JP2006128603A - セラミックス部材及びその製造方法 - Google Patents
セラミックス部材及びその製造方法 Download PDFInfo
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Abstract
【解決手段】静電チャック10は、アルミナ焼結体12と、アルミナ焼結体12上に形成され、腐食性ガスに曝されるイットリア焼結体13とを備える基体11と、基体11に埋設された静電電極15とを備える。
【選択図】図1
Description
本実施形態のセラミックス部材は、アルミナ焼結体と、アルミナ焼結体上に形成され、腐食性ガスに曝されるイットリア焼結体とを備える基体と、基体に埋設された金属部材とを備える。腐食性ガスに曝される部分はイットリア焼結体で形成されている。又、金属部材は、基体に埋設されている。そのため、セラミックス部材は、耐食性に非常に優れる。しかも、基体の一部は機械的強度に優れるアルミナ焼結体で形成される。更に、アルミナ焼結体とイットリア焼結体は熱膨張係数が近く、両者は強固に接合される。よって、セラミックス部材は、機械的強度にも非常に優れる。
図1に示すように、静電チャック10は、基体11と、静電電極15と、端子16とを備える。基体11は、基板載置面11aを有し、基板載置面11a上に載置された半導体基板や液晶基板などの基板を保持する。基体11には、静電電極15が埋設される。基体11は、アルミナ焼結体12と、イットリア焼結体13と、イットリウムとアルミニウムを含む中間層14とを備える。
本実施形態のセラミックス部材の製造方法は、アルミナ焼結体を形成する工程と、イットリア焼結体を形成する工程と、金属部材を形成する工程と、アルミナ焼結体とイットリア焼結体と金属部材とを一体化する工程とを備える。尚、アルミナ焼結体形成工程、イットリア焼結体形成工程、金属部材形成工程の順番は限定されない。又、アルミナ焼結体形成工程、イットリア焼結体形成工程、金属部材形成工程、一体化工程のうち、2つ以上の工程を同時に行うこともできるし、1つの工程を複数の工程に渡って行うこともできる。
まず、図2(a)に示すように、アルミナ焼結体12を形成する。具体的には、アルミナ焼結体12の原料粉末に、バインダー、水、分散剤等を添加して混合し、スラリーを作製する。原料粉末は、アルミナ粉末、アルミナ粉末とジルコニア粉末の混合粉末、アルミナ粉末とマグネシア粉末の混合粉末、アルミナ粉末とシリカ粉末の混合粉末などを用いることができる。但し、原料粉末に含まれるアルミナ量は、95重量%以上であることが好ましい。アルミナ量は、98重量%以上であることがより好ましい。又、アルミナ粉末の純度は、99.5重量%以上であることが好ましく、99.9重量%以上であることがより好ましい。又、アルミナ粉末や混合粉末の平均粒子径は、0.2〜1.0μmであることが好ましい。
(静電チャック)
静電チャック10などのセラミックス部材は、基体に埋設され、金属部材及び端子と接合し、金属部材と端子とを接続する接続部材とを備えることができる。このような接続部材を備えるセラミックス部材について、図4に示す静電チャック20を例にとって説明する。図1に示した静電チャック10と実質的に同様の部分には、同一の符号を付してここでは説明を省略する。
セラミックス部材には、静電チャックだけでなく、金属部材として抵抗発熱体を備えたヒーターがある。図5を用いてヒーター30について説明する。図1に示した静電チャック10と実質的に同様の部分には、同一の符号を付してここでは説明を省略する。
セラミックス部材には、静電チャックやヒーターだけでなく、金属部材としてRF電極を備えたサセプターがある。図6を用いて加熱処理が可能なサセプター40について説明する。図1、図4、図5に示した静電チャック10,20やヒーター30と実質的に同様の部分には、同一の符号を付してここでは説明を省略する。
イットリア焼結体の原料粉末として、純度99.9重量%、平均粒子径1μmのイットリア粉末を用意した。イットリア粉末に、水、分散材、バインダーとしてポリビニルアルコール(PVA)を添加し、トロンメルで16時間混合してスラリーを作製した。得られたスラリーを20μmの篩通しを行って不純物を取り除いた後、スプレードライヤーを用いて噴霧乾燥し、平均粒子径約80μmのイットリアの造粒顆粒を作製した。得られた造粒顆粒を、常圧酸化雰囲気炉にて500℃で仮焼し、脱脂すると共に、含有水分量を1%以下に調整した。
実施例1と同様にして、イットリア及びアルミナの造粒顆粒を準備した。まず、イットリアの造粒顆粒を金型に充填し、一軸プレス装置により、10kg重/cm2で加圧してイットリア成形体を作製し、イットリア成形体の密度を1.8g/ccに調整した。イットリア成形体上に、線径が0.12mmのメッシュ状のニオブの静電電極(金網電極)を載置した。更に、イットリア成形体、静電電極上に、アルミナの造粒顆粒を充填してプレス成形を行い、イットリア成形体、静電電極、アルミナ成形体の積層体を作製した。尚、積層体作製後のイットリア成形体の密度が2g/cc以下に調整できるように、10kg重/cm2で加圧して積層体を作製した。
アルミナ焼結体の原料粉末として、純度99.9重量%、平均粒子径0.5μmのアルミナ粉末と、純度99.9重量%、平均粒子径0.1μmのイットリア安定化ジルコニア粉末(8mol%YSZ)を用意した。アルミナ95重量%、イットリア安定化ジルコニア粉末5重量%に、水、分散材、バインダーとしてポリビニルアルコール(PVA)を添加し、トロンメルで16時間混合してスラリーを作製した。得られたスラリーを20μmの篩通しを行って不純物を取り除いた後、スプレードライヤーを用いて噴霧乾燥し、平均粒子径約80μmのアルミナ/ジルコニアの造粒顆粒を作製した。
