JP2006148710A - 撮像モジュール及び撮像モジュールの製造方法 - Google Patents

撮像モジュール及び撮像モジュールの製造方法 Download PDF

Info

Publication number
JP2006148710A
JP2006148710A JP2004337978A JP2004337978A JP2006148710A JP 2006148710 A JP2006148710 A JP 2006148710A JP 2004337978 A JP2004337978 A JP 2004337978A JP 2004337978 A JP2004337978 A JP 2004337978A JP 2006148710 A JP2006148710 A JP 2006148710A
Authority
JP
Japan
Prior art keywords
fixing
imaging module
light receiving
lens
transparent body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004337978A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006148710A5 (enExample
Inventor
Shogo Hirooka
章吾 広岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2004337978A priority Critical patent/JP2006148710A/ja
Priority to US11/285,346 priority patent/US20060109367A1/en
Priority to CNA2005101315781A priority patent/CN1783953A/zh
Priority to KR1020050111635A priority patent/KR20060056870A/ko
Priority to EP05257173A priority patent/EP1659781A1/en
Priority to TW094141030A priority patent/TW200636315A/zh
Publication of JP2006148710A publication Critical patent/JP2006148710A/ja
Publication of JP2006148710A5 publication Critical patent/JP2006148710A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Lens Barrels (AREA)
  • Blocking Light For Cameras (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
JP2004337978A 2004-11-22 2004-11-22 撮像モジュール及び撮像モジュールの製造方法 Pending JP2006148710A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004337978A JP2006148710A (ja) 2004-11-22 2004-11-22 撮像モジュール及び撮像モジュールの製造方法
US11/285,346 US20060109367A1 (en) 2004-11-22 2005-11-21 Image pickup module and manufacturing method of image pickup module
CNA2005101315781A CN1783953A (zh) 2004-11-22 2005-11-22 摄像模块及摄像模块的制造方法
KR1020050111635A KR20060056870A (ko) 2004-11-22 2005-11-22 촬상 모듈 및 촬상 모듈의 제조 방법
EP05257173A EP1659781A1 (en) 2004-11-22 2005-11-22 Image pickup module and manufacturing method of image pickup module
TW094141030A TW200636315A (en) 2004-11-22 2005-11-22 Image pickup module and manufacturing method of image pickup module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004337978A JP2006148710A (ja) 2004-11-22 2004-11-22 撮像モジュール及び撮像モジュールの製造方法

Publications (2)

Publication Number Publication Date
JP2006148710A true JP2006148710A (ja) 2006-06-08
JP2006148710A5 JP2006148710A5 (enExample) 2006-07-27

Family

ID=35968069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004337978A Pending JP2006148710A (ja) 2004-11-22 2004-11-22 撮像モジュール及び撮像モジュールの製造方法

Country Status (6)

