TW200636315A - Image pickup module and manufacturing method of image pickup module - Google Patents

Image pickup module and manufacturing method of image pickup module

Info

Publication number
TW200636315A
TW200636315A TW094141030A TW94141030A TW200636315A TW 200636315 A TW200636315 A TW 200636315A TW 094141030 A TW094141030 A TW 094141030A TW 94141030 A TW94141030 A TW 94141030A TW 200636315 A TW200636315 A TW 200636315A
Authority
TW
Taiwan
Prior art keywords
image pickup
pickup module
cover
lens holder
manufacturing
Prior art date
Application number
TW094141030A
Other languages
English (en)
Chinese (zh)
Inventor
Shohgo Hirooka
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of TW200636315A publication Critical patent/TW200636315A/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Lens Barrels (AREA)
  • Blocking Light For Cameras (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
TW094141030A 2004-11-22 2005-11-22 Image pickup module and manufacturing method of image pickup module TW200636315A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004337978A JP2006148710A (ja) 2004-11-22 2004-11-22 撮像モジュール及び撮像モジュールの製造方法

Publications (1)

Publication Number Publication Date
TW200636315A true TW200636315A (en) 2006-10-16

Family

ID=35968069

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141030A TW200636315A (en) 2004-11-22 2005-11-22 Image pickup module and manufacturing method of image pickup module

Country Status (6)

Country Link
US (1) US20060109367A1 (enExample)
EP (1) EP1659781A1 (enExample)
JP (1) JP2006148710A (enExample)
KR (1) KR20060056870A (enExample)
CN (1) CN1783953A (enExample)
TW (1) TW200636315A (enExample)

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CN102290334B (zh) * 2005-07-05 2015-03-11 日立化成株式会社 半导体装置的制造方法
TWI437301B (zh) * 2006-02-03 2014-05-11 Hitachi Maxell Camera module
KR100770685B1 (ko) * 2006-04-19 2007-10-29 삼성전기주식회사 소켓 타입 인쇄회로기판 및 이를 이용한 카메라 모듈
KR100743083B1 (ko) * 2006-06-13 2007-07-27 주식회사 엠씨넥스 카메라 모듈
US7566854B2 (en) * 2006-12-08 2009-07-28 Advanced Chip Engineering Technology Inc. Image sensor module
WO2008096584A1 (ja) * 2007-02-07 2008-08-14 Konica Minolta Opto, Inc. 撮像装置の製造方法及び撮像装置並びに携帯端末
JP2010525412A (ja) 2007-04-24 2010-07-22 フレックストロニクス エーピー エルエルシー 底部にキャビティを備えるウエハーレベル光学部品とフリップチップ組立を用いた小型フォームファクタモジュール
CN100561280C (zh) * 2007-05-30 2009-11-18 鸿富锦精密工业（深圳）有限公司 相机模组及其制造方法
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
US8411192B2 (en) 2007-11-15 2013-04-02 Sharp Kabushiki Kaisha Image capturing module, method for manufacturing the image capturing module, and electronic information device
JP4714233B2 (ja) * 2007-11-20 2011-06-29 シャープ株式会社 撮像モジュールおよびその製造方法、電子情報機器
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
JP5047243B2 (ja) 2008-09-26 2012-10-10 シャープ株式会社 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
US8654215B2 (en) 2009-02-23 2014-02-18 Gary Edwin Sutton Mobile communicator with curved sensor camera
US8248499B2 (en) * 2009-02-23 2012-08-21 Gary Edwin Sutton Curvilinear sensor system
JP2010219713A (ja) * 2009-03-16 2010-09-30 Panasonic Corp 撮像装置
US9419032B2 (en) * 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
TWI425825B (zh) * 2009-12-31 2014-02-01 勝開科技股份有限公司 免調焦距影像感測器封裝結構
DE112010004616A5 (de) * 2010-04-01 2013-01-24 Conti Temic Microelectronic Gmbh Vorrichtung mit optischem modul und trägerplatte
JP5499257B2 (ja) * 2010-12-15 2014-05-21 ナルックス株式会社 光センサ用部品及び光センサ
US10009528B2 (en) 2011-02-24 2018-06-26 Nan Chang O-Film Optoelectronics Technology Ltd Autofocus camera module packaging with circuitry-integrated actuator system
US8545114B2 (en) 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane
WO2013071494A1 (zh) * 2011-11-16 2013-05-23 Ho Chunwei 影像感测器模块
US9599787B2 (en) * 2011-12-27 2017-03-21 Tera Xtal Technology Corporation Using sapphire lens to protect the lens module
KR101894387B1 (ko) * 2012-05-22 2018-09-04 해성디에스 주식회사 인쇄회로기판 및 그의 제조 방법
US8817394B2 (en) * 2013-01-17 2014-08-26 Himax Technologies Limited Lens module and manufacturing method thereof
KR101785879B1 (ko) * 2014-07-23 2017-10-16 헵타곤 마이크로 옵틱스 피티이. 리미티드 수직 정렬 피처들을 포함하는 광 방출기 및 광 검출기 모듈들
JP2017152546A (ja) * 2016-02-25 2017-08-31 株式会社ニコン 撮像装置及び半導体装置
DE102016208547A1 (de) * 2016-05-18 2017-11-23 Robert Bosch Gmbh Kameramodul für ein Fahrzeug
JP2019068140A (ja) * 2017-09-28 2019-04-25 シャープ株式会社 固体撮像装置およびその製造方法
CN111627948B (zh) * 2020-06-05 2023-04-28 中国电子科技集团公司第四十四研究所 一种具有片上滤光片的ccd结构
CN214381086U (zh) * 2021-01-22 2021-10-08 南昌欧菲光电技术有限公司 感光芯片及封装结构、摄像模组和电子设备

