TW200636315A - Image pickup module and manufacturing method of image pickup module - Google Patents

Image pickup module and manufacturing method of image pickup module

Info

Publication number
TW200636315A
TW200636315A TW094141030A TW94141030A TW200636315A TW 200636315 A TW200636315 A TW 200636315A TW 094141030 A TW094141030 A TW 094141030A TW 94141030 A TW94141030 A TW 94141030A TW 200636315 A TW200636315 A TW 200636315A
Authority
TW
Taiwan
Prior art keywords
image pickup
pickup module
cover
lens holder
manufacturing
Prior art date
Application number
TW094141030A
Other languages
English (en)
Inventor
Shohgo Hirooka
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of TW200636315A publication Critical patent/TW200636315A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14632—Wafer-level processed structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Lens Barrels (AREA)
  • Blocking Light For Cameras (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
TW094141030A 2004-11-22 2005-11-22 Image pickup module and manufacturing method of image pickup module TW200636315A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004337978A JP2006148710A (ja) 2004-11-22 2004-11-22 撮像モジュール及び撮像モジュールの製造方法

Publications (1)

Publication Number Publication Date
TW200636315A true TW200636315A (en) 2006-10-16

Family

ID=35968069

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141030A TW200636315A (en) 2004-11-22 2005-11-22 Image pickup module and manufacturing method of image pickup module

Country Status (6)

Country Link
US (1) US20060109367A1 (zh)
EP (1) EP1659781A1 (zh)
JP (1) JP2006148710A (zh)
KR (1) KR20060056870A (zh)
CN (1) CN1783953A (zh)
TW (1) TW200636315A (zh)

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CN101218539B (zh) * 2005-07-05 2011-07-13 日立化成工业株式会社 感光性粘接剂组合物、以及使用其所得粘接薄膜、粘接薄片、贴有粘接剂层的半导体晶圆、半导体装置及电子零件
TWI437301B (zh) * 2006-02-03 2014-05-11 Hitachi Maxell Camera module
KR100770685B1 (ko) * 2006-04-19 2007-10-29 삼성전기주식회사 소켓 타입 인쇄회로기판 및 이를 이용한 카메라 모듈
KR100743083B1 (ko) * 2006-06-13 2007-07-27 주식회사 엠씨넥스 카메라 모듈
US7566854B2 (en) * 2006-12-08 2009-07-28 Advanced Chip Engineering Technology Inc. Image sensor module
JPWO2008096584A1 (ja) * 2007-02-07 2010-05-20 コニカミノルタオプト株式会社 撮像装置の製造方法及び撮像装置並びに携帯端末
JP2010525412A (ja) 2007-04-24 2010-07-22 フレックストロニクス エーピー エルエルシー 底部にキャビティを備えるウエハーレベル光学部品とフリップチップ組立を用いた小型フォームファクタモジュール
CN100561280C (zh) * 2007-05-30 2009-11-18 鸿富锦精密工业（深圳）有限公司 相机模组及其制造方法
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
US8411192B2 (en) 2007-11-15 2013-04-02 Sharp Kabushiki Kaisha Image capturing module, method for manufacturing the image capturing module, and electronic information device
JP4714233B2 (ja) * 2007-11-20 2011-06-29 シャープ株式会社 撮像モジュールおよびその製造方法、電子情報機器
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
JP5047243B2 (ja) * 2008-09-26 2012-10-10 シャープ株式会社 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
US8654215B2 (en) 2009-02-23 2014-02-18 Gary Edwin Sutton Mobile communicator with curved sensor camera
US8248499B2 (en) * 2009-02-23 2012-08-21 Gary Edwin Sutton Curvilinear sensor system
JP2010219713A (ja) * 2009-03-16 2010-09-30 Panasonic Corp 撮像装置
US9419032B2 (en) * 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
TWI425825B (zh) * 2009-12-31 2014-02-01 Kingpak Tech Inc 免調焦距影像感測器封裝結構
KR20130024910A (ko) * 2010-04-01 2013-03-08 콘티 테믹 마이크로일렉트로닉 게엠베하 광학 모듈과 지지판이 장착된 장치
CN103261856B (zh) * 2010-12-15 2015-09-23 纳卢克斯株式会社 光传感器用部件
US10009528B2 (en) 2011-02-24 2018-06-26 Nan Chang O-Film Optoelectronics Technology Ltd Autofocus camera module packaging with circuitry-integrated actuator system
US8545114B2 (en) 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane
WO2013071494A1 (zh) * 2011-11-16 2013-05-23 Ho Chunwei 影像感测器模块
US9599787B2 (en) * 2011-12-27 2017-03-21 Tera Xtal Technology Corporation Using sapphire lens to protect the lens module
KR101894387B1 (ko) * 2012-05-22 2018-09-04 해성디에스 주식회사 인쇄회로기판 및 그의 제조 방법
US8817394B2 (en) * 2013-01-17 2014-08-26 Himax Technologies Limited Lens module and manufacturing method thereof
US9768361B2 (en) * 2014-07-23 2017-09-19 Heptagon Micro Optics Pte. Ltd. Light emitter and light detector modules including vertical alignment features
DE102016208547A1 (de) 2016-05-18 2017-11-23 Robert Bosch Gmbh Kameramodul für ein Fahrzeug
JP2019068140A (ja) * 2017-09-28 2019-04-25 シャープ株式会社 固体撮像装置およびその製造方法
CN111627948B (zh) * 2020-06-05 2023-04-28 中国电子科技集团公司第四十四研究所 一种具有片上滤光片的ccd结构
CN214381086U (zh) * 2021-01-22 2021-10-08 南昌欧菲光电技术有限公司 感光芯片及封装结构、摄像模组和电子设备

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JPH10321827A (ja) * 1997-05-16 1998-12-04 Sony Corp 撮像装置及びカメラ
US6384397B1 (en) * 2000-05-10 2002-05-07 National Semiconductor Corporation Low cost die sized module for imaging application having a lens housing assembly
TW523924B (en) * 2001-01-12 2003-03-11 Konishiroku Photo Ind Image pickup device and image pickup lens
US6686588B1 (en) * 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
JP2003163342A (ja) * 2001-11-29 2003-06-06 Olympus Optical Co Ltd 固体撮像装置及びその製造方法
KR100476558B1 (ko) * 2002-05-27 2005-03-17 삼성전기주식회사 이미지 센서 모듈 및 그 제작 공정
KR20030091549A (ko) * 2002-05-28 2003-12-03 삼성전기주식회사 이미지 센서모듈 및 그 제조공정
JP4269334B2 (ja) * 2002-10-28 2009-05-27 コニカミノルタホールディングス株式会社 撮像レンズ、撮像ユニット及び携帯端末
JP2004194223A (ja) * 2002-12-13 2004-07-08 Konica Minolta Holdings Inc 撮像装置及び携帯端末
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Also Published As

Publication number Publication date
EP1659781A1 (en) 2006-05-24
CN1783953A (zh) 2006-06-07
US20060109367A1 (en) 2006-05-25
KR20060056870A (ko) 2006-05-25
JP2006148710A (ja) 2006-06-08

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