JP5010661B2 - 電子機器および電子機器の製造方法 - Google Patents
電子機器および電子機器の製造方法 Download PDFInfo
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- JP5010661B2 JP5010661B2 JP2009227208A JP2009227208A JP5010661B2 JP 5010661 B2 JP5010661 B2 JP 5010661B2 JP 2009227208 A JP2009227208 A JP 2009227208A JP 2009227208 A JP2009227208 A JP 2009227208A JP 5010661 B2 JP5010661 B2 JP 5010661B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 claims description 146
- 239000012790 adhesive layer Substances 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 54
- 239000010410 layer Substances 0.000 claims description 22
- 230000001681 protective effect Effects 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000004088 simulation Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01066—Dysprosium [Dy]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Description
σ:半導体チップ裏面にかかる応力値(MPa)
tchip:半導体チップの厚さ(mm)
dx:接着層投影領域の開口端縁から最外周外部接続端子の中心点までのx方向の距離(mm)
dy:接着層投影領域の開口端縁から最外周外部接続端子の中心点までのy方向の距離(mm)あ
tadh:接着層の厚さ(mm)
hball:外部接続端子の高さ(mm)
Eadh:接着層の弾性率(MPa)
なお、図5および図6において、横方向をx方向とし、縦方向をy方向とする。dxは左右(2辺)のdxで小さい方を、dyは上下2辺のdyで小さい方を採るものとする。また、Cは定数であり、係数a=0.03、b=0.23、c=0.44、d=2.2、e=0.76、f=−0.15である。
Claims (2)
- 第1の面に受光部を有する活性層が形成された半導体基板と、
前記半導体基板の前記第1の面上に、前記受光部を囲むように設けられた接着層と、
前記半導体基板の前記受光部上に所定の間隙をおいて配置され、前記接着層を介して接着された光透過性保護部材と、
前記半導体基板の前記第1の面とは反対側の第2の面に、所定の配列で配置された複数の外部接続端子とを備え、
最外周に位置する前記外部接続端子において、少なくとも対向する2辺を形成する前記外部接続端子の中心点が、前記接着層を前記第2の面に投影した領域(以下、接着層の投影領域と示す。)内に配置されている半導体装置であって、
前記半導体基板は50〜300μmの厚さを有しており、かつ中心点が前記接着層の投影領域外に配置された最外周外部接続端子において、前記接着層の投影領域の前記受光部を囲む開口端縁から前記中心点までの距離dが、前記外部接続端子の直径の−25%以上である半導体装置と、
該半導体装置の前記光透過性保護部材上に設けられたレンズモジュールと、
実装基板とを具備し、
前記半導体装置が前記外部接続端子を介して前記実装基板に実装されてなることを特徴とする電子機器。 - 請求項1記載の電子機器の製造方法であり、
最外周に位置する前記外部接続端子において、少なくとも対向する2辺を形成する前記外部接続端子の中心点が、前記接着層の投影領域内に配置され、かつ前記外部接続端子の中心点が前記接着層の投影領域外に配置された前記最外周外部接続端子において、前記接着層の投影領域の前記受光部を囲む開口端縁から前記中心点までの距離dが、前記外部接続端子の直径の−25%以上となるように設計し、それに基づいて製造することを特徴とする電子機器の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009227208A JP5010661B2 (ja) | 2009-09-30 | 2009-09-30 | 電子機器および電子機器の製造方法 |
CN2010102753337A CN102034834B (zh) | 2009-09-30 | 2010-09-06 | 半导体装置和电子设备、及其制造方法 |
US12/881,386 US8421207B2 (en) | 2009-09-30 | 2010-09-14 | Semiconductor device, electronic apparatus, and manufacturing methods thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009227208A JP5010661B2 (ja) | 2009-09-30 | 2009-09-30 | 電子機器および電子機器の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011077297A JP2011077297A (ja) | 2011-04-14 |
JP5010661B2 true JP5010661B2 (ja) | 2012-08-29 |
Family
ID=43779355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009227208A Expired - Fee Related JP5010661B2 (ja) | 2009-09-30 | 2009-09-30 | 電子機器および電子機器の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8421207B2 (ja) |
JP (1) | JP5010661B2 (ja) |
