TW200618703A - Connection method of conductive articles, and electric or electronic component with parts connected by the connection method - Google Patents
Connection method of conductive articles, and electric or electronic component with parts connected by the connection methodInfo
- Publication number
- TW200618703A TW200618703A TW094123255A TW94123255A TW200618703A TW 200618703 A TW200618703 A TW 200618703A TW 094123255 A TW094123255 A TW 094123255A TW 94123255 A TW94123255 A TW 94123255A TW 200618703 A TW200618703 A TW 200618703A
- Authority
- TW
- Taiwan
- Prior art keywords
- connection method
- electric
- electronic component
- parts connected
- conductive articles
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004201633A JP2006024751A (ja) | 2004-07-08 | 2004-07-08 | 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品 |
US63846804P | 2004-12-22 | 2004-12-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200618703A true TW200618703A (en) | 2006-06-01 |
Family
ID=35797809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094123255A TW200618703A (en) | 2004-07-08 | 2005-07-08 | Connection method of conductive articles, and electric or electronic component with parts connected by the connection method |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070224397A1 (zh) |
EP (1) | EP1785017A1 (zh) |
JP (1) | JP2006024751A (zh) |
KR (1) | KR20070033016A (zh) |
CN (1) | CN1985553A (zh) |
TW (1) | TW200618703A (zh) |
WO (1) | WO2006017037A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4803350B2 (ja) * | 2005-06-03 | 2011-10-26 | 信越化学工業株式会社 | 圧着性異方導電性樹脂組成物及び微細電極の接続方法 |
JP2008118091A (ja) * | 2006-10-10 | 2008-05-22 | Sumitomo Electric Ind Ltd | 配線板、配線板接続体および配線板モジュール |
JP5186157B2 (ja) * | 2007-08-24 | 2013-04-17 | デクセリアルズ株式会社 | 異方性導電フィルム及びそれを用いた接続構造体の製造方法 |
MY150038A (en) * | 2007-09-19 | 2013-11-29 | Toray Industries | Adhesive composition for electronic components, and adhesive sheet for electronic components using the same |
JP2009096851A (ja) * | 2007-10-15 | 2009-05-07 | Three M Innovative Properties Co | 非導電性接着剤組成物及び非導電性接着フィルム、並びにそれらの製造方法及び使用方法 |
KR20090055673A (ko) * | 2007-11-29 | 2009-06-03 | 삼성전자주식회사 | 인쇄회로기판 조립체 및 그 제조방법 |
JP2009188114A (ja) * | 2008-02-05 | 2009-08-20 | Three M Innovative Properties Co | フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器 |
JP5732631B2 (ja) | 2009-09-18 | 2015-06-10 | ボンドテック株式会社 | 接合装置および接合方法 |
US20120257343A1 (en) * | 2011-04-08 | 2012-10-11 | Endicott Interconnect Technologies, Inc. | Conductive metal micro-pillars for enhanced electrical interconnection |
CN210120253U (zh) | 2016-07-28 | 2020-02-28 | 3M创新有限公司 | 电缆和电缆组件 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0289026B1 (en) * | 1987-05-01 | 1994-12-28 | Canon Kabushiki Kaisha | External circuit connecting method and packaging structure |
JP3231814B2 (ja) * | 1991-07-12 | 2001-11-26 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 異方性導電膜 |
JP2937705B2 (ja) * | 1993-08-31 | 1999-08-23 | アルプス電気株式会社 | プリント配線板の接続方法 |
JP2978390B2 (ja) * | 1993-12-16 | 1999-11-15 | 松下電器産業株式会社 | フレキシブルプリント基板と配線基板との接続体の製造方法 |
US5936850A (en) * | 1995-03-03 | 1999-08-10 | Canon Kabushiki Kaisha | Circuit board connection structure and method, and liquid crystal device including the connection structure |
US20010028953A1 (en) * | 1998-11-16 | 2001-10-11 | 3M Innovative Properties Company | Adhesive compositions and methods of use |
JP2000204332A (ja) * | 1999-01-08 | 2000-07-25 | Minnesota Mining & Mfg Co <3M> | 熱剥離性接着剤組成物および接着構造体 |
US6228500B1 (en) * | 1999-03-08 | 2001-05-08 | 3M Innovative Properties Company | Adhesive composition and precursor thereof |
