JP4677887B2 - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物 Download PDF

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Publication number
JP4677887B2
JP4677887B2 JP2005338299A JP2005338299A JP4677887B2 JP 4677887 B2 JP4677887 B2 JP 4677887B2 JP 2005338299 A JP2005338299 A JP 2005338299A JP 2005338299 A JP2005338299 A JP 2005338299A JP 4677887 B2 JP4677887 B2 JP 4677887B2
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Japan
Prior art keywords
group
compound
acid
resin composition
carbon atoms
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Expired - Fee Related
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JP2005338299A
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English (en)
Japanese (ja)
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JP2006178437A (ja
JP2006178437A5 (https=
Inventor
竜一郎 谷口
智之 弓場
真佐夫 富川
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Toray Industries Inc
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Toray Industries Inc
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Priority to JP2005338299A priority Critical patent/JP4677887B2/ja
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  • Materials For Photolithography (AREA)
  • Polyamides (AREA)
JP2005338299A 2004-11-24 2005-11-24 感光性樹脂組成物 Expired - Fee Related JP4677887B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005338299A JP4677887B2 (ja) 2004-11-24 2005-11-24 感光性樹脂組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004338702 2004-11-24
JP2005338299A JP4677887B2 (ja) 2004-11-24 2005-11-24 感光性樹脂組成物

Publications (3)

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JP2006178437A JP2006178437A (ja) 2006-07-06
JP2006178437A5 JP2006178437A5 (https=) 2008-12-18
JP4677887B2 true JP4677887B2 (ja) 2011-04-27

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ID=36732563

Family Applications (1)

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JP2005338299A Expired - Fee Related JP4677887B2 (ja) 2004-11-24 2005-11-24 感光性樹脂組成物

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JP (1) JP4677887B2 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5171628B2 (ja) * 2006-08-15 2013-03-27 旭化成イーマテリアルズ株式会社 ポジ型感光性樹脂組成物
JP4924013B2 (ja) * 2006-12-25 2012-04-25 東レ株式会社 ポジ型感光性樹脂組成物
EP2110708B1 (en) 2007-02-13 2012-12-05 Toray Industries, Inc. Positive-type photosensitive resin composition
CN101611350B (zh) * 2007-02-13 2012-08-08 东丽株式会社 正型感光性树脂组合物
EP1970761B1 (en) * 2007-03-14 2012-02-29 FUJIFILM Corporation Photosensitive composition and method of producing a cured relief pattern
JP5061703B2 (ja) * 2007-04-25 2012-10-31 東レ株式会社 感光性樹脂組成物
JP5115045B2 (ja) * 2007-06-14 2013-01-09 東レ株式会社 ポリイミドワニス
JP5196148B2 (ja) * 2008-06-11 2013-05-15 住友電気工業株式会社 感光性樹脂組成物およびそれを用いたポリイミド樹脂膜、フレキシブルプリント配線板
JP5562585B2 (ja) * 2009-07-06 2014-07-30 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
KR101333704B1 (ko) 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
KR101400192B1 (ko) * 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
KR101229312B1 (ko) 2011-01-03 2013-02-04 금호석유화학 주식회사 술포늄 화합물, 광산발생제 및 이의 제조방법
JP5991063B2 (ja) * 2012-07-31 2016-09-14 東洋インキScホールディングス株式会社 樹脂組成物、ならびにそれを用いた塗膜
JP5879088B2 (ja) * 2011-10-14 2016-03-08 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、及び、硬化レリーフパターンの製造方法
KR101423177B1 (ko) * 2011-12-30 2014-07-29 제일모직 주식회사 포지티브형 감광성 수지 조성물
JP6065507B2 (ja) * 2012-10-03 2017-01-25 Jsr株式会社 感放射線性重合体組成物、絶縁膜および有機el素子
CN107430335B (zh) * 2015-04-01 2021-04-02 东丽株式会社 感光性着色树脂组合物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587346A (en) * 1985-01-22 1986-05-06 Ciba-Geigy Corporation Liquid 2-(2-hydroxy-3-higher branched alkyl-5-methyl-phenyl)-2H-benzotriazole mixtures, stabilized compositions and processes for preparing liquid mixtures
JPH0772799B2 (ja) * 1986-08-13 1995-08-02 ソニー株式会社 レジスト材料
JPH07168359A (ja) * 1993-12-15 1995-07-04 Tosoh Corp マイクロレンズ用感光材料
JP2002169283A (ja) * 2000-11-30 2002-06-14 Hitachi Chemical Dupont Microsystems Ltd 感光性重合体組成物、パターンの製造法及び電子部品
JP3773845B2 (ja) * 2000-12-29 2006-05-10 三星電子株式会社 ポジティブ型感光性ポリイミド前駆体およびこれを含む組成物
JP4082041B2 (ja) * 2001-02-26 2008-04-30 東レ株式会社 ポジ型感光性樹脂前駆体組成物及びそれを用いた電子部品ならびに表示装置
JP2004004703A (ja) * 2002-04-03 2004-01-08 Sumitomo Chem Co Ltd ポジ型レジスト組成物
JP4401196B2 (ja) * 2003-03-10 2010-01-20 富士フイルム株式会社 染料含有硬化性組成物、カラーフィルタ及びその製造方法

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Publication number Publication date
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