JP5062959B2 - セラミックス部材及びその製造方法 - Google Patents
セラミックス部材及びその製造方法 Download PDFInfo
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Description
図1に示すように、セラミックス部材は10、セラミックス焼結体11と、金属部材12とを備える。金属部材12は、セラミックス焼結体11に接して形成されている。セラミックス部材10では、セラミックス焼結体11における金属部材12周辺の変質層11aの厚さtが300μm以下に抑えられている。変質層11aの厚さtは、200μm以下であることが好ましく、100μm以下であることがより好ましい。変質層11aの厚さtは0μmであることが更に好ましい。即ち、セラミックス焼結体11は、変質層11aを有しないことが特に好ましい。
金属部材12は、セラミックス焼結体11に接して形成されていればよい。金属部材12は、図1に示すように、セラミックス焼結体11に埋設されていることが好ましい。これによれば、セラミックス部材10の使用環境が腐食性環境や高熱環境の場合であっても、金属部材12がそのような環境に直接曝されることを防止できる。そのため、セラミックス部材10の耐食性や耐熱性を向上できる。
このようなセラミックス部材10の製造方法は、例えば、セラミックス成形体を作製する成形体作製工程と、金属元素を含む金属部材をセラミックス成形体に接して形成する金属部材形成工程と、セラミックス成形体及び前記金属部材を焼成する焼成工程とを有することができる。但し、セラミックス成形体の相対密度が40%以上、焼成工程中1600℃におけるセラミックス焼結体の相対密度が80%以上となるように調整する。更に、焼成工程は、1500〜1700℃の温度範囲において、減圧雰囲気で保持する工程を含んでいる。
Dr(1600)={D(1600)/D(th)}×100 (%) (3)
セラミックス成形体の相対密度Dr(pr)は、例えば、セラミックス成形体の作製に用いるセラミックス原料粉末の平均粒子径、焼結助剤の種類、焼結助剤の添加量、又は、成形圧力の少なくとも1つを適宜調整することにより、40%以上となるように調整することが好ましい。焼成工程中1600℃におけるセラミックス焼結体の相対密度Dr(1600)は、例えば、セラミックス成形体の作製に用いるセラミックス原料粉末の平均粒子径、焼結助剤の種類、焼結助剤の添加量、又は、焼成条件の少なくとも1つを適宜調整することにより、80%以上となるように調整することが好ましい。焼成条件として、例えば、焼成温度や焼成時間、昇温速度などの焼成スケジュール、焼成雰囲気、焼成方法、減圧雰囲気での保持条件(保持時間、保持温度、圧力)などを調整することができる。例えば、これらは、セラミックス原料粉末の種類などに応じて、適宜調整できる。
図3に示すように、ヒーター30は、基体31と、抵抗発熱体32と、管状部材33と、給電部材34とを備える。ヒーター30は、半導体基板や液晶基板などの基板を載置する基板載置面30aを有している。ヒーター30は、基板載置面30a上に載置された基板を加熱する。
図4に示すように、静電チャック40は、基体41と、静電電極42と、誘電体層43と、給電部材44とを備える。静電チャック40は、基板載置面40aを有し、基板載置面40a上に載置された基板を吸着して保持する。
まず、純度99.9重量%の窒化アルミニウム粉末を表1に示す各平均粒子径に調整した。窒化アルミニウム粉末95重量%に、焼結助剤として平均粒子径1.3μm、純度99.9重量%のイットリア粉末5重量%を加え、ボールミルを用いて混合した。得られた混合粉末に、バインダー(PVA)及びイソプロピルアルコール(IPA)を添加して混合し、スラリーを作製した。スラリーを噴霧造粒法により造粒し、造粒粉を作製した。
11,21 セラミックス焼結体
11a,21a 変質層
12,22 金属部材
30 ヒーター
31,41 基体
32 抵抗発熱体
33 管状部材
34,44 給電部材
40 静電チャック
42 静電電極
43 誘電体層
Claims (10)
- 窒化アルミニウムを含むセラミックス焼結体と、
該セラミックス焼結体に接して形成された、金属元素を含む金属部材と
を備えるセラミックス部材であって、
前記セラミックス部材は、前記金属部材を前記セラミック焼結体に焼成する前のセラミックス成形体に接して形成したあと前記セラミックス成形体及び前記金属部材を焼成することにより得られたものであり、
前記セラミックス焼結体における前記金属部材周辺のセラミックスを主成分とする変質層の厚さが300μm以下であることを特徴とするセラミックス部材。 - 前記金属部材は、前記セラミックス部材の製造過程における体積抵抗値の変化率が20%以下であることを特徴とする請求項1に記載のセラミックス部材。
- 前記金属部材は、4a族元素、5a族元素及び6a族元素の群から選ばれる1種類以上の金属元素を含むことを特徴とする請求項1又は2に記載のセラミックス部材。
- 前記セラミックス焼結体は、希土類元素及びアルカリ土類元素の群から選ばれる1種類以上の元素を酸化物換算量で10重量%以下含むことを特徴とする請求項1乃至3のいずれか1項に記載のセラミックス部材。