JP4201436B2 (ja) * | 1999-07-14 | 2008-12-24 | 日東電工株式会社 | 多層配線基板の製造方法 |
JP2001107009A (ja) * | 1999-09-30 | 2001-04-17 | Three M Innovative Properties Co | 熱硬化性接着剤組成物及びそれを用いた接着構造 |
US6520669B1 (en) * | 2000-06-19 | 2003-02-18 | Light Sciences Corporation | Flexible substrate mounted solid-state light sources for exterior vehicular lighting |
US20050224978A1 (en) * | 2002-06-24 | 2005-10-13 | Kohichiro Kawate | Heat curable adhesive composition, article, semiconductor apparatus and method |
-
2004
- 2004-07-08 JP JP2004201633A patent/JP2006024751A/ja not_active Ceased
-
2005
- 2005-07-01 WO PCT/US2005/023373 patent/WO2006017037A1/en active Application Filing
- 2005-07-01 US US11/571,624 patent/US20070224397A1/en not_active Abandoned
- 2005-07-01 KR KR1020077002798A patent/KR20070033016A/ko not_active Application Discontinuation
- 2005-07-01 EP EP05768133A patent/EP1785017A1/en not_active Withdrawn
- 2005-07-01 CN CNA2005800230784A patent/CN1985553A/zh active Pending
- 2005-07-08 TW TW094123255A patent/TW200618703A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP1785017A1 (en) | 2007-05-16 |
US20070224397A1 (en) | 2007-09-27 |
KR20070033016A (ko) | 2007-03-23 |
JP2006024751A (ja) | 2006-01-26 |
CN1985553A (zh) | 2007-06-20 |
WO2006017037A1 (en) | 2006-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200618703A (en) | Connection method of conductive articles, and electric or electronic component with parts connected by the connection method | |
WO2006110634A3 (en) | Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method | |
WO2007005617A3 (en) | Electrically conducting polymer glue, devices made therewith and methods of manufacture | |
WO2008005782A3 (en) | Conductive adhesive tape having different adhesion on both surfaces and method for manufacturing the same | |
GB2411293B (en) | Multilayered integrated circuit with extraneous conductive traces | |
TW200610080A (en) | Electronic device and method of manufacturing the same | |
TW200721934A (en) | Electronic component embedded board and its manufacturing method | |
WO2008049006A3 (en) | Materials for use with interconnects of electrical devices and related methods | |
TW200633607A (en) | Touch board with single-layer PCB structure | |
ATE557576T1 (de) | Leiterplatine mit elektronischem bauelement | |
WO2010038179A3 (en) | An oled device and an electronic circuit | |
WO2007038649A3 (en) | Power supply with current limiting circuits | |
WO2004038798A3 (en) | Stacked electronic structures including offset substrates | |
TW200709315A (en) | Manufacturing method for electronic substrate, electronic substrate, and electronic apparatus | |
TW200629998A (en) | Printed circuit board and forming method thereof | |
EP2040347A4 (en) | OMNIBUS BAR DEVICE AND PRINTED CIRCUIT BOARD MOUNTED THEREWITH | |
TW200725666A (en) | Electronic device and keyborad thereof | |
ATE506842T1 (de) | Schnittstellenverbesserung für modulare plattformanwendungen | |
TWI263318B (en) | An electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts | |
TW200613995A (en) | Main board with a slot-sharing circuit for PCI express x16 and x1 slot to be connected to | |
TW200627672A (en) | Semiconductor light-emitting element assembly | |
TW200735736A (en) | Assembly with at leat two component in electrical leading effect connection and procedure for manufacturing the assembly | |
TW200607411A (en) | Wiring board and method of manufacturing wiring board | |
TW200641582A (en) | Low profile structure | |
TW200731907A (en) | Circuit board |