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JPH10321827A (ja) * 1997-05-16 1998-12-04 Sony Corp 撮像装置及びカメラ
US6384397B1 (en) * 2000-05-10 2002-05-07 National Semiconductor Corporation Low cost die sized module for imaging application having a lens housing assembly
TW523924B (en) * 2001-01-12 2003-03-11 Konishiroku Photo Ind Image pickup device and image pickup lens
US6686588B1 (en) * 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
JP2003163342A (ja) * 2001-11-29 2003-06-06 Olympus Optical Co Ltd 固体撮像装置及びその製造方法
KR100476558B1 (ko) * 2002-05-27 2005-03-17 삼성전기주식회사 이미지 센서 모듈 및 그 제작 공정
KR20030091549A (ko) * 2002-05-28 2003-12-03 삼성전기주식회사 이미지 센서모듈 및 그 제조공정
JP4269334B2 (ja) * 2002-10-28 2009-05-27 コニカミノルタホールディングス株式会社 撮像レンズ、撮像ユニット及び携帯端末
JP2004194223A (ja) * 2002-12-13 2004-07-08 Konica Minolta Holdings Inc 撮像装置及び携帯端末
US20040113047A1 (en) * 2002-12-16 2004-06-17 Hsiu Wen Tu Image sensor module
US6940058B2 (en) * 2003-02-04 2005-09-06 Kingpak Technology, Inc. Injection molded image sensor module
JP4204368B2 (ja) * 2003-03-28 2009-01-07 シャープ株式会社 光学装置用モジュール及び光学装置用モジュールの製造方法
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
TWM267483U (en) * 2004-07-16 2005-06-11 Kingpak Tech Inc Image sensor module

Also Published As

Publication number Publication date
KR20060056870A (ko) 2006-05-25
US20060109367A1 (en) 2006-05-25
EP1659781A1 (en) 2006-05-24
CN1783953A (zh) 2006-06-07
JP2006148710A (ja) 2006-06-08

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