Country Link
US (1) US20060109367A1 (enExample)
EP (1) EP1659781A1 (enExample)
JP (1) JP2006148710A (enExample)
KR (1) KR20060056870A (enExample)
CN (1) CN1783953A (enExample)
TW (1) TW200636315A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008096584A1 (ja) * 2007-02-07 2008-08-14 Konica Minolta Opto, Inc. 撮像装置の製造方法及び撮像装置並びに携帯端末
JP2010102313A (ja) * 2008-09-26 2010-05-06 Sharp Corp 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
JP2010219713A (ja) * 2009-03-16 2010-09-30 Panasonic Corp 撮像装置
JP2011120269A (ja) * 2007-11-20 2011-06-16 Sharp Corp 撮像モジュールおよびその製造方法、電子情報機器
JP2012227549A (ja) * 2005-07-05 2012-11-15 Hitachi Chem Co Ltd カメラモジュールの製造方法及びカメラモジュール
US8411192B2 (en) 2007-11-15 2013-04-02 Sharp Kabushiki Kaisha Image capturing module, method for manufacturing the image capturing module, and electronic information device
JP5499257B2 (ja) * 2010-12-15 2014-05-21 ナルックス株式会社 光センサ用部品及び光センサ
JP2021002055A (ja) * 2014-07-23 2021-01-07 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． 縦方向アライメント機構を含む発光体および光検出モジュール
JP2022009109A (ja) * 2016-02-25 2022-01-14 株式会社ニコン 撮像装置及び半導体装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI437301B (zh) * 2006-02-03 2014-05-11 Hitachi Maxell Camera module
KR100770685B1 (ko) * 2006-04-19 2007-10-29 삼성전기주식회사 소켓 타입 인쇄회로기판 및 이를 이용한 카메라 모듈
KR100743083B1 (ko) * 2006-06-13 2007-07-27 주식회사 엠씨넥스 카메라 모듈
US7566854B2 (en) * 2006-12-08 2009-07-28 Advanced Chip Engineering Technology Inc. Image sensor module
JP2010525412A (ja) 2007-04-24 2010-07-22 フレックストロニクス エーピー エルエルシー 底部にキャビティを備えるウエハーレベル光学部品とフリップチップ組立を用いた小型フォームファクタモジュール
CN100561280C (zh) * 2007-05-30 2009-11-18 鸿富锦精密工业（深圳）有限公司 相机模组及其制造方法
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
US8654215B2 (en) 2009-02-23 2014-02-18 Gary Edwin Sutton Mobile communicator with curved sensor camera
US8248499B2 (en) * 2009-02-23 2012-08-21 Gary Edwin Sutton Curvilinear sensor system
US9419032B2 (en) * 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
TWI425825B (zh) * 2009-12-31 2014-02-01 勝開科技股份有限公司 免調焦距影像感測器封裝結構
DE112010004616A5 (de) * 2010-04-01 2013-01-24 Conti Temic Microelectronic Gmbh Vorrichtung mit optischem modul und trägerplatte
US10009528B2 (en) 2011-02-24 2018-06-26 Nan Chang O-Film Optoelectronics Technology Ltd Autofocus camera module packaging with circuitry-integrated actuator system
US8545114B2 (en) 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane
WO2013071494A1 (zh) * 2011-11-16 2013-05-23 Ho Chunwei 影像感测器模块
US9599787B2 (en) * 2011-12-27 2017-03-21 Tera Xtal Technology Corporation Using sapphire lens to protect the lens module
KR101894387B1 (ko) * 2012-05-22 2018-09-04 해성디에스 주식회사 인쇄회로기판 및 그의 제조 방법
US8817394B2 (en) * 2013-01-17 2014-08-26 Himax Technologies Limited Lens module and manufacturing method thereof
DE102016208547A1 (de) * 2016-05-18 2017-11-23 Robert Bosch Gmbh Kameramodul für ein Fahrzeug
JP2019068140A (ja) * 2017-09-28 2019-04-25 シャープ株式会社 固体撮像装置およびその製造方法
CN111627948B (zh) * 2020-06-05 2023-04-28 中国电子科技集团公司第四十四研究所 一种具有片上滤光片的ccd结构
CN214381086U (zh) * 2021-01-22 2021-10-08 南昌欧菲光电技术有限公司 感光芯片及封装结构、摄像模组和电子设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321827A (ja) * 1997-05-16 1998-12-04 Sony Corp 撮像装置及びカメラ
US6384397B1 (en) * 2000-05-10 2002-05-07 National Semiconductor Corporation Low cost die sized module for imaging application having a lens housing assembly
TW523924B (en) * 2001-01-12 2003-03-11 Konishiroku Photo Ind Image pickup device and image pickup lens
US6686588B1 (en) * 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
JP2003163342A (ja) * 2001-11-29 2003-06-06 Olympus Optical Co Ltd 固体撮像装置及びその製造方法
KR100476558B1 (ko) * 2002-05-27 2005-03-17 삼성전기주식회사 이미지 센서 모듈 및 그 제작 공정
KR20030091549A (ko) * 2002-05-28 2003-12-03 삼성전기주식회사 이미지 센서모듈 및 그 제조공정
JP4269334B2 (ja) * 2002-10-28 2009-05-27 コニカミノルタホールディングス株式会社 撮像レンズ、撮像ユニット及び携帯端末
JP2004194223A (ja) * 2002-12-13 2004-07-08 Konica Minolta Holdings Inc 撮像装置及び携帯端末
US20040113047A1 (en) * 2002-12-16 2004-06-17 Hsiu Wen Tu Image sensor module
US6940058B2 (en) * 2003-02-04 2005-09-06 Kingpak Technology, Inc. Injection molded image sensor module
JP4204368B2 (ja) * 2003-03-28 2009-01-07 シャープ株式会社 光学装置用モジュール及び光学装置用モジュールの製造方法
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
TWM267483U (en) * 2004-07-16 2005-06-11 Kingpak Tech Inc Image sensor module

