JP2006173554A - ウィンドウを備えたボールグリッドアレイ基板およびその製造方法 - Google Patents
ウィンドウを備えたボールグリッドアレイ基板およびその製造方法 Download PDFInfo
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Abstract
【解決手段】回路パターンおよびワイヤボンディングパッドパターンを含み、実装されるチップの大きさに相応するウィンドウを有し、前記チップがワイヤボンディングパッドにワイヤボンディングで接続されている第1外層と、回路パターン、前記第1外層のウィンドウ領域に対応する部分およびソルダボールパッドパターンを有し、ボールパッド上にチップが実装されている第2外層と、前記第1外層と前記第2外層間に形成され、前記第1外層のウィンドウに対応する部分にウィンドウが形成された絶縁層とを含む。
【選択図】図4a
Description
101 絶縁層
102a、102b 銅箔
103a、103b 銅メッキ層
104a、104b ドライフィルム
105a、105b ソルダレジスト
106a、106b 金メッキ層
210 接着剤
220 半導体チップ
230 ワイヤボンディング
240 ソルダボール
Claims (12)
- 回路パターンおよびワイヤボンディングパッドパターンを含み、実装されるチップの大きさに相応するウィンドウを有し、前記チップがワイヤボンディングパッドにワイヤボンディングで接続されている第1外層と、
回路パターン、前記第1外層のウィンドウ領域に対応する部分およびソルダボールパッドパターンを有し、ボールパッド上にチップが実装されている第2外層と、
前記第1外層と前記第2外層間に形成され、前記第1外層のウィンドウに対応する部分にウィンドウが形成された絶縁層とを含むことを特徴とするボールグリッドアレイ基板。 - 前記ウィンドウ上に複数の半導体チップが積層されて実装されることを特徴とする請求項1記載のボールグリッドアレイ基板。
- 前記基板上に複数の基板が積層されることを特徴とする請求項1記載のボールグリッドアレイ基板。
- 前記ワイヤボンディングパッドパターン、前記ソルダボールパッドパターン、前記ウィンドウの内壁、および前記第2外層の回路パターン上に形成される第1メッキ層をさらに含むことを特徴とする請求項1ないし3のいずれか1項記載のボールグリッドアレイ基板。
- 前記ワイヤボンディングパターンと金メッキ層との間、前記ソルダボールパターンと金メッキ層との間、前記ウィンドウと金メッキ層との間、および前記第2外層の回路パターン間に形成される第2メッキ層をさらに含むことを特徴とする請求項4記載のボールグリッドアレイ基板。
- (A)第1外層、第2外層、および前記第1外層と前記第2外層間に形成される絶縁層を含む原板を提供する段階と、
(B)前記第1外層および前記絶縁層にウィンドウを形成する段階と、
(C)前記第1外層にパターンおよびワイヤボンディングパッドを含むパターンを形成し、前記第2外層に回路パターンおよびソルダボールパッドパターンを含むパターンを形成する段階と、
(D)前記第1外層および前記第2外層にソルダレジストを塗布した後、前記ワイヤボンディングパッドパターンおよび前記ソルダボールパッドパターンに対応する部分が開放されたソルダレジストパターンを形成する段階と、
(E)前記第1外層のワイヤボンディングパッドパターン、前記第2外層のソルダボールパッドパターン、前記ウィンドウパターン、および前記第2外層の回路パターンを金メッキする段階とを含むことを特徴とするボールグリッドアレイ基板の製作方法。 - 前記(A)段階の後、
(F)前記原板にビアホールを形成する段階と、
(G)前記原板の表面およびビアホールの内壁に銅メッキ層を形成する段階とをさらに含むことを特徴とする請求項6記載のボールグリッドアレイ基板の製作方法。 - 前記(D)段階の後、
(E)前記ワイヤボンディングパッドパターンおよび前記ソルダボールパッドパターン上にニッケルメッキ層を形成する段階と、
(F)前記ワイヤボンディングパッドパターンおよび前記ソルダボールパターンのニッケルメッキ層上に金メッキ層を形成する段階と、
(G)前記ソルダボールパッドパターンの金メッキ層上にソルダボールを形成し、前記ワイヤボンディングパッドパターンの金メッキ層上にワイヤボンディングを形成する段階とをさらに含むことを特徴とする請求項6記載のボールグリッドアレイ基板の製作方法。 - 前記(D)段階は、
(D−1)前記第1外層および前記第2外層のソルダレジスト上にエッチングレジストを塗布した後、前記エッチングレジストを露光および現像することにより、前記ソルダボールパッドパターンおよび前記ワイヤボンディングパッドに対応する部分が開放されたエッチングレジストパターンを形成する過程と、
(D−2)前記エッチングレジストを除去する過程とを含むことを特徴とする請求項6記載のボールグリッドアレイ基板の製作方法。 - 前記エッチングレジストは感光性物質からなることを特徴とする請求項9記載のボールグリッドアレイ基板の製作方法。
- 前記絶縁層は内層が多層であることを特徴とする請求項6記載のボールグリッドアレイ基板の製作方法。
- 前記(A)段階において、前記原板は、絶縁層の上面に銅箔が形成され、下面に接着剤を介して保護フィルムが形成されることを特徴とする請求項6記載のボールグリッドアレイ基板の製作方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040108179A KR100688857B1 (ko) | 2004-12-17 | 2004-12-17 | 윈도우를 구비한 볼 그리드 어레이 기판 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
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JP2006173554A true JP2006173554A (ja) | 2006-06-29 |
JP4481854B2 JP4481854B2 (ja) | 2010-06-16 |
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JP2005081647A Active JP4481854B2 (ja) | 2004-12-17 | 2005-03-22 | ウィンドウを備えたボールグリッドアレイ基板およびその製造方法 |
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US (2) | US7227250B2 (ja) |
JP (1) | JP4481854B2 (ja) |
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- 2005-03-22 JP JP2005081647A patent/JP4481854B2/ja active Active
- 2005-03-29 CN CNB2005100597225A patent/CN100386869C/zh not_active Expired - Fee Related
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010016096A (ja) * | 2008-07-02 | 2010-01-21 | Omron Corp | 電子部品 |
JP2015095472A (ja) * | 2013-11-08 | 2015-05-18 | アイシン精機株式会社 | 電子部品モジュール |
Also Published As
Publication number | Publication date |
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CN1790684A (zh) | 2006-06-21 |
KR100688857B1 (ko) | 2007-03-02 |
JP4481854B2 (ja) | 2010-06-16 |
US20070207607A1 (en) | 2007-09-06 |
US20060131729A1 (en) | 2006-06-22 |
KR20060069086A (ko) | 2006-06-21 |
CN100386869C (zh) | 2008-05-07 |
US7462555B2 (en) | 2008-12-09 |
US7227250B2 (en) | 2007-06-05 |
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