JP2006024751A - 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品 - Google Patents

平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品 Download PDF

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Publication number
JP2006024751A
JP2006024751A JP2004201633A JP2004201633A JP2006024751A JP 2006024751 A JP2006024751 A JP 2006024751A JP 2004201633 A JP2004201633 A JP 2004201633A JP 2004201633 A JP2004201633 A JP 2004201633A JP 2006024751 A JP2006024751 A JP 2006024751A
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JP
Japan
Prior art keywords
conductor
adhesive composition
multiconductor
planar
thermosetting adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2004201633A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006024751A5 (enExample
Inventor
Yoshihisa Kawate
良尚 川手
Koichiro Kawate
恒一郎 川手
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to JP2004201633A priority Critical patent/JP2006024751A/ja
Priority to EP05768133A priority patent/EP1785017A1/en
Priority to PCT/US2005/023373 priority patent/WO2006017037A1/en
Priority to KR1020077002798A priority patent/KR20070033016A/ko
Priority to US11/571,624 priority patent/US20070224397A1/en
Priority to CNA2005800230784A priority patent/CN1985553A/zh
Priority to TW094123255A priority patent/TW200618703A/zh
Publication of JP2006024751A publication Critical patent/JP2006024751A/ja
Publication of JP2006024751A5 publication Critical patent/JP2006024751A5/ja
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2004201633A 2004-07-08 2004-07-08 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品 Ceased JP2006024751A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2004201633A JP2006024751A (ja) 2004-07-08 2004-07-08 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品
EP05768133A EP1785017A1 (en) 2004-07-08 2005-07-01 Connection method of conductive articles, and electric or electronic component with parts connected by the connection method
PCT/US2005/023373 WO2006017037A1 (en) 2004-07-08 2005-07-01 Connection method of conductive articles, and electric or electronic component with parts connected by the connection method
KR1020077002798A KR20070033016A (ko) 2004-07-08 2005-07-01 도전성 물품의 접속 방법, 및 이 접속 방법에 의해 접속된부품을 갖는 전기 또는 전자 성분
US11/571,624 US20070224397A1 (en) 2004-07-08 2005-07-01 Connection Method of Conductive Articles, and Electric or Electronic Component with Parts Connected By the Connection Method
CNA2005800230784A CN1985553A (zh) 2004-07-08 2005-07-01 连接导电制品的方法，和具有通过所述连接方法连接的部件的电气或电子元件
TW094123255A TW200618703A (en) 2004-07-08 2005-07-08 Connection method of conductive articles, and electric or electronic component with parts connected by the connection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004201633A JP2006024751A (ja) 2004-07-08 2004-07-08 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品

Publications (2)

Publication Number Publication Date
JP2006024751A true JP2006024751A (ja) 2006-01-26
JP2006024751A5 JP2006024751A5 (enExample) 2007-08-23

Family

ID=35797809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004201633A Ceased JP2006024751A (ja) 2004-07-08 2004-07-08 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品

Country Status (7)

Country Link
US (1) US20070224397A1 (enExample)
EP (1) EP1785017A1 (enExample)
JP (1) JP2006024751A (enExample)
KR (1) KR20070033016A (enExample)
CN (1) CN1985553A (enExample)
TW (1) TW200618703A (enExample)
WO (1) WO2006017037A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008118091A (ja) * 2006-10-10 2008-05-22 Sumitomo Electric Ind Ltd 配線板、配線板接続体および配線板モジュール

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4803350B2 (ja) * 2005-06-03 2011-10-26 信越化学工業株式会社 圧着性異方導電性樹脂組成物及び微細電極の接続方法
JP5186157B2 (ja) * 2007-08-24 2013-04-17 デクセリアルズ株式会社 異方性導電フィルム及びそれを用いた接続構造体の製造方法
EP2192167A4 (en) * 2007-09-19 2013-07-03 Toray Industries ADHESIVE COMPOSITION FOR ELECTRONIC COMPOSITIONS AND ADHESIVE FOR ELECTRONIC COMPOSITIONS THEREWITH
JP2009096851A (ja) * 2007-10-15 2009-05-07 Three M Innovative Properties Co 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法
KR20090055673A (ko) * 2007-11-29 2009-06-03 삼성전자주식회사 인쇄회로기판 조립체 및 그 제조방법
JP2009188114A (ja) * 2008-02-05 2009-08-20 Three M Innovative Properties Co フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器
JP5732631B2 (ja) 2009-09-18 2015-06-10 ボンドテック株式会社 接合装置および接合方法
US20120257343A1 (en) * 2011-04-08 2012-10-11 Endicott Interconnect Technologies, Inc. Conductive metal micro-pillars for enhanced electrical interconnection
WO2018022379A1 (en) 2016-07-28 2018-02-01 3M Innovative Properties Company Electrical cable

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0289026B1 (en) * 1987-05-01 1994-12-28 Canon Kabushiki Kaisha External circuit connecting method and packaging structure
JP3231814B2 (ja) * 1991-07-12 2001-11-26 ミネソタ マイニング アンド マニュファクチャリング カンパニー 異方性導電膜
JP2937705B2 (ja) * 1993-08-31 1999-08-23 アルプス電気株式会社 プリント配線板の接続方法
JP2978390B2 (ja) * 1993-12-16 1999-11-15 松下電器産業株式会社 フレキシブルプリント基板と配線基板との接続体の製造方法
US5936850A (en) * 1995-03-03 1999-08-10 Canon Kabushiki Kaisha Circuit board connection structure and method, and liquid crystal device including the connection structure
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
JP2000204332A (ja) * 1999-01-08 2000-07-25 Minnesota Mining & Mfg Co <3M> 熱剥離性接着剤組成物および接着構造体
US6228500B1 (en) * 1999-03-08 2001-05-08 3M Innovative Properties Company Adhesive composition and precursor thereof
JP4201436B2 (ja) * 1999-07-14 2008-12-24 日東電工株式会社 多層配線基板の製造方法
JP2001107009A (ja) * 1999-09-30 2001-04-17 Three M Innovative Properties Co 熱硬化性接着剤組成物及びそれを用いた接着構造
US6520669B1 (en) * 2000-06-19 2003-02-18 Light Sciences Corporation Flexible substrate mounted solid-state light sources for exterior vehicular lighting
US20050224978A1 (en) * 2002-06-24 2005-10-13 Kohichiro Kawate Heat curable adhesive composition, article, semiconductor apparatus and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008118091A (ja) * 2006-10-10 2008-05-22 Sumitomo Electric Ind Ltd 配線板、配線板接続体および配線板モジュール

Also Published As

Publication number Publication date
CN1985553A (zh) 2007-06-20
KR20070033016A (ko) 2007-03-23
EP1785017A1 (en) 2007-05-16
WO2006017037A1 (en) 2006-02-16
TW200618703A (en) 2006-06-01
US20070224397A1 (en) 2007-09-27

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