JP2006024751A5 - - Google Patents

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Publication number
JP2006024751A5
JP2006024751A5 JP2004201633A JP2004201633A JP2006024751A5 JP 2006024751 A5 JP2006024751 A5 JP 2006024751A5 JP 2004201633 A JP2004201633 A JP 2004201633A JP 2004201633 A JP2004201633 A JP 2004201633A JP 2006024751 A5 JP2006024751 A5 JP 2006024751A5
Authority
JP
Japan
Prior art keywords
adhesive composition
weight
conductor
parts
thermosetting adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2004201633A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006024751A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004201633A priority Critical patent/JP2006024751A/ja
Priority claimed from JP2004201633A external-priority patent/JP2006024751A/ja
Priority to EP05768133A priority patent/EP1785017A1/en
Priority to PCT/US2005/023373 priority patent/WO2006017037A1/en
Priority to KR1020077002798A priority patent/KR20070033016A/ko
Priority to US11/571,624 priority patent/US20070224397A1/en
Priority to CNA2005800230784A priority patent/CN1985553A/zh
Priority to TW094123255A priority patent/TW200618703A/zh
Publication of JP2006024751A publication Critical patent/JP2006024751A/ja
Publication of JP2006024751A5 publication Critical patent/JP2006024751A5/ja
Ceased legal-status Critical Current

Links

JP2004201633A 2004-07-08 2004-07-08 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品 Ceased JP2006024751A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2004201633A JP2006024751A (ja) 2004-07-08 2004-07-08 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品
EP05768133A EP1785017A1 (en) 2004-07-08 2005-07-01 Connection method of conductive articles, and electric or electronic component with parts connected by the connection method
PCT/US2005/023373 WO2006017037A1 (en) 2004-07-08 2005-07-01 Connection method of conductive articles, and electric or electronic component with parts connected by the connection method
KR1020077002798A KR20070033016A (ko) 2004-07-08 2005-07-01 도전성 물품의 접속 방법, 및 이 접속 방법에 의해 접속된부품을 갖는 전기 또는 전자 성분
US11/571,624 US20070224397A1 (en) 2004-07-08 2005-07-01 Connection Method of Conductive Articles, and Electric or Electronic Component with Parts Connected By the Connection Method
CNA2005800230784A CN1985553A (zh) 2004-07-08 2005-07-01 连接导电制品的方法，和具有通过所述连接方法连接的部件的电气或电子元件
TW094123255A TW200618703A (en) 2004-07-08 2005-07-08 Connection method of conductive articles, and electric or electronic component with parts connected by the connection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004201633A JP2006024751A (ja) 2004-07-08 2004-07-08 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品

Publications (2)

Publication Number Publication Date
JP2006024751A JP2006024751A (ja) 2006-01-26
JP2006024751A5 true JP2006024751A5 (enExample) 2007-08-23

Family

ID=35797809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004201633A Ceased JP2006024751A (ja) 2004-07-08 2004-07-08 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品

Country Status (7)

Country Link
US (1) US20070224397A1 (enExample)
EP (1) EP1785017A1 (enExample)
JP (1) JP2006024751A (enExample)
KR (1) KR20070033016A (enExample)
CN (1) CN1985553A (enExample)
TW (1) TW200618703A (enExample)
WO (1) WO2006017037A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4803350B2 (ja) * 2005-06-03 2011-10-26 信越化学工業株式会社 圧着性異方導電性樹脂組成物及び微細電極の接続方法
JP2008118091A (ja) * 2006-10-10 2008-05-22 Sumitomo Electric Ind Ltd 配線板、配線板接続体および配線板モジュール
JP5186157B2 (ja) * 2007-08-24 2013-04-17 デクセリアルズ株式会社 異方性導電フィルム及びそれを用いた接続構造体の製造方法
EP2192167A4 (en) * 2007-09-19 2013-07-03 Toray Industries ADHESIVE COMPOSITION FOR ELECTRONIC COMPOSITIONS AND ADHESIVE FOR ELECTRONIC COMPOSITIONS THEREWITH
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
KR20090055673A (ko) * 2007-11-29 2009-06-03 삼성전자주식회사 인쇄회로기판 조립체 및 그 제조방법
JP2009188114A (ja) * 2008-02-05 2009-08-20 Three M Innovative Properties Co フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器
JP5732631B2 (ja) 2009-09-18 2015-06-10 ボンドテック株式会社 接合装置および接合方法
US20120257343A1 (en) * 2011-04-08 2012-10-11 Endicott Interconnect Technologies, Inc. Conductive metal micro-pillars for enhanced electrical interconnection
WO2018022379A1 (en) 2016-07-28 2018-02-01 3M Innovative Properties Company Electrical cable

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0289026B1 (en) * 1987-05-01 1994-12-28 Canon Kabushiki Kaisha External circuit connecting method and packaging structure
JP3231814B2 (ja) * 1991-07-12 2001-11-26 ミネソタ マイニング アンド マニュファクチャリング カンパニー 異方性導電膜
JP2937705B2 (ja) * 1993-08-31 1999-08-23 アルプス電気株式会社 プリント配線板の接続方法
JP2978390B2 (ja) * 1993-12-16 1999-11-15 松下電器産業株式会社 フレキシブルプリント基板と配線基板との接続体の製造方法
US5936850A (en) * 1995-03-03 1999-08-10 Canon Kabushiki Kaisha Circuit board connection structure and method, and liquid crystal device including the connection structure
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
JP2000204332A (ja) * 1999-01-08 2000-07-25 Minnesota Mining & Mfg Co <3M> 熱剥離性接着剤組成物および接着構造体
US6228500B1 (en) * 1999-03-08 2001-05-08 3M Innovative Properties Company Adhesive composition and precursor thereof
JP4201436B2 (ja) * 1999-07-14 2008-12-24 日東電工株式会社 多層配線基板の製造方法
JP2001107009A (ja) * 1999-09-30 2001-04-17 Three M Innovative Properties Co 熱硬化性接着剤組成物及びそれを用いた接着構造
US6520669B1 (en) * 2000-06-19 2003-02-18 Light Sciences Corporation Flexible substrate mounted solid-state light sources for exterior vehicular lighting
US20050224978A1 (en) * 2002-06-24 2005-10-13 Kohichiro Kawate Heat curable adhesive composition, article, semiconductor apparatus and method

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