WO2013071494A1 - 影像感测器模块 - Google Patents

影像感测器模块 Download PDF

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Publication number
WO2013071494A1
WO2013071494A1 PCT/CN2011/082257 CN2011082257W WO2013071494A1 WO 2013071494 A1 WO2013071494 A1 WO 2013071494A1 CN 2011082257 W CN2011082257 W CN 2011082257W WO 2013071494 A1 WO2013071494 A1 WO 2013071494A1
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WO
WIPO (PCT)
Prior art keywords
image sensor
sensor module
circuit board
image
sensing unit
Prior art date
Application number
PCT/CN2011/082257
Other languages
English (en)
French (fr)
Inventor
何春纬
Original Assignee
Ho Chunwei
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ho Chunwei filed Critical Ho Chunwei
Priority to PCT/CN2011/082257 priority Critical patent/WO2013071494A1/zh
Publication of WO2013071494A1 publication Critical patent/WO2013071494A1/zh

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4205—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Definitions

  • the present invention relates to the field of image device technology, and in particular to an image sensor module. Background technique
  • image sensor modules have been widely used in electronic devices for various purposes.
  • the combination of image sensor modules and various portable electronic devices such as mobile phones, notebook computers, etc., has been favored by many consumers.
  • the existing image sensor module 10 includes a geometric optical lens set 12, a lens barrel 14 housing the geometric optical lens group 12, an image sensor 16 and a lens holder 18.
  • the image sensor 16 is disposed in the lens holder 18, and the lens holder 18 and the lens barrel 14 are coupled by threads.
  • such an image sensor module 10 is bulky and cannot meet the market demand for a miniaturized image sensor module. Summary of the invention
  • the invention provides an image sensor module which has a small volume and can meet the requirements of the market for the type of image sensor module.
  • An embodiment of the invention provides an image sensor module.
  • the image sensor module includes an image sensing unit and an imaging unit.
  • the image sensing unit has a sensing surface, and the imaging unit is opposite to the sensing surface.
  • the imaging unit is formed by at least one optical diffractive sheet having a diffractive optical pattern formed thereon for imaging an object external to the image sensor module on the sensing surface.
  • the image sensing unit is a complementary metal-oxide-semiconductor (CMOS) chip.
  • CMOS complementary metal-oxide-semiconductor
  • the diffractive optical pattern includes a plurality of diffractive optical regions, each of the diffractive optical regions is an independent imaging portion, and each of the imaging portions is configured to image a portion of the object on the sensing surface. on.
  • the image sensing unit includes a die and a package.
  • the crystal has the above sensing surface, and the package covers the crystal.
  • a signal output portion is formed on the bottom surface of the package.
  • the image sensor module further includes a fixing frame for fixing the imaging unit.
  • the signal output unit includes a plurality of metal balls.
  • the image sensor module further includes a circuit board. The fixing frame and the image sensing unit are disposed on the circuit board, and the signal output portion is electrically connected to the circuit board.
  • the image sensing unit includes a crystal.
  • the image sensor module described above further includes a carrier board and a bracket.
  • the carrier has opposite first and second surfaces.
  • the crystal is disposed on the first surface of the carrier and electrically connected to the carrier.
  • a second surface of the carrier is formed with a signal output portion.
  • the bracket is disposed on the first surface of the carrier and fixes the imaging unit.
  • the signal output unit includes a plurality of metal balls.
  • the image sensor module further includes a circuit board.
  • the carrier board is disposed on the circuit board, and the signal output part is electrically connected to the circuit board.
  • the image sensing unit includes a crystal.
  • the image sensor module further includes a circuit board and a fixing frame.
  • the crystal is disposed on the circuit board and electrically connected to the circuit board.
  • the fixing frame is disposed on the circuit board, and the imaging unit is fixed on the fixing frame.
  • the image sensor module of the present invention has an optical diffraction sheet and an image sensing unit, wherein the optical diffraction sheet serves as an imaging unit. Since the thickness of the optical diffraction sheet is thinner than the geometric optical lens group used in the prior art, the image sensor module of the present invention is smaller in volume than the prior art.