CN (1) | CN102034834B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7223767B2 (ja) | 2018-02-02 | 2023-02-16 | ディスペンディックス ゲーエムベーハー | 自動体積測定装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5975621B2 (ja) * | 2011-11-02 | 2016-08-23 | リンテック株式会社 | ダイシングシートおよび半導体チップの製造方法 |
JP6141760B2 (ja) * | 2013-12-19 | 2017-06-07 | 京セラ株式会社 | 撮像素子搭載用基板及び撮像装置 |
US20180006070A1 (en) * | 2015-02-13 | 2018-01-04 | Sony Corporation | Image sensor, method of manufacturing the same, and electronic apparatus |
US9653504B1 (en) * | 2015-11-03 | 2017-05-16 | Omnivision Technologies, Inc. | Chip-scale packaged image sensor packages with black masking and associated packaging methods |
KR102335306B1 (ko) * | 2016-03-12 | 2021-12-03 | 닝보 써니 오포테크 코., 엘티디. | 어레이 이미징 모듈, 성형 감광성 어셈블리 및 그 제조 방법, 및 전자 장치 |
KR20220021238A (ko) * | 2020-08-13 | 2022-02-22 | 삼성전자주식회사 | 반도체 패키지 및 그 제조방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5030360B2 (ja) * | 2002-12-25 | 2012-09-19 | オリンパス株式会社 | 固体撮像装置の製造方法 |
JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
KR100752713B1 (ko) * | 2005-10-10 | 2007-08-29 | 삼성전기주식회사 | 이미지센서의 웨이퍼 레벨 칩 스케일 패키지 및 그제조방법 |
JP2007129164A (ja) * | 2005-11-07 | 2007-05-24 | Sharp Corp | 光学装置用モジュール、光学装置用モジュールの製造方法、及び、構造体 |
WO2008053849A1 (fr) * | 2006-11-02 | 2008-05-08 | Toppan Printing Co., Ltd. | Périphérique d'imagerie à l'état condensécondensé et procédé de fabrication correspondant |
US8013350B2 (en) * | 2007-02-05 | 2011-09-06 | Panasonic Corporation | Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device |
JP5123575B2 (ja) * | 2007-06-14 | 2013-01-23 | 株式会社フジクラ | 配線基板及びその製造方法 |
JP5175620B2 (ja) * | 2008-05-29 | 2013-04-03 | シャープ株式会社 | 電子素子ウェハモジュールおよびその製造方法、電子素子モジュール、電子情報機器 |
US8048708B2 (en) * | 2008-06-25 | 2011-11-01 | Micron Technology, Inc. | Method and apparatus providing an imager module with a permanent carrier |
JP2010040621A (ja) * | 2008-08-01 | 2010-02-18 | Toshiba Corp | 固体撮像デバイス及びその製造方法 |
US8125042B2 (en) * | 2008-11-13 | 2012-02-28 | Samsung Electronics Co., Ltd. | Semiconductor package and method of manufacturing the same |
JP2011003828A (ja) * | 2009-06-22 | 2011-01-06 | Panasonic Corp | 光半導体装置、及びそれを用いた光ピックアップ装置、並びに電子機器 |
-
2009
- 2009-09-30 JP JP2009227208A patent/JP5010661B2/ja not_active Expired - Fee Related
-
2010
- 2010-09-06 CN CN2010102753337A patent/CN102034834B/zh not_active Expired - Fee Related
- 2010-09-14 US US12/881,386 patent/US8421207B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7223767B2 (ja) | 2018-02-02 | 2023-02-16 | ディスペンディックス ゲーエムベーハー | 自動体積測定装置 |
Also Published As
Publication number | Publication date |
---|---|
US20110073975A1 (en) | 2011-03-31 |
JP2011077297A (ja) | 2011-04-14 |
CN102034834A (zh) | 2011-04-27 |
US8421207B2 (en) | 2013-04-16 |
CN102034834B (zh) | 2013-05-29 |
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