JP2006005176A5 - - Google Patents

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Publication number
JP2006005176A5
JP2006005176A5 JP2004180245A JP2004180245A JP2006005176A5 JP 2006005176 A5 JP2006005176 A5 JP 2006005176A5 JP 2004180245 A JP2004180245 A JP 2004180245A JP 2004180245 A JP2004180245 A JP 2004180245A JP 2006005176 A5 JP2006005176 A5 JP 2006005176A5
Authority
JP
Japan
Prior art keywords
metal
insulating layer
layer
sputtering
wiring circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004180245A
Other languages
English (en)
Japanese (ja)
Other versions
JP3962039B2 (ja
JP2006005176A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2004180245A external-priority patent/JP3962039B2/ja
Priority to JP2004180245A priority Critical patent/JP3962039B2/ja
Priority to EP05010861A priority patent/EP1608211A3/en
Priority to US11/147,345 priority patent/US7417316B2/en
Priority to TW094119239A priority patent/TWI350721B/zh
Priority to KR1020050051930A priority patent/KR101120526B1/ko
Priority to CN2005100811017A priority patent/CN1725933B/zh
Publication of JP2006005176A publication Critical patent/JP2006005176A/ja
Publication of JP2006005176A5 publication Critical patent/JP2006005176A5/ja
Publication of JP3962039B2 publication Critical patent/JP3962039B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004180245A 2004-06-17 2004-06-17 配線回路形成用基板、配線回路基板および金属薄層の形成方法 Expired - Fee Related JP3962039B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2004180245A JP3962039B2 (ja) 2004-06-17 2004-06-17 配線回路形成用基板、配線回路基板および金属薄層の形成方法
EP05010861A EP1608211A3 (en) 2004-06-17 2005-05-19 Wired circuit forming board, wired circuit board and thin metal layer forming method
US11/147,345 US7417316B2 (en) 2004-06-17 2005-06-08 Wired circuit forming board, wired circuit board, and thin metal layer forming method
TW094119239A TWI350721B (en) 2004-06-17 2005-06-10 Substrate for forming printed circuit, printed circuit board and method of forming metallic thin layer thereon
KR1020050051930A KR101120526B1 (ko) 2004-06-17 2005-06-16 배선 회로 형성용 기판, 배선 회로 기판 및 금속박층의형성 방법
CN2005100811017A CN1725933B (zh) 2004-06-17 2005-06-17 布线电路形成用基板、布线电路基板以及金属薄层的形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004180245A JP3962039B2 (ja) 2004-06-17 2004-06-17 配線回路形成用基板、配線回路基板および金属薄層の形成方法

Publications (3)

Publication Number Publication Date
JP2006005176A JP2006005176A (ja) 2006-01-05
JP2006005176A5 true JP2006005176A5 (https=) 2006-06-15
JP3962039B2 JP3962039B2 (ja) 2007-08-22

Family

ID=34936692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004180245A Expired - Fee Related JP3962039B2 (ja) 2004-06-17 2004-06-17 配線回路形成用基板、配線回路基板および金属薄層の形成方法

Country Status (6)

Country Link
US (1) US7417316B2 (https=)
EP (1) EP1608211A3 (https=)
JP (1) JP3962039B2 (https=)
KR (1) KR101120526B1 (https=)
CN (1) CN1725933B (https=)
TW (1) TWI350721B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7804172B2 (en) * 2006-01-10 2010-09-28 Halliburton Energy Services, Inc. Electrical connections made with dissimilar metals
CN101489346B (zh) * 2008-01-15 2011-11-16 欣兴电子股份有限公司 线路板的图案化结构
TWI398933B (zh) * 2008-03-05 2013-06-11 榮創能源科技股份有限公司 積體電路元件之封裝結構及其製造方法
FR2943072B1 (fr) * 2009-03-12 2019-08-16 Centre National De La Recherche Scientifique Cnrs Decoration par pulverisation plasma magnetron sur des contenants en verre pour les secteurs de la cosmetique.
CN101840988A (zh) * 2010-04-22 2010-09-22 傲迪特半导体(南京)有限公司 汽车前大灯发热pcb基台及其制作方法
EP3030061B1 (en) * 2013-07-29 2021-01-06 Kyocera Corporation Wiring substrate, wiring substrate with lead, and electronic device
TWI488549B (zh) * 2014-03-07 2015-06-11 Azotek Co Ltd 金屬基板及其製作方法
JP2015133167A (ja) * 2015-04-22 2015-07-23 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
US10180708B2 (en) 2016-05-24 2019-01-15 Microsoft Technology Licensing, Llc Curved circuit board
KR20180058626A (ko) * 2016-11-24 2018-06-01 주식회사 아모그린텍 평판 케이블 제조 방법
CN108055790B (zh) * 2017-12-06 2019-10-18 深圳市和美源电子有限公司 一种电路板及其制作方法和应用
KR102847046B1 (ko) * 2019-05-08 2025-08-18 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1097234B (de) * 1958-06-26 1961-01-12 Bosch Gmbh Robert Verfahren zum UEberziehen von Gegenstaenden mit Silber durch Aufdampfen im Vakuum unter Verwendung einer hafterhoehenden Chromzwischenschicht
LU46411A1 (https=) * 1964-06-27 1972-01-01
US3881884A (en) * 1973-10-12 1975-05-06 Ibm Method for the formation of corrosion resistant electronic interconnections
US4917963A (en) * 1988-10-28 1990-04-17 Andus Corporation Graded composition primer layer
JPH0382188A (ja) * 1989-08-25 1991-04-08 Kyocera Corp セラミック配線基板の製造方法
JPH04235272A (ja) 1991-01-11 1992-08-24 Kobe Steel Ltd 耐食性及び加工性に優れた蒸着Ａｌ−Ｍｎ系合金めっき材およびその製造方法
JP3422371B2 (ja) 1993-01-13 2003-06-30 石川島播磨重工業株式会社 連続真空蒸着方法
US5874174A (en) * 1995-08-09 1999-02-23 Matsushita Electric Industrial Co., Ltd. Conductor film and its forming method
JPH1192579A (ja) 1997-09-19 1999-04-06 Nitto Denko Corp 有機基材のプラズマ処理方法及び有機基材への金属層形成方法
JPH11158613A (ja) 1997-12-01 1999-06-15 Canon Inc 電極基板、及び該電極基板の製造方法
US6328858B1 (en) * 1998-10-01 2001-12-11 Nexx Systems Packaging, Llc Multi-layer sputter deposition apparatus
JP4430165B2 (ja) 1999-09-02 2010-03-10 日東電工株式会社 真空薄膜形成装置および真空薄膜形成方法
JP2003318533A (ja) 2002-04-24 2003-11-07 Toyo Metallizing Co Ltd フレキシブルプリント配線用基板
TW587322B (en) * 2002-12-31 2004-05-11 Phoenix Prec Technology Corp Substrate with stacked via and fine circuit thereon, and method for fabricating the same

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