  • FIG. 1 is a schematic cross-sectional view of a conventional image sensor module.
  • FIG. 2 is a cross-sectional view showing an image sensor module according to a first embodiment of the present invention.
  • Figure 3 is a schematic illustration of the optical diffraction sheet of Figure 2.
  • FIG. 4 is a cross-sectional view showing an image sensor module according to a second embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of an image sensor module according to a third embodiment of the present invention.
  • the image sensor module according to the present invention is embodied in the following with reference to the accompanying drawings and preferred embodiments.
  • the method, method, procedure and efficacy are described in detail as follows.
  • the image sensor module 20 of the first embodiment of the present invention includes an image sensing unit 22 and an imaging unit for imaging, and the imaging unit is composed of at least one optical diffraction sheet 24 , and the implementation The example is a piece.
  • the optical diffraction sheet 24 is fixed above the image sensing unit 22.
  • the optical diffraction sheet 24 includes, for example, a substrate 241 and a diffractive optical pattern 240 formed on the substrate 241 , wherein the diffractive optical pattern 240 is used to image an object outside the image sensor module 20 on the image sensing unit 22 .
  • the sensing surface 2600 is on.
  • the diffractive optical pattern 240 includes a plurality of diffractive optical regions 242.
  • Each diffractive optical zone 242 is an independent imaging section with independent imaging capabilities.
  • Each of the diffractive optical regions 242 corresponds to a portion of the object and is used to image the portion of the object to a particular region of the sensing surface 2600 of the image sensing unit 22. That is, each of the diffractive optical regions 242 is used to image a portion of the object on the image sensing unit 22, and the image of the entire object sensed by the image sensing unit 22 is composed of the partial images.
  • the diffractive optical pattern 240 may be a dimple, a protrusion, an opening, or a combination thereof formed on the substrate 241.
  • the number and arrangement of the diffractive optical regions 242 can also be determined according to specific needs, and are not limited to the arrangement and number shown in FIG.
  • the optical diffraction sheet 24 is a single piece, and of course, the imaging unit in which a plurality of optical diffraction sheets 24 are stacked together is also suitable for the present invention. In embodiments of multiple optical diffracts, the diffractive optical patterns of the optical dips may be different.
  • the shape of the optical diffraction sheet 24 is not limited to the rectangular shape shown in Fig. 3, and may be circular or other shapes, and the invention is not limited thereto.
  • the image sensing unit 22 is, for example, a packaged image sensor, which includes a crystal 260 and a package 262.
  • the crystal 260 is a light sensing component, such as a complementary metal oxide semiconductor chip.
  • the crystal 260 has a sensing surface 2600 for receiving an optical signal
  • the package 262 encloses the crystal 260
  • the top surface 2620 of the package 262 exposes the sensing surface 2600.
  • the sensing surface 2600 is opposite the optical diffractive sheet 24 to sense light passing through the optical diffracting sheet 24.
  • the bottom surface 2622 of the package body 262 is provided with a signal output portion 28.
  • the signal output portion 28 is exemplified by a plurality of metal balls (such as solder balls).
  • the signal output portion 28 can also be a metal lead or the like, and the invention is not limited thereto.
  • the image sensor module 20 of the present embodiment further includes a fixing frame 25 for fixing the optical diffraction sheet 24, and the image sensing unit 22 is disposed in the fixing frame 25.
  • the holder 25 is, for example, in the form of a hollow cylinder having a first open end 250 and a second open end 252 opposite the first open end 250.
  • the inner wall of the first open end 250 of the retainer 25 extends radially inwardly to define an annular shoulder 254 having an upper surface 2540, a lower surface 2542 opposite the upper surface 2540, and an annular inner side 2544.
  • the optical diffractive sheet 24 is, for example, an opening fixed to the first open end 250 and covering the first open end 250.
  • the outer edge of the optical diffraction sheet 24 can be adhered to the annular inner side surface 2544 of the shoulder 254 by an adhesive.
  • the adhesive can also be adhered to the shoulder 254.