実施例1〜3により得られた静電チャックについて以下の(1)〜(6)の評価を行った。(1)機械的強度:基体の一部を構成するアルミナ焼結体の室温における4点曲げ強度をJIS R1601に従って測定した。(2)体積抵抗率:誘電体層として機能するイットリア焼結体の室温における体積抵抗率をJIS C2141に従って測定した。印加電圧は2000V/mmとした。(3)相対密度:誘電体層として機能するイットリア焼結体の相対密度を、純水を媒体に用いたアルキメデス法により測定した。(4)熱膨張係数差:JIS R1618に従い、室温から1200℃までの温度範囲で、アルミナ焼結体の熱膨張係数とイットリア焼結体の熱膨張係数を測定し、両者の熱膨張係数の差を求めた。
11,21,31,41…基体
12…アルミナ焼結体
13…イットリア焼結体
14,34…中間層
14a…YAM層
14b…YAG層
15,25…静電電極
16,26,36,46…端子
27…接続部材
30…ヒーター
35…抵抗発熱体
40…サセプター
45…RF電極
Claims (21)
- アルミナ焼結体と、該アルミナ焼結体上に形成され、腐食性ガスに曝されるイットリア焼結体とを備える基体と、
該基体に埋設された金属部材と
を備えることを特徴とするセラミックス部材。 - 前記アルミナ焼結体と前記イットリア焼結体の熱膨張係数の差は、0.50×10−6/K以下であることを特徴とする請求項1に記載のセラミックス部材。
- 前記アルミナ焼結体の熱膨張係数は、前記イットリア焼結体の熱膨張係数よりも高いことを特徴とする請求項1又は2に記載のセラミックス部材。
- 前記アルミナ焼結体、前記イットリア焼結体及び前記金属部材は、一体焼結体であることを特徴とする請求項1乃至3のいずれか1項に記載のセラミックス部材。
- 前記アルミナ焼結体と前記イットリア焼結体との間に、イットリウムとアルミニウムを含む中間層を備えることを特徴とする請求項1乃至4のいずれか1項に記載のセラミックス部材。
- 前記中間層は、イットリウムとアルミニウムの含有量が異なる複数層を有することを特徴とする請求項5に記載のセラミックス部材。
- 前記金属部材は、前記アルミナ焼結体と前記イットリア焼結体との間に介在することを特徴とする請求項1乃至6のいずれか1項に記載のセラミックス部材。
- 前記金属部材は、前記アルミナ焼結体及び前記イットリア焼結体との熱膨張係数の差が3×10−6/K以下であることを特徴とする請求項1乃至7のいずれか1項に記載のセラミックス部材。
- 前記金属部材は静電電極、抵抗発熱体、又は、RF電極の少なくとも1つであることを特徴とする請求項1乃至8のいずれか1項に記載のセラミックス部材。
- 前記イットリア焼結体の体積抵抗率は、1×1015Ω・cm以上であることを特徴とする請求項1乃至9のいずれか1項に記載のセラミックス部材。
- 前記イットリア焼結体の厚さは、0.3〜0.5mmであることを特徴とする請求項1乃至10のいずれか1項に記載のセラミックス部材。
- 前記金属部材を給電部材に接続するための端子と、
前記基体に埋設され、前記金属部材及び前記端子と接合し、前記金属部材と前記端子とを接続する接続部材と
を備えることを特徴とする請求項1乃至11のいずれか1項に記載のセラミックス部材。 - 前記接続部材は、前記アルミナ焼結体との熱膨張係数の差が2×10−6/K以下であることを特徴とする請求項12に記載のセラミックス部材。
- 前記接続部材は、白金、又は、ニオブの少なくとも1つを含むことを特徴とする請求項12又は13に記載のセラミックス部材。
- 前記接続部材の金属部材との接合面と前記端子との接合面の距離は、1mm以上であることを特徴とする請求項12乃至14のいずれか1項に記載のセラミックス部材。
- アルミナ焼結体を形成する工程と、
イットリア焼結体を形成する工程と、
金属部材を形成する工程と、
前記アルミナ焼結体と前記イットリア焼結体と前記金属部材とを一体化する工程と
を備えることを特徴とするセラミックス部材の製造方法。 - アルミナ焼結体又はアルミナ仮焼体を形成する工程と、
前記アルミナ焼結体又は前記アルミナ仮焼体上に金属部材を形成する工程と、
前記金属部材上にイットリア成形体を形成する工程と、
前記アルミナ焼結体又は前記アルミナ仮焼体と、前記金属部材と、前記イットリア成形体とを一体に焼成する工程と
を備えることを特徴とする請求項16に記載のセラミックス部材の製造方法。 - イットリア焼結体又はイットリア仮焼体を形成する工程と、
前記イットリア焼結体又は前記イットリア仮焼体上に金属部材を形成する工程と、
前記金属部材上にアルミナ成形体を形成する工程と、
前記イットリア焼結体又は前記イットリア仮焼体と、前記金属部材と、前記アルミナ成形体とを一体に焼成する工程と
を備えることを特徴とする請求項16に記載のセラミックス部材の製造方法。 - 前記イットリア焼結体は、400℃以上で仮焼されたイットリア粉末を用いて形成することを特徴とする請求項16乃至18のいずれか1項に記載のセラミックス部材の製造方法。
- 前記イットリア焼結体は、含有水分量が1%以下のイットリア粉末を用いて形成することを特徴とする請求項16乃至19のいずれか1項に記載のセラミックス部材の製造方法。
- 前記イットリア焼結体は、密度が2g/cc以下のイットリア成形体を焼成して形成することを特徴とする請求項16乃至20のいずれか1項に記載のセラミックス部材の製造方法。
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