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012227549A (ja) * 2005-07-05 2012-11-15 Hitachi Chem Co Ltd カメラモジュールの製造方法及びカメラモジュール
US8673539B2 (en) 2005-07-05 2014-03-18 Hitachi Chemical Company, Ltd. Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
WO2008096584A1 (ja) * 2007-02-07 2008-08-14 Konica Minolta Opto, Inc. 撮像装置の製造方法及び撮像装置並びに携帯端末
US8411192B2 (en) 2007-11-15 2013-04-02 Sharp Kabushiki Kaisha Image capturing module, method for manufacturing the image capturing module, and electronic information device
JP2011120269A (ja) * 2007-11-20 2011-06-16 Sharp Corp 撮像モジュールおよびその製造方法、電子情報機器
JP2010102313A (ja) * 2008-09-26 2010-05-06 Sharp Corp 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
US8482926B2 (en) 2008-09-26 2013-07-09 Sharp Kabushiki Kaisha Optical element wafer module, optical element module, method for manufacturing optical element module, electronic element wafer module, method for manufacturing electronic element module, electronic element module and electronic information device
JP2010219713A (ja) * 2009-03-16 2010-09-30 Panasonic Corp 撮像装置
JP5499257B2 (ja) * 2010-12-15 2014-05-21 ナルックス株式会社 光センサ用部品及び光センサ
JP2021002055A (ja) * 2014-07-23 2021-01-07 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． 縦方向アライメント機構を含む発光体および光検出モジュール
JP7084455B2 (ja) 2014-07-23 2022-06-14 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッド 縦方向アライメント機構を含む発光体および光検出モジュール
JP2022009109A (ja) * 2016-02-25 2022-01-14 株式会社ニコン 撮像装置及び半導体装置

Also Published As

Publication number Publication date
KR20060056870A (ko) 2006-05-25
TW200636315A (en) 2006-10-16
US20060109367A1 (en) 2006-05-25
EP1659781A1 (en) 2006-05-24
CN1783953A (zh) 2006-06-07

Similar Documents

Publication Publication Date Title
KR20060056870A (ko) 촬상 모듈 및 촬상 모듈의 제조 방법
KR100575094B1 (ko) 광학장치용 모듈 및 그 제조방법
KR100678984B1 (ko) 리드부를 갖춘 반도체 웨이퍼의 제조방법 및 반도체 장치의제조방법
JP5531268B2 (ja) モールド成型されたハウジングを備えたウェハレベルカメラモジュールおよび製造方法
JP4694602B2 (ja) 固体撮像装置およびそれを備えた電子機器
TWI402979B (zh) 電子元件晶圓模組、電子元件模組、感測器晶圓模組、感測器模組、透鏡陣列盤、感測器模組之製造方法、及電子資訊裝置
JP4819152B2 (ja) 光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
US20060043544A1 (en) Semiconductor device, semiconductor module, and manufacturing method of semiconductor device
US20100044815A1 (en) Cmos image sensor package and camera module using same
US8742323B2 (en) Semiconductor module
KR101689703B1 (ko) 포토 센서 패키지 모듈
US20180027153A1 (en) Image sensing device with cover plate having optical pattern thereon
JP2006278726A (ja) 半導体装置モジュール及び半導体装置モジュールの製造方法
JP2005347416A (ja) 固体撮像装置、半導体ウエハ及びカメラモジュール
KR100809682B1 (ko) 투명 커버가 부착되어 있는 광학 장치의 제조방법 및 이를이용한 광학 장치 모듈의 제조방법
JP4647851B2 (ja) カメラモジュール
US7521657B2 (en) Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same
JP2011187482A (ja) 固体撮像装置、光学装置用モジュール、及び固体撮像装置の製造方法
JP4618639B2 (ja) 半導体装置の製造方法
JPWO2003015400A1 (ja) カメラモジュール
JP2004260357A (ja) カメラモジュール
JP2004260356A (ja) カメラモジュール
JP2002222935A (ja) 固体撮像装置およびその製造方法、固体撮像システム
JP3859679B2 (ja) カメラモジュール
JP4131673B2 (ja) カメラモジュールとその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060607

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20080806

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080819

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081015

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090623