  • the fixing frame 25 can have many different deformations, and the fixing manner of the optical diffraction sheet 24 can be changed according to the specific structure of the fixing frame 25, and is not limited to the pasting manner in the embodiment.
  • the image sensor module 20 of the present embodiment may further include a circuit board 27, and the image sensing unit 22 and the fixing frame 25 are fixed to the upper surface 270 of the circuit board 27, for example, and disposed on the bottom surface 2622 of the package body 262.
  • the signal output unit 28 is fixed to the circuit board 27, for example, and is electrically connected to the circuit board 27.
  • the end face of the second open end 252 of the holder 25 is fixed to the upper surface 270 of the circuit board 27.
  • the image sensor module 20 of the present embodiment uses an optical diffractive sheet 24 in place of the geometric optical lens set used in the prior art. Since the thickness of the optical diffraction sheet 24 can be reduced to several millimeters, or even several micrometers, the image sensor 20 of the present embodiment can be made smaller in volume.
  • the image sensing unit of the present invention can also adopt other different packaging methods.
  • the other two embodiments will be described below, but it is not intended to limit the present invention.
  • the image sensor module 30 includes an image sensing unit 32 and an optical diffraction sheet 34 as an imaging unit.
  • the image sensing unit 32 is, for example, a crystal.
  • the image sensor module 30 includes, for example, a carrier plate 36 and a bracket 37.
  • the structure and function of the optical diffraction sheet 34 and the crystal of the present embodiment are substantially similar to those of the optical diffraction sheet 24 and the crystal 260 of the first embodiment, and will not be described herein.
  • the carrier board 36 is used to carry the image sensing unit 32 and the bracket 37.
  • Carrier board 36 There are opposing first surface 360 and second surface 362.
  • the image sensing unit 32 is disposed on the first surface 360 of the carrier 36 and is located within the bracket 37.
  • the sensing surface 350 of the image sensing unit 32 faces the optical diffraction sheet 34 , and the image sensing unit 32 is electrically connected to the carrier 36 , for example, through the metal wire 31 .
  • the present invention does not limit the image sensing unit 32 and The manner in which the carrier board 36 is electrically connected.
  • the second surface 362 of the carrier 36 is formed, for example, with a signal output portion 39.
  • the signal output portion 39 of the present embodiment is exemplified by a plurality of metal balls (such as solder balls), but is not limited thereto.
  • the bracket 37 is used to fix the optical diffraction sheet 34.
  • the bracket 37 is, for example, hollow, and includes an opposite first open end 370 and a second open end 372.
  • the outer edge of the optical diffraction sheet 34 may be fixed to the inner wall of the first open end 370 by an adhesive and cover the opening of the first open end 370.
  • the end face of the second port 372 of the bracket 37 is fixed to the first surface 360 of the carrier plate 36, for example, by an adhesive.
  • the image sensor module 30 of the present embodiment may further include a circuit board 38 disposed on the circuit board 38 and electrically connected to the circuit board 38.
  • the present invention does not limit the electrical connection between the carrier board 36 and the circuit board 38.
  • the carrier board and the circuit may also be connected by wire bonding.
  • the board is electrically connected.
  • FIG. 5 is a cross-sectional view of an image sensor module according to a third embodiment of the present invention.
  • the image sensor module 40 includes an image sensing unit 42, an optical diffraction sheet 44 as an imaging unit, a mounting bracket 46, and a circuit board 47.
  • the image sensing unit 42 of the present embodiment is, for example, a crystal, and the structure and function of the optical diffraction sheet 44 and the crystal are substantially similar to those of the first embodiment, and will not be described herein.
  • the image sensing unit 42 is directly disposed on the upper surface 470 of the circuit board 47 and electrically connected to the circuit board 47.
  • the image sensing unit 42 is electrically connected to the circuit board 47 through the metal wires 48, for example.
  • the holder 46 includes opposing first open ends 460 and second open ends 462.
  • Optical diffractive sheet 44 is secured to first open end 460 and covers its opening.
  • the image sensing unit 42 is disposed in the holder 46, and the sensing surface 450 of the image sensing unit 42 faces the optical diffraction sheet 44.