- 前記金属部材は、前記セラミックス焼結体に埋設されていることを特徴とする請求項1乃至4のいずれか1項に記載のセラミックス部材。
- 前記金属部材は、抵抗発熱体、静電電極、又は、RF電極の少なくとも1つであることを特徴とする請求項1乃至5のいずれか1項に記載のセラミックス部材。
- 窒化アルミニウムを含むセラミックス成形体を作製する成形体作製工程と、
金属元素を含む金属部材を前記セラミックス成形体に接して形成する金属部材形成工程と、
前記セラミックス成形体及び前記金属部材を焼成する焼成工程とを備え、
前記セラミックス成形体の相対密度が40%以上、前記焼成工程中1600℃におけるセラミックス焼結体の相対密度が80%以上となるように調整し、
前記焼成工程は、1500〜1700℃の温度範囲において、減圧雰囲気で保持し、その後、1750〜2100℃の温度範囲において、不活性ガス雰囲気又は減圧雰囲気で焼成する工程である、セラミックス部材の製造方法。 - 前記焼成工程による前記金属部材の体積抵抗値の変化率が20%以下であることを特徴とする請求項7に記載のセラミックス部材の製造方法。
- セラミックス原料粉末の平均粒子径、焼結助剤の種類、焼結助剤の添加量、又は、成形圧力の少なくとも1つを調整することにより前記セラミックス成形体の相対密度を調整し、セラミックス原料粉末の平均粒子径、焼結助剤の種類、焼結助剤の添加量、成形圧力、又は、焼成条件の少なくとも1つを調整することにより前記セラミックス焼結体の相対密度を調整することを特徴とする請求項7又は8に記載のセラミックス部材の製造方法。
- 前記焼成工程は、ホットプレス法を用いて行うことを特徴とする請求項7乃至9のいずれか1項に記載のセラミックス部材の製造方法。
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JP2005090236A JP5062959B2 (ja) | 2005-03-25 | 2005-03-25 | セラミックス部材及びその製造方法 |
US11/384,153 US20060216533A1 (en) | 2005-03-25 | 2006-03-17 | Ceramic member and method for producing the same |
KR1020060026077A KR100706064B1 (ko) | 2005-03-25 | 2006-03-22 | 세라믹스 부재 및 그 제조 방법 |
TW095110231A TWI322140B (en) | 2005-03-25 | 2006-03-24 | Ceramic member and method for producing the same |
US12/511,339 US20090283933A1 (en) | 2005-03-25 | 2009-07-29 | Ceramic member and method for producing the same |
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JP5062959B2 true JP5062959B2 (ja) | 2012-10-31 |
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JP2016018906A (ja) * | 2014-07-09 | 2016-02-01 | 日本特殊陶業株式会社 | 電極埋設体 |
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US20080318071A1 (en) * | 2007-06-21 | 2008-12-25 | Moen Incorporated | Metallic coating on substrate |
JP5345583B2 (ja) * | 2009-04-07 | 2013-11-20 | 日本碍子株式会社 | 静電チャック |
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2005
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JP2016018906A (ja) * | 2014-07-09 | 2016-02-01 | 日本特殊陶業株式会社 | 電極埋設体 |
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KR100706064B1 (ko) | 2007-04-13 |
US20090283933A1 (en) | 2009-11-19 |
KR20060103141A (ko) | 2006-09-28 |
JP2006273586A (ja) | 2006-10-12 |
TW200640826A (en) | 2006-12-01 |
US20060216533A1 (en) | 2006-09-28 |
TWI322140B (en) | 2010-03-21 |
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