JPH0226270U - - Google Patents

Info

Publication number
JPH0226270U
JPH0226270U JP1988103199U JP10319988U JPH0226270U JP H0226270 U JPH0226270 U JP H0226270U JP 1988103199 U JP1988103199 U JP 1988103199U JP 10319988 U JP10319988 U JP 10319988U JP H0226270 U JPH0226270 U JP H0226270U
Authority
JP
Japan
Prior art keywords
bonding part
terminal fitting
face
bonding
terminal device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988103199U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988103199U priority Critical patent/JPH0226270U/ja
Publication of JPH0226270U publication Critical patent/JPH0226270U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Multi-Conductor Connections (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例による端子装置の要
部を示す斜視図、第２図は第１図に示す実施例の
要部平面図、第３図は従来の端子装置を内燃機関
点火コイルの制御回路ユニツトに適用した例を示
す要部平面図、第４図は第３図の―線に沿う
側面図、第５図は第３図に用いた端子金具のボン
デイング部の詳細を示す斜視図、第６図は上記ボ
ンデイング部の埋め込み状態の詳細を示す斜視図
、第７図は一般的な内燃機関点火コイルの制御回
路の一例を示す回路図である。 図において１は樹脂成型体、１ａは成型端部、
４は端子金具、４１はボンデイング部、４４は端
面部である。なお、図中、同一符号は同一、また
は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. ワイヤをボンデイングするためのボンデイング
    部を有すると共に、このボンデイング部の少なく
    とも一方向に端面部を形成してなる端子金具、こ
    の端子金具のボンデイング部に対しこのボンデイ
    ング部の表面は露出させ、残部は上記端面部を含
    めて一体に包囲して上記端子金具を固定し、かつ
    上記端面部の前方に成型端部を有する樹脂成型体
    を備えたことを特徴とする端子装置。
JP1988103199U 1988-08-05 1988-08-05 Pending JPH0226270U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988103199U JPH0226270U (ja) 1988-08-05 1988-08-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988103199U JPH0226270U (ja) 1988-08-05 1988-08-05

Publications (1)

Publication Number Publication Date
JPH0226270U true JPH0226270U (ja) 1990-02-21

Family

ID=31333807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988103199U Pending JPH0226270U (ja) 1988-08-05 1988-08-05

Country Status (1)

Country Link
JP (1) JPH0226270U (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03264921A (ja) * 1990-03-15 1991-11-26 Nec Corp 液晶ディスプレイ用自動コントラスト調節機構
JPH0423063U (ja) * 1990-06-15 1992-02-25
JPH09259956A (ja) * 1996-03-15 1997-10-03 Aisin Aw Co Ltd 導電ワイヤ接続端子
JPH11273769A (ja) * 1998-03-20 1999-10-08 Aisin Aw Co Ltd 電子制御ユニット
JP2000349219A (ja) * 1999-06-03 2000-12-15 Mitsubishi Electric Corp 引き出し端子、電力用半導体装置用ケース及び電力用半導体装置
JP2001189580A (ja) * 1999-01-08 2001-07-10 Aisin Aw Co Ltd 電子部品
JP2002134643A (ja) * 2000-10-20 2002-05-10 Keihin Corp ワイヤボンディング端子構造
JP2002134642A (ja) * 2000-10-20 2002-05-10 Keihin Corp ワイヤボンディング端子構造
JP2003124423A (ja) * 2001-10-10 2003-04-25 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法
JP2019067885A (ja) * 2017-09-29 2019-04-25 三菱電機株式会社 半導体装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03264921A (ja) * 1990-03-15 1991-11-26 Nec Corp 液晶ディスプレイ用自動コントラスト調節機構
JPH0423063U (ja) * 1990-06-15 1992-02-25
JPH09259956A (ja) * 1996-03-15 1997-10-03 Aisin Aw Co Ltd 導電ワイヤ接続端子
JPH11273769A (ja) * 1998-03-20 1999-10-08 Aisin Aw Co Ltd 電子制御ユニット
DE19912834B4 (de) * 1998-03-20 2007-08-30 Aisin AW Co., Ltd., Anjo Elektronische Steuereinheit
JP2001189580A (ja) * 1999-01-08 2001-07-10 Aisin Aw Co Ltd 電子部品
JP2000349219A (ja) * 1999-06-03 2000-12-15 Mitsubishi Electric Corp 引き出し端子、電力用半導体装置用ケース及び電力用半導体装置
JP2002134643A (ja) * 2000-10-20 2002-05-10 Keihin Corp ワイヤボンディング端子構造
JP2002134642A (ja) * 2000-10-20 2002-05-10 Keihin Corp ワイヤボンディング端子構造
JP2003124423A (ja) * 2001-10-10 2003-04-25 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法
JP2019067885A (ja) * 2017-09-29 2019-04-25 三菱電機株式会社 半導体装置

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