  • the second open end 462 of the holder 46 is secured to the upper surface 470 of the circuit board 47.
  • the imaging unit of the image sensor module of the present invention is composed of an optical diffraction sheet, and since the thickness of the optical diffraction sheet is thinner than that of the geometric optical lens group used in the prior art, Technically, the image sensor module of the present invention is smaller in size.
  • the imaging unit of the image sensor module of the embodiment of the present invention is composed of an optical diffraction sheet. Since the thickness of the optical diffraction sheet is thinner than that of the prior art geometric optical lens group, compared with the prior art, The image sensor module of the present invention is smaller in size.

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  • Optics & Photonics (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本发明提供一种影像感测器模块。此影像感测器模块包括影像感测单元及成像单元。影像感测单元具有感测面，成像单元与感测面相对。成像单元由至少一光学绕射片构成。光学绕射片上形成有绕射光学图案，绕射光学图案用于将一物体成像在影像感测单元的感测面上。由于光学绕射片的厚度较现有技术所使用的几何光学镜片组薄，因此相较于现有技术，本发明的影像感测器模块的体积更小。

Description

影像感测器模块
技术领域
本发明涉及影像装置技术领域， 且特别是有关于一种影像感测器模块。 背景技术
随着影像技术的发展， 影像感测器模块在各种用途的电子装置中都得到 了非常广泛的应用。 影像感测器模块与各种可携式电子装置如手机 (mobile phone), 笔记型计算机等的结合， 更得到众多消费者的青睐。
请参见图 1 , 现有的影像感测器模块 10包括几何光学镜片组 12、 容纳 几何光学镜片组 12的镜筒 14、 影像感测器 16和镜座 18。 影像感测器 16设 置在镜座 18内， 镜座 18与镜筒 14借由螺纹而结合。 但是， 这样的影像感 测器模块 10体积较大， 无法满足市场对小型化影像感测器模块的需求。 发明内容
本发明提供一种影像感测器模块， 其具有较小的体积， 可以适应市场对 、型化影像感测器模块的需求。
本发明一实施例提出一种影像感测器模块。 此影像感测器模块包括影像 感测单元及成像单元。 影像感测单元具有感测面， 成像单元与感测面相对。 成像单元由至少一光学绕射片构成， 光学绕射片上形成有绕射光学图案， 绕 射光学图案用于将影像感测器模块外部的一物体成像在感测面上。
在本发明的一实施例中， 上述影像感测单元为互补式金属氧化物半导体 (complementary metal-oxide-semiconductor, CMOS)芯片。
在本发明的一实施例中， 上述绕射光学图案包括多个绕射光学区域， 每 一绕射光学区域为一独立的成像部， 每一成像部用于将物体的局部成像在感 测面上。
在本发明的一实施例中，上述影像感测单元包括一棵晶 (die)及一封装体。 棵晶具有上述感测面，而封装体包覆棵晶。封装体的底面形成有信号输出部。 影像感测器模块更包括固定架， 固定架用于固定上述成像单元。
