JP2006140535A - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP2006140535A JP2006140535A JP2006028927A JP2006028927A JP2006140535A JP 2006140535 A JP2006140535 A JP 2006140535A JP 2006028927 A JP2006028927 A JP 2006028927A JP 2006028927 A JP2006028927 A JP 2006028927A JP 2006140535 A JP2006140535 A JP 2006140535A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- lead
- terminal surface
- electronic component
- corner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
Landscapes
- Wire Bonding (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
【解決手段】樹脂製のパッド部、及びパッド部に埋設された複数の端子ユニットを有し、各端子ユニットは、互いに平行に、かつ、端子面を露出させて配設されたリード部47を備え、端子面には、ボンディングワイヤとリード部47とを接合するための接合部が形成されるようになっている。二つの線分から成るコーナ部が形成された端子面を備える少なくとも二つの端子ユニットと、二つの線分から成るコーナ部が形成されない端子面を備える端子ユニットとを有する。コーナ部に基づいてリード部47の位置が認識されてワイヤボンディングが行われる。コーナ部は二つの線分から成るので、リード部47の画像を読み取ったときに、読み取られた画像のコーナ部を正確に認識することができる。
【選択図】図12
Description
なお、本発明は前記実施の形態に限定されるものではなく、本発明の趣旨に基づいて種々変形させることが可能であり、それらを本発明の範囲から排除するものではない。
38 コネクタ
43 パッド部
43a 樹脂面
47 リード部
47a 端子面
49 端子ユニット
53 ボンディングワイヤ
71 上金型
C キャビティ空間
K3 凸部
m1 接合部
q コーナ部
Claims (7)
- 樹脂製のパッド部、及び該パッド部に埋設された複数の端子ユニットを有し、該各端子ユニットは、互いに平行に、かつ、端子面を露出させて配設されたリード部を備え、前記端子面には、ボンディングワイヤとリード部とを接合するための接合部が形成された電子部品において、二つの線分から成るコーナ部が形成された端子面を備える少なくとも二つの端子ユニットと、二つの線分から成るコーナ部が形成されない端子面を備える端子ユニットとを有するとともに、二つの線分から成るコーナ部に基づいて前記リード部の位置が認識されてワイヤボンディングが行われることを特徴とする電子部品。
- 前記リード部の端子面における所定の部分に突起が形成され、前記コーナ部は、前記突起によって形成された線分、及び端子面における他の部分によって形成された線分が交差することによって形成される請求項1に記載の電子部品。
- 前記コーナ部において、前記端子面と前記樹脂面とがオフセットさせられる請求項1又は2に記載の電子部品。
- 前記コーナ部は、前記端子ユニットの複数のリード部のうちの両端に配設されたリード部の端子面に形成される請求項1〜3のいずれか1項に記載の電子部品。
- 前記パッド部における複数のリード間に凹部が形成される請求項1〜4のいずれか1項に記載の電子部品。
- 前記凹部は、前記端子ユニットを樹脂に埋め込む際に、金型に形成された複数の凸部によって形成される請求項5に記載の電子部品。
- 前記コーナ部の二つの線分のうちの一方の線分は、前記パッド部に形成された凹部に沿って形成される請求項5に記載の電子部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006028927A JP4331172B2 (ja) | 1999-01-08 | 2006-02-06 | 電子部品 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11003402A JP2000208181A (ja) | 1999-01-08 | 1999-01-08 | 電子部品及びその製造装置 |
JP2006028927A JP4331172B2 (ja) | 1999-01-08 | 2006-02-06 | 電子部品 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP36863799A Division JP2001189580A (ja) | 1999-01-08 | 1999-12-27 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006140535A true JP2006140535A (ja) | 2006-06-01 |
JP4331172B2 JP4331172B2 (ja) | 2009-09-16 |
Family
ID=11556393
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11003402A Pending JP2000208181A (ja) | 1999-01-08 | 1999-01-08 | 電子部品及びその製造装置 |
JP36863799A Pending JP2001189580A (ja) | 1999-01-08 | 1999-12-27 | 電子部品 |
JP2006028927A Expired - Lifetime JP4331172B2 (ja) | 1999-01-08 | 2006-02-06 | 電子部品 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11003402A Pending JP2000208181A (ja) | 1999-01-08 | 1999-01-08 | 電子部品及びその製造装置 |
JP36863799A Pending JP2001189580A (ja) | 1999-01-08 | 1999-12-27 | 電子部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6302706B1 (ja) |
JP (3) | JP2000208181A (ja) |
DE (1) | DE19963705B4 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002134643A (ja) * | 2000-10-20 | 2002-05-10 | Keihin Corp | ワイヤボンディング端子構造 |
DE10120362A1 (de) * | 2001-04-26 | 2002-11-21 | Integrated Electronic Systems Sys Consulting Gmbh | Spritzgussformteil |
US8824151B2 (en) | 2012-02-13 | 2014-09-02 | Ford Global Technologies, Llc | Mounting system for an electronic control module housing in a vehicle |
