CN1783953A - 摄像模块及摄像模块的制造方法 - Google Patents

摄像模块及摄像模块的制造方法 Download PDF

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Publication number
CN1783953A
CN1783953A CNA2005101315781A CN200510131578A CN1783953A CN 1783953 A CN1783953 A CN 1783953A CN A2005101315781 A CNA2005101315781 A CN A2005101315781A CN 200510131578 A CN200510131578 A CN 200510131578A CN 1783953 A CN1783953 A CN 1783953A
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CN
China
Prior art keywords
mentioned
lens
transparent body
matrix
fixed
Prior art date
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Pending
Application number
CNA2005101315781A
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English (en)
Chinese (zh)
Inventor
广冈章吾
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Sharp Corp
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Sharp Corp
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Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of CN1783953A publication Critical patent/CN1783953A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/026—Wafer-level processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Lens Barrels (AREA)
  • Blocking Light For Cameras (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
CNA2005101315781A 2004-11-22 2005-11-22 摄像模块及摄像模块的制造方法 Pending CN1783953A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004337978 2004-11-22
JP2004337978A JP2006148710A (ja) 2004-11-22 2004-11-22 撮像モジュール及び撮像モジュールの製造方法

Publications (1)

Publication Number Publication Date
CN1783953A true CN1783953A (zh) 2006-06-07

Family

ID=35968069

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005101315781A Pending CN1783953A (zh) 2004-11-22 2005-11-22 摄像模块及摄像模块的制造方法

Country Status (6)

Country Link
US (1) US20060109367A1 (enExample)
EP (1) EP1659781A1 (enExample)
JP (1) JP2006148710A (enExample)
KR (1) KR20060056870A (enExample)
CN (1) CN1783953A (enExample)
TW (1) TW200636315A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013071494A1 (zh) * 2011-11-16 2013-05-23 Ho Chunwei 影像感测器模块
CN103428988A (zh) * 2012-05-22 2013-12-04 三星泰科威株式会社 印刷电路板及其制造方法
CN103941372A (zh) * 2013-01-17 2014-07-23 奇景光电股份有限公司 镜头模块及其制造方法
CN109616483A (zh) * 2017-09-28 2019-04-12 夏普株式会社 固体摄像装置及其制造方法
CN111627948A (zh) * 2020-06-05 2020-09-04 中国电子科技集团公司第四十四研究所 一种具有片上滤光片的ccd结构
JP2021002055A (ja) * 2014-07-23 2021-01-07 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． 縦方向アライメント機構を含む発光体および光検出モジュール
CN113161430A (zh) * 2021-01-22 2021-07-23 南昌欧菲光电技术有限公司 感光组件及其制造方法、摄像模组和电子设备

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CN102290334B (zh) * 2005-07-05 2015-03-11 日立化成株式会社 半导体装置的制造方法
TWI437301B (zh) * 2006-02-03 2014-05-11 Hitachi Maxell Camera module
KR100770685B1 (ko) * 2006-04-19 2007-10-29 삼성전기주식회사 소켓 타입 인쇄회로기판 및 이를 이용한 카메라 모듈
KR100743083B1 (ko) * 2006-06-13 2007-07-27 주식회사 엠씨넥스 카메라 모듈
US7566854B2 (en) * 2006-12-08 2009-07-28 Advanced Chip Engineering Technology Inc. Image sensor module
WO2008096584A1 (ja) * 2007-02-07 2008-08-14 Konica Minolta Opto, Inc. 撮像装置の製造方法及び撮像装置並びに携帯端末
JP2010525412A (ja) 2007-04-24 2010-07-22 フレックストロニクス エーピー エルエルシー 底部にキャビティを備えるウエハーレベル光学部品とフリップチップ組立を用いた小型フォームファクタモジュール
CN100561280C (zh) * 2007-05-30 2009-11-18 鸿富锦精密工业（深圳）有限公司 相机模组及其制造方法
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
US8411192B2 (en) 2007-11-15 2013-04-02 Sharp Kabushiki Kaisha Image capturing module, method for manufacturing the image capturing module, and electronic information device
JP4714233B2 (ja) * 2007-11-20 2011-06-29 シャープ株式会社 撮像モジュールおよびその製造方法、電子情報機器
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
JP5047243B2 (ja) 2008-09-26 2012-10-10 シャープ株式会社 光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器
US8654215B2 (en) 2009-02-23 2014-02-18 Gary Edwin Sutton Mobile communicator with curved sensor camera
US8248499B2 (en) * 2009-02-23 2012-08-21 Gary Edwin Sutton Curvilinear sensor system
JP2010219713A (ja) * 2009-03-16 2010-09-30 Panasonic Corp 撮像装置
US9419032B2 (en) * 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
TWI425825B (zh) * 2009-12-31 2014-02-01 勝開科技股份有限公司 免調焦距影像感測器封裝結構
DE112010004616A5 (de) * 2010-04-01 2013-01-24 Conti Temic Microelectronic Gmbh Vorrichtung mit optischem modul und trägerplatte
JP5499257B2 (ja) * 2010-12-15 2014-05-21 ナルックス株式会社 光センサ用部品及び光センサ
US10009528B2 (en) 2011-02-24 2018-06-26 Nan Chang O-Film Optoelectronics Technology Ltd Autofocus camera module packaging with circuitry-integrated actuator system
US8545114B2 (en) 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane
US9599787B2 (en) * 2011-12-27 2017-03-21 Tera Xtal Technology Corporation Using sapphire lens to protect the lens module
JP2017152546A (ja) * 2016-02-25 2017-08-31 株式会社ニコン 撮像装置及び半導体装置
DE102016208547A1 (de) * 2016-05-18 2017-11-23 Robert Bosch Gmbh Kameramodul für ein Fahrzeug