在本发明的一实施例中， 上述信号输出部包括多个金属球。 在本发明的一实施例中， 此影像感测器模块更包括电路板。 固定架与影 像感测单元配置于电路板上， 且信号输出部电性连接至电路板。
在本发明的一实施例中， 上述影像感测单元包括棵晶。 上述影像感测器 模块更包括载板和支架。 载板具有相对的第一表面与第二表面。 棵晶配置于 载板的第一表面并电性连接至载板。 载板的第二表面形成有信号输出部。 支 架配置于载板的第一表面并固定成像单元。
在本发明的一实施例中， 上述信号输出部包括多个金属球。
在本发明的一实施例中， 上述影像感测器模块更包括电路板。 载板配置 于电路板上， 且信号输出部电性连接至电路板。
在本发明的一实施例中， 上述影像感测单元包括棵晶。 上述影像感测器 模块更包括电路板及固定架。 棵晶配置于电路板上并电性连接至电路板。 固 定架配置于电路板上， 成像单元固定在固定架上。
本发明的影像感测器模块具有光学绕射片和影像感测单元， 其中光学绕 射片作为成像单元。 由于光学绕射片的厚度较现有技术所使用的几何光学镜 片组薄， 因此相较于现有技术， 本发明的影像感测器模块的体积更小。
上述说明仅是本发明技术方案的概述， 为了能够更清楚了解本发明的技 术手段， 而可依照说明书的内容予以实施， 并且为了让本发明的上述和其他 目的、 特征和优点能够更明显易懂， 以下特举较佳实施例， 并配合附图,详细 说明: ¾口下。 附图概述
图 1为现有的影像感测器模块的剖面示意图。
图 2为本发明第一实施例的影像感测器模块的剖面示意图。
图 3为图 2中光学绕射片的示意图。
图 4为本发明第二实施例的影像感测器模块的剖面示意图。
图 5为本发明第三实施例的影像感测器模块的剖面示意图。
本发明的较佳实施方式
为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效, 以下结合附图及较佳实施例， 对依据本发明提出的影像感测器模块其具体实 施方式、 方法、 步骤及功效， 详细说明如后。
有关本发明的前述及其他技术内容、 特点及功效， 在以下配合参考图式 的较佳实施例详细说明中将可清楚的呈现。 通过具体实施方式的说明， 当可 了解，然而所附图式仅是提供参考与说明之用，并非用来对本发明加以限制。
图 2为本发明第一实施例的影像感测器模块的剖面示意图， 图 3所示为 图 2的光学绕射片的示意图。 请参照图 2与图 3 , 本发明第一实施例的影像 感测器模块 20包括影像感测单元 22及用于成像的成像单元， 成像单元由至 少一片光学绕射片 24构成， 而本实施例是以一片为例。 光学绕射片 24固定 于影像感测单元 22上方。光学绕射片 24例如包括基材 241及形成于基材 241 上的绕射光学图案 240,其中绕射光学图案 240用于将影像感测器模块 20外 部的物体成像在影像感测单元 22的感测面 2600上。 具体而言， 绕射光学图 案 240包括多个绕射光学区域 242。 每一绕射光学区域 242都是独立的成像 部，具有独立的成像功能。每一绕射光学区域 242对应上述物体的某一部分， 且用于将此部分的物体成像于影像感测单元 22的感测面 2600的特定区域。 也就是说， 每一绕射光学区域 242用于将上述物体的局部成像在影像感测单 元 22上， 而影像感测单元 22所感测到的整个物体的影像由上述这些局部影 像组成。
绕射光学图案 240可以是形成于基材 241的凹痕、 突起、 开孔或其的组 合。 绕射光学区域 242的数量及排列方式也可以根据具体需求来确定， 并不 限定于图 3所示的排列方式及数量。 于本实施例中， 光学绕射片 24为单片 式， 当然多片光学绕射片 24堆栈在一起形成的成像单元也同样适用于本发 明。 在多片光学绕射片的实施例中， 这些光学绕射片的绕射光学图案可不相 同。 光学绕射片 24的形状也不限定于图 3所示的矩形， 其也可以为圓形或 其它形状， 本发明并不以此为限。
请再参照图 2, 于本实施例中， 影像感测单元 22例如为封装完成的影像 感测器， 其包括棵晶 260及封装体 262。 棵晶 260为光感测组件， 例如互补 式金属氧化物半导体芯片。棵晶 260具有用于接收光信号的感测面 2600, 封 装体 262包覆棵晶 260, 且封装体 262的顶面 2620暴露出感测面 2600。 感 测面 2600与光学绕射片 24相对， 以感测通过光学绕射片 24的光线。 此外， 封装体 262的底面 2622设有信号输出部 28。 本实施例中， 信号输出部 28是 以多个金属球 (如锡球)为例。 当然， 信号输出部 28还可以为金属导脚 (lead) 等， 本发明并不以此为限。
