | 1995-08-02 | ソニー株式会社 | レジスト材料 |
| JPH07168359A (ja) * | 1993-12-15 | 1995-07-04 | Tosoh Corp | マイクロレンズ用感光材料 |
| JP2002169283A (ja) * | 2000-11-30 | 2002-06-14 | Hitachi Chemical Dupont Microsystems Ltd | 感光性重合体組成物、パターンの製造法及び電子部品 |
| JP3773845B2 (ja) * | 2000-12-29 | 2006-05-10 | 三星電子株式会社 | ポジティブ型感光性ポリイミド前駆体およびこれを含む組成物 |
| JP4082041B2 (ja) * | 2001-02-26 | 2008-04-30 | 東レ株式会社 | ポジ型感光性樹脂前駆体組成物及びそれを用いた電子部品ならびに表示装置 |
| JP2004004703A (ja) * | 2002-04-03 | 2004-01-08 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
| JP4401196B2 (ja) * | 2003-03-10 | 2010-01-20 | 富士フイルム株式会社 | 染料含有硬化性組成物、カラーフィルタ及びその製造方法 |
-
2005
- 2005-11-24 JP JP2005338299A patent/JP4677887B2/ja not_active Expired - Fee Related
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