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JPH10321827A (ja) * 1997-05-16 1998-12-04 Sony Corp 撮像装置及びカメラ
US6384397B1 (en) * 2000-05-10 2002-05-07 National Semiconductor Corporation Low cost die sized module for imaging application having a lens housing assembly
TW523924B (en) * 2001-01-12 2003-03-11 Konishiroku Photo Ind Image pickup device and image pickup lens
US6686588B1 (en) * 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
JP2003163342A (ja) * 2001-11-29 2003-06-06 Olympus Optical Co Ltd 固体撮像装置及びその製造方法
KR100476558B1 (ko) * 2002-05-27 2005-03-17 삼성전기주식회사 이미지 센서 모듈 및 그 제작 공정
KR20030091549A (ko) * 2002-05-28 2003-12-03 삼성전기주식회사 이미지 센서모듈 및 그 제조공정
JP4269334B2 (ja) * 2002-10-28 2009-05-27 コニカミノルタホールディングス株式会社 撮像レンズ、撮像ユニット及び携帯端末
JP2004194223A (ja) * 2002-12-13 2004-07-08 Konica Minolta Holdings Inc 撮像装置及び携帯端末
US20040113047A1 (en) * 2002-12-16 2004-06-17 Hsiu Wen Tu Image sensor module
US6940058B2 (en) * 2003-02-04 2005-09-06 Kingpak Technology, Inc. Injection molded image sensor module
JP4204368B2 (ja) * 2003-03-28 2009-01-07 シャープ株式会社 光学装置用モジュール及び光学装置用モジュールの製造方法
EP1471730A1 (en) * 2003-03-31 2004-10-27 Dialog Semiconductor GmbH Miniature camera module
TWM267483U (en) * 2004-07-16 2005-06-11 Kingpak Tech Inc Image sensor module

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013071494A1 (zh) * 2011-11-16 2013-05-23 Ho Chunwei 影像感测器模块
CN103428988A (zh) * 2012-05-22 2013-12-04 三星泰科威株式会社 印刷电路板及其制造方法
CN103428988B (zh) * 2012-05-22 2018-03-30 海成帝爱斯株式会社 印刷电路板及其制造方法
CN103941372A (zh) * 2013-01-17 2014-07-23 奇景光电股份有限公司 镜头模块及其制造方法
US9261629B2 (en) 2013-01-17 2016-02-16 Himax Technologies Limited Lens module and manufacturing method thereof
CN103941372B (zh) * 2013-01-17 2016-07-06 奇景光电股份有限公司 镜头模块及其制造方法
JP2021002055A (ja) * 2014-07-23 2021-01-07 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッドＨｅｐｔａｇｏｎ Ｍｉｃｒｏ Ｏｐｔｉｃｓ Ｐｔｅ． Ｌｔｄ． 縦方向アライメント機構を含む発光体および光検出モジュール
JP7084455B2 (ja) 2014-07-23 2022-06-14 ヘプタゴン・マイクロ・オプティクス・プライベート・リミテッド 縦方向アライメント機構を含む発光体および光検出モジュール
CN109616483A (zh) * 2017-09-28 2019-04-12 夏普株式会社 固体摄像装置及其制造方法
CN111627948A (zh) * 2020-06-05 2020-09-04 中国电子科技集团公司第四十四研究所 一种具有片上滤光片的ccd结构
CN113161430A (zh) * 2021-01-22 2021-07-23 南昌欧菲光电技术有限公司 感光组件及其制造方法、摄像模组和电子设备

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Publication number Publication date
KR20060056870A (ko) 2006-05-25
TW200636315A (en) 2006-10-16
US20060109367A1 (en) 2006-05-25
EP1659781A1 (en) 2006-05-24
JP2006148710A (ja) 2006-06-08

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Open date: 20060607