WO2008087983A1 - 載置台構造及び処理装置 - Google Patents

載置台構造及び処理装置 Download PDF

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Publication number
WO2008087983A1
WO2008087983A1 PCT/JP2008/050443 JP2008050443W WO2008087983A1 WO 2008087983 A1 WO2008087983 A1 WO 2008087983A1 JP 2008050443 W JP2008050443 W JP 2008050443W WO 2008087983 A1 WO2008087983 A1 WO 2008087983A1
Authority
WO
WIPO (PCT)
Prior art keywords
feeding
power
connection terminal
stress relaxing
receiving conductor
Prior art date
Application number
PCT/JP2008/050443
Other languages
English (en)
French (fr)
Inventor
Tomohito Komatsu
Hirohiko Yamamoto
Daisuke Toriya
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007250195A external-priority patent/JP5029257B2/ja
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to KR1020117008312A priority Critical patent/KR20110046586A/ko
Priority to CN2008800025213A priority patent/CN101584036B/zh
Publication of WO2008087983A1 publication Critical patent/WO2008087983A1/ja
Priority to US12/505,282 priority patent/US8334481B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Resistance Heating (AREA)

Abstract

　セラミック製の載置台本体（７２）の内部に被給電導体部（９６）が埋設されている。載置台本体（７２）の表面に凹部の形態の接続穴（１１２）が形成され、この接続穴（１１２）の内部に被給電導体部に電気的に接合された高融点金属、その合金、又はその化合物よりなる接続端子（１１０）が露出している。給電用ライン部材の先端に設けられた給電用コネクタ部（１１４）が被給電導体部への給電を行うために接続穴内へ挿入される。応力緩和部材（１１６）が、接続端子と給電用コネクタ部との間に介設される。応力緩和部材と接続端子とがロウ材（１２０）により接合される。応力緩和部材はコバルト及びニッケルを含まない金属又はその合金よりなる。これにより、接続端子と給電用コネクタ部との接合部における金属元素の熱拡散の発生を防止し、接合強度の劣化を防止することができる。
PCT/JP2008/050443 2007-01-17 2008-01-16 載置台構造及び処理装置 WO2008087983A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020117008312A KR20110046586A (ko) 2007-01-17 2008-01-16 탑재대 구조 및 처리 장치
CN2008800025213A CN101584036B (zh) 2007-01-17 2008-01-16 载置台构造和处理装置
US12/505,282 US8334481B2 (en) 2007-01-17 2009-07-17 Mounting table structure, and processing apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007008105 2007-01-17
JP2007-008105 2007-01-17
JP2007-250195 2007-09-26
JP2007250195A JP5029257B2 (ja) 2007-01-17 2007-09-26 載置台構造及び処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/505,282 Continuation US8334481B2 (en) 2007-01-17 2009-07-17 Mounting table structure, and processing apparatus

Publications (1)

Publication Number Publication Date
WO2008087983A1 true WO2008087983A1 (ja) 2008-07-24

Family

ID=39635985

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050443 WO2008087983A1 (ja) 2007-01-17 2008-01-16 載置台構造及び処理装置

Country Status (2)

Country Link
KR (1) KR20110046586A (ja)
WO (1) WO2008087983A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014023413A1 (en) * 2012-08-07 2014-02-13 Plansee Se Terminal for mechanical support of a heating element
JP2020126913A (ja) * 2019-02-04 2020-08-20 日本特殊陶業株式会社 セラミックス部材

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101591294B1 (ko) * 2014-10-24 2016-02-03 주식회사 에프알디 반도체 제조 장비용 세라믹 히터의 단자 결합 구조
JP6497248B2 (ja) * 2015-07-13 2019-04-10 住友電気工業株式会社 ウェハ保持体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774234A (ja) * 1993-06-28 1995-03-17 Tokyo Electron Ltd 静電チャックの電極構造、この組み立て方法、この組み立て治具及び処理装置
JPH1112053A (ja) * 1997-06-20 1999-01-19 Ngk Insulators Ltd セラミックスの接合構造およびその製造方法
JP2004253786A (ja) * 2003-01-29 2004-09-09 Ngk Insulators Ltd セラミックスの接合構造
JP2006128603A (ja) * 2004-09-30 2006-05-18 Ngk Insulators Ltd セラミックス部材及びその製造方法
JP2006186351A (ja) * 2001-10-03 2006-07-13 Sumitomo Electric Ind Ltd 半導体製造装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774234A (ja) * 1993-06-28 1995-03-17 Tokyo Electron Ltd 静電チャックの電極構造、この組み立て方法、この組み立て治具及び処理装置
JPH1112053A (ja) * 1997-06-20 1999-01-19 Ngk Insulators Ltd セラミックスの接合構造およびその製造方法
JP2006186351A (ja) * 2001-10-03 2006-07-13 Sumitomo Electric Ind Ltd 半導体製造装置
JP2004253786A (ja) * 2003-01-29 2004-09-09 Ngk Insulators Ltd セラミックスの接合構造
JP2006128603A (ja) * 2004-09-30 2006-05-18 Ngk Insulators Ltd セラミックス部材及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014023413A1 (en) * 2012-08-07 2014-02-13 Plansee Se Terminal for mechanical support of a heating element
US10136472B2 (en) 2012-08-07 2018-11-20 Plansee Se Terminal for mechanical support of a heating element
JP2020126913A (ja) * 2019-02-04 2020-08-20 日本特殊陶業株式会社 セラミックス部材

Also Published As

Publication number Publication date
KR20110046586A (ko) 2011-05-04

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