JP2004054254A5 - - Google Patents
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- JP2004054254A5 JP2004054254A5 JP2003150454A JP2003150454A JP2004054254A5 JP 2004054254 A5 JP2004054254 A5 JP 2004054254A5 JP 2003150454 A JP2003150454 A JP 2003150454A JP 2003150454 A JP2003150454 A JP 2003150454A JP 2004054254 A5 JP2004054254 A5 JP 2004054254A5
- Authority
- JP
- Japan
- Prior art keywords
- mol
- hours
- resin film
- nmp
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 82
- 229920005989 resin Polymers 0.000 description 57
- 239000011347 resin Substances 0.000 description 57
- 238000009835 boiling Methods 0.000 description 24
- 239000000243 solution Substances 0.000 description 23
- 239000004642 Polyimide Substances 0.000 description 22
- 229920001721 polyimide Polymers 0.000 description 22
- 239000002243 precursor Substances 0.000 description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 20
- 239000000203 mixture Substances 0.000 description 20
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 17
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 16
- 125000000962 organic group Chemical group 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 14
- 125000004432 carbon atom Chemical group C* 0.000 description 14
- 238000003786 synthesis reaction Methods 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- 239000002966 varnish Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000001914 filtration Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000002904 solvent Substances 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- ZSXGLVDWWRXATF-UHFFFAOYSA-N N,N-dimethylformamide dimethyl acetal Chemical compound COC(OC)N(C)C ZSXGLVDWWRXATF-UHFFFAOYSA-N 0.000 description 9
- 238000007865 diluting Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 239000011342 resin composition Substances 0.000 description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- -1 methylol group Chemical group 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 239000002981 blocking agent Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 150000004985 diamines Chemical class 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- 229920006015 heat resistant resin Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- GPXCORHXFPYJEH-UHFFFAOYSA-N 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)O[Si](C)(C)CCCN GPXCORHXFPYJEH-UHFFFAOYSA-N 0.000 description 4
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 4
- 229940018563 3-aminophenol Drugs 0.000 description 4
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 4
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 3
- JXYITCJMBRETQX-UHFFFAOYSA-N 4-ethynylaniline Chemical compound NC1=CC=C(C#C)C=C1 JXYITCJMBRETQX-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229940116333 ethyl lactate Drugs 0.000 description 3
- 239000003504 photosensitizing agent Substances 0.000 description 3
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 2
- UENRXLSRMCSUSN-UHFFFAOYSA-N 3,5-diaminobenzoic acid Chemical compound NC1=CC(N)=CC(C(O)=O)=C1 UENRXLSRMCSUSN-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 125000005016 hydroxyalkynyl group Chemical group 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Chemical group 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003150454A JP4333219B2 (ja) | 2002-05-29 | 2003-05-28 | 感光性樹脂組成物および耐熱性樹脂膜の製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002155460 | 2002-05-29 | ||
| JP2003150454A JP4333219B2 (ja) | 2002-05-29 | 2003-05-28 | 感光性樹脂組成物および耐熱性樹脂膜の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004054254A JP2004054254A (ja) | 2004-02-19 |
| JP2004054254A5 true JP2004054254A5 (https=) | 2006-06-29 |
| JP4333219B2 JP4333219B2 (ja) | 2009-09-16 |
Family
ID=31949018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003150454A Expired - Lifetime JP4333219B2 (ja) | 2002-05-29 | 2003-05-28 | 感光性樹脂組成物および耐熱性樹脂膜の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4333219B2 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1491952B1 (en) * | 2003-06-23 | 2015-10-07 | Sumitomo Bakelite Co., Ltd. | Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device |
| JP4556616B2 (ja) * | 2003-10-28 | 2010-10-06 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法 |
| JP4494061B2 (ja) * | 2004-03-30 | 2010-06-30 | 東京応化工業株式会社 | ポジ型レジスト組成物 |
| JP2005309032A (ja) * | 2004-04-21 | 2005-11-04 | Toray Ind Inc | ポジ型感光性樹脂組成物 |
| JP4698356B2 (ja) * | 2005-09-20 | 2011-06-08 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| WO2008020573A1 (en) * | 2006-08-15 | 2008-02-21 | Asahi Kasei Emd Corporation | Positive photosensitive resin composition |
| JP4929982B2 (ja) * | 2006-10-30 | 2012-05-09 | 住友ベークライト株式会社 | 感光性樹脂組成物、絶縁膜、保護膜および電子機器 |
| US20100062273A1 (en) * | 2007-02-19 | 2010-03-11 | Sumitomo Bakelite Co., Ltd | Photosensitive resin composition, cured film, protective film, insulating film, semiconductor device and display device using the same |
| CN101765810A (zh) * | 2007-07-26 | 2010-06-30 | 住友电木株式会社 | 喷涂用正型感光性树脂组合物、使用该喷涂用正型感光性树脂组合物的固化膜的形成方法、固化膜以及半导体装置 |
| KR20100097149A (ko) * | 2007-11-16 | 2010-09-02 | 스미또모 가가꾸 가부시키가이샤 | 슬릿상 토출구로부터 도공액을 토출하는 도포법용 도공액 |
| JP5292799B2 (ja) * | 2007-12-19 | 2013-09-18 | 凸版印刷株式会社 | 基板用支持ピン |
| JP5434027B2 (ja) * | 2008-09-24 | 2014-03-05 | 住友化学株式会社 | 有機光電変換素子 |
| EP2345933A4 (en) * | 2008-10-20 | 2013-01-23 | Sumitomo Bakelite Co | POSITIVE LIGHT-SENSITIVE RESIN COMPOSITION FOR SPRAYING COATING AND METHOD FOR PRODUCING A CONTINUOUS ELECTRODE THEREFOR |
| KR101227280B1 (ko) * | 2009-09-10 | 2013-01-28 | 도레이 카부시키가이샤 | 감광성 수지 조성물 및 감광성 수지막의 제조방법 |
| KR101333704B1 (ko) | 2009-12-29 | 2013-11-27 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| KR101728820B1 (ko) | 2013-12-12 | 2017-04-20 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자 |
| KR102245394B1 (ko) * | 2015-03-27 | 2021-04-28 | 도레이 카부시키가이샤 | 박막 트랜지스터용 감광성 수지 조성물, 경화막, 박막 트랜지스터, 액정 표시 장치 또는 유기 전계 발광 표시 장치, 경화막의 제조 방법, 박막 트랜지스터의 제조 방법 및 액정 표시 장치 또는 유기 전계 발광 표시 장치의 제조 방법 |
| JP7487518B2 (ja) * | 2020-03-27 | 2024-05-21 | 住友ベークライト株式会社 | 感光性樹脂組成物、硬化膜、硬化膜を備えるパネルレベルパッケージ及びその製造方法 |
| JP7443970B2 (ja) * | 2020-07-22 | 2024-03-06 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品 |
| CN111825348B (zh) * | 2020-08-13 | 2021-09-17 | 乐清市川嘉电气科技有限公司 | 一种多孔电致变色玻璃及其制备方法 |
| US20240176240A1 (en) * | 2021-01-22 | 2024-05-30 | Asahi Kasei Kabushiki Kaisha | Photosensitive resin composition, production method for polyimide cured film using same, and polyimide cured film |
-
2003
- 2003-05-28 JP JP2003150454A patent/JP4333219B2/ja not_active Expired - Lifetime
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