JP2018078022A (ja) * | 2016-11-09 | 2018-05-17 | 矢崎総業株式会社 | コネクタ |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6242241U (ja) * | 1986-08-08 | 1987-03-13 | ||
JPS6355537U (ja) * | 1986-09-29 | 1988-04-14 | ||
JPH0357256A (ja) * | 1989-07-26 | 1991-03-12 | Hitachi Ltd | ターゲットマークを有するパッケージリード |
JPH03214636A (ja) * | 1990-01-18 | 1991-09-19 | Matsushita Electric Works Ltd | プリント配線板 |
JPH09259956A (ja) * | 1996-03-15 | 1997-10-03 | Aisin Aw Co Ltd | 導電ワイヤ接続端子 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS618610Y2 (ja) * | 1980-11-13 | 1986-03-17 | ||
JPS5910244A (ja) * | 1982-07-09 | 1984-01-19 | Hitachi Ltd | 樹脂封止半導体装置 |
JPH01308410A (ja) * | 1984-04-09 | 1989-12-13 | Northern Petro Chem Co | エチレンの共重合 |
JPS60263120A (ja) * | 1984-06-12 | 1985-12-26 | Seiko Epson Corp | 液晶表示体 |
JPH0226270U (ja) * | 1988-08-05 | 1990-02-21 | ||
JPH04286147A (ja) * | 1991-03-15 | 1992-10-12 | Oki Electric Ind Co Ltd | 樹脂封止型半導体装置 |
JP2705368B2 (ja) * | 1991-05-31 | 1998-01-28 | 株式会社デンソー | 電子装置 |
JP2765278B2 (ja) * | 1991-05-31 | 1998-06-11 | 株式会社デンソー | 電子装置の製造方法 |
JPH05234630A (ja) * | 1992-02-25 | 1993-09-10 | Matsushita Electric Ind Co Ltd | 電子回路ユニット |
JP3372065B2 (ja) * | 1992-09-18 | 2003-01-27 | 株式会社村田製作所 | 弾性表面波装置 |
JP2973799B2 (ja) * | 1993-04-23 | 1999-11-08 | 富士電機株式会社 | パワートランジスタモジュール |
JP3075458B2 (ja) * | 1994-04-27 | 2000-08-14 | 矢崎総業株式会社 | 端子挿入方法 |
US5491302A (en) * | 1994-09-19 | 1996-02-13 | Tessera, Inc. | Microelectronic bonding with lead motion |
JP3168901B2 (ja) * | 1996-02-22 | 2001-05-21 | 株式会社日立製作所 | パワー半導体モジュール |
US5748451A (en) * | 1996-08-14 | 1998-05-05 | International Business Machines Corporation | Power distribution/stiffener for active back plane technologies |
KR100232680B1 (ko) * | 1997-01-22 | 1999-12-01 | 구본준 | Acf 구조 |
WO1998033217A1 (en) * | 1997-01-24 | 1998-07-30 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing thereof |
JP3281832B2 (ja) | 1997-03-07 | 2002-05-13 | 矢崎総業株式会社 | 電気接続具 |
JP3505997B2 (ja) | 1998-03-20 | 2004-03-15 | アイシン・エィ・ダブリュ株式会社 | 電子制御ユニット |
JPH11297450A (ja) | 1998-04-08 | 1999-10-29 | Nippon Abs Ltd | 端子のボンディング面の保護方法および電子機器ハウジング |
JP3472702B2 (ja) | 1998-04-08 | 2003-12-02 | 矢崎総業株式会社 | コネクタ一体型ケースの成形方法及びこの成形方法に用いられる型構造 |
JP3547333B2 (ja) * | 1999-02-22 | 2004-07-28 | 株式会社日立産機システム | 電力変換装置 |
-
1999
- 1999-01-08 JP JP11003402A patent/JP2000208181A/ja active Pending
- 1999-12-27 JP JP36863799A patent/JP2001189580A/ja active Pending
- 1999-12-29 US US09/475,213 patent/US6302706B1/en not_active Expired - Lifetime
- 1999-12-29 DE DE19963705A patent/DE19963705B4/de not_active Expired - Lifetime
-
2006
- 2006-02-06 JP JP2006028927A patent/JP4331172B2/ja not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6242241U (ja) * | 1986-08-08 | 1987-03-13 | ||
JPS6355537U (ja) * | 1986-09-29 | 1988-04-14 | ||
JPH0357256A (ja) * | 1989-07-26 | 1991-03-12 | Hitachi Ltd | ターゲットマークを有するパッケージリード |
JPH03214636A (ja) * | 1990-01-18 | 1991-09-19 | Matsushita Electric Works Ltd | プリント配線板 |
JPH09259956A (ja) * | 1996-03-15 | 1997-10-03 | Aisin Aw Co Ltd | 導電ワイヤ接続端子 |
Also Published As
Publication number | Publication date |
---|---|
DE19963705A1 (de) | 2000-08-17 |
JP2000208181A (ja) | 2000-07-28 |
JP4331172B2 (ja) | 2009-09-16 |
JP2001189580A (ja) | 2001-07-10 |
DE19963705B4 (de) | 2011-04-28 |
US6302706B1 (en) | 2001-10-16 |
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