本实施例的影像感测器模块 20例如更包括固定架 25 , 其用于固定光学 绕射片 24, 而影像感测单元 22设置在固定架 25内。 于本实施例中， 固定架 25例如呈中空筒状，其具有第一开口端 250及与第一开口端 250相对的第二 开口端 252。固定架 25的第一开口端 250的内壁沿径向向内延伸形成一环状 的肩部 254,此肩部 254具有上表面 2540、与上表面 2540相对的下表面 2542 及环形内侧面 2544。 光学绕射片 24例如是固定在第一开口端 250并覆盖第 一开口端 250的开口。 于本实施例中， 光学绕射片 24的外缘可借由粘着剂 黏贴在肩部 254的环形内侧面 2544上， 当然在其它实施例中也可以借由粘 着剂黏贴在肩部 254的上表面 2540或下表面 2542上。 实际应用中， 固定架 25可以有很多不同的变形，光学绕射片 24的固定方式可以根据固定架 25的 具体结构进行改变， 并不以本实施例中的黏贴方式为限。
本实施例的影像感测器模块 20可进一步包括电路板 27, 而影像感测单 元 22及固定架 25例如是固定于电路板 27的上表面 270上， 其中设置于封 装体 262的底面 2622的信号输出部 28例如是固定在电路板 27上并与电路 板 27形成电性连接。 于本实施例中， 固定架 25的第二开口端 252的端面固 定在电路板 27的上表面 270上。
本实施例的影像感测器模块 20使用光学绕射片 24来取代现有技术所使 用的几何光学镜片组。 由于光学绕射片 24 的厚度可缩减至数毫米， 甚至数 微米， 所以可使本实施例的影像感测器 20具有较小的体积。
可以理解， 本发明的影像感测单元还可以采用其它不同的封装方式， 下 面将介绍另外两个实施例， 但其并非用以限定本发明。
图 4为本发明第二实施例的影像感测器模块的剖面示意图。请参照图 4, 于本实施例中， 影像感测器模块 30包括影像感测单元 32、 作为成像单元的 光学绕射片 34。 影像感测单元 32例如为棵晶。 此外， 影像感测器模块 30例 如更包括载板 36及支架 37。本实施例的光学绕射片 34及棵晶的结构与功能 与第一实施例的光学绕射片 24及棵晶 260基本相似， 这里不再赘述。
于本实施例中， 载板 36用于承载影像感测单元 32和支架 37。 载板 36 具有相对的第一表面 360及第二表面 362。 影像感测单元 32配置在载板 36 的第一表面 360, 且位于支架 37内。 影像感测单元 32的感测面 350朝向光 学绕射片 34,且影像感测单元 32例如透过金属线 31而与载板 36电性连接， 但本发明并不限定影像感测单元 32与载板 36电性连接的方式。 载板 36的 第二表面 362例如形成有信号输出部 39。 本实施例的信号输出部 39是以多 个金属球 (如锡球)为例， 但并不以此为限。
支架 37用于固定光学绕射片 34。于本实施例中，支架 37例如呈中空状， 其包括相对的第一开口端 370及第二开口端 372。光学绕射片 34的外缘可借 由粘着剂固定在第一开口端 370的内壁并覆盖第一开口端 370的开口。
于本实施例中， 支架 37的第二端口 372的端面例如借由粘着剂固定在 载板 36的第一表面 360上。 此外， 本实施例的影像感测器模块 30可更包括 电路板 38, 而载板 36配置于电路板 38上， 且与电路板 38形成电性连接。
需说明的是,本发明并不限定载板 36与电路板 38的间的电性连接方式， 在另一实施例中， 亦可透过打线接合 (wire bonding)的方式将载板与电路板电 性连接。
图 5为本发明第三实施例的影像感测器模块的剖面示意图。请参照图 5 , 于本实施例中， 影像感测器模块 40包括影像感测单元 42、 作为成像单元的 光学绕射片 44、 固定架 46及电路板 47。 本实施例的影像感测单元 42例如 为棵晶， 且光学绕射片 44及棵晶的结构及功能与第一实施例基本相似， 这 里不再赘述。 于本实施例中， 影像感测单元 42直接配置在电路板 47的上表 面 470上并与电路板 47电性连接。 具体而言， 影像感测单元 42例如是透过 金属线 48而电性连接至电路板 47。
固定架 46包括相对的第一开口端 460及第二开口端 462。 光学绕射片 44固定在第一开口端 460并覆盖其开口。 影像感测单元 42设置在固定架 46 内， 影像感测单元 42的感测面 450正对光学绕射片 44。 固定架 46的第二开 口端 462固定在电路板 47的上表面 470。
综上所述， 本发明的影像感测器模块的成像单元是由光学绕射片组成， 由于光学绕射片的厚度较现有技术所使用的几何光学镜片组薄， 因此， 相较 于现有技术， 本发明的影像感测器模块的体积更小。
以上所述， 仅是本发明的较佳实施例而已， 并非对本发明作任何形式上 的限制， 虽然本发明已以较佳实施例揭露如上， 然而并非用以限定本发明， 任何熟悉本专业的技术人员， 在不脱离本发明技术方案范围内，当可利用上 述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但凡是未 筒单修改、 等同变化与修饰，均仍属于本发明技术方案的范围内。
工业实用性
本发明实施例的影像感测器模块的成像单元是由光学绕射片组成， 由于 光学绕射片的厚度较现有技术所使用的几何光学镜片组薄， 因此， 相较于现 有技术， 本发明的影像感测器模块的体积更小。

Claims

权 利 要 求 书
1.一种影像感测器模块， 包括：
影像感测单元， 具有感测面； 以及
成像单元， 与该感测面相对， 其特征在于：
该成像单元由至少一片光学绕射片构成， 该至少一片光学绕射片具有绕 射光学图案， 该绕射光学图案用于将物体成像在该感测面上。
2.如权利要求 1所述的影像感测器模块， 其特征在于， 该影像感测单元 为互补式金属氧化物半导体芯片。
3.如权利要求 1所述的影像感测器模块， 其特征在于， 该绕射光学图案 包括多个绕射光学区域， 每一绕射光学区域为独立的成像部， 每一成像部用 于将该物体的局部成像在该感测面上。
4.如权利要求 1所述的影像感测器模块， 其特征在于， 该影像感测单元 包括棵晶及封装体， 该棵晶具有该感测面， 而该封装体包覆该棵晶， 该封装 体之底面形成有信号输出部， 该影像感测器模块进一步包括固定架， 该固定 架固定该成像单元。
5.如权利要求 4所述的影像感测器模块， 其特征在于， 该信号输出部包 括多个金属球。
6.如权利要求 4所述的影像感测器模块， 进一步包括电路板， 该固定架 与该影像感测单元配置于该电路板上， 且该信号输出部电性连接至该电路 板。
7.如权利要求 1所述的影像感测器模块， 其特征在于， 该影像感测单元 包括棵晶， 该影像感测器模块进一步包括：
载板， 具有相对的第一表面与第二表面， 该棵晶配置于该第一表面并电 性连接至该载板， 而该第二表面形成有信号输出部； 以及
支架， 配置于该第一表面并固定该成像单元。
8.如权利要求 7所述的影像感测器模块， 其特征在于， 该信号输出部包 括多个金属球。
9.如权利要求 7所述的影像感测器模块， 更包括电路板， 该载板配置于 该电路板上， 且该信号输出部电性连接至该电路板。
10.如权利要求 1所述的影像感测器模块， 其特征在于， 该影像感测单元 包括棵晶， 该影像感测器模块更包括：
电路板， 该裸晶配置于该电路板上并电性连接至该电路板； 以及 固定架， 配置于该电路板上， 并固定该成像单元。
PCT/CN2011/082257 2011-11-16 2011-11-16 影像感测器模块 WO2013071494A1 (zh)

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EP1081944A2 (en) * 1999-09-03 2001-03-07 Sony Corporation Imaging element, imaging device, camera module and camera system
US20050275048A1 (en) * 2004-06-14 2005-12-15 Farnworth Warren M Microelectronic imagers and methods of packaging microelectronic imagers
CN1783953A (zh) * 2004-11-22 2006-06-07 夏普株式会社 摄像模块及摄像